This paper describes a sparse realization of passive reduced-order interconnect models via PRIMA to provide the SPICE compatible models. It is demonstrated that, if the SPICE models are directly realized so that the reduced-order equations obtained via PRIMA are stamped into the MNA matrix, the simulations of networks containing the macromodels become computationally inefficient when size of the reduced-order equations is relatively large. This is due to dense coefficient matrices of the reduced-order equations resulting from congruent transformations in PRIMA. To overcome this disadvantage, we propose a sparse realization of the reduced-order models. Since the expression is equivalent to the reduced-order equations, the passivity of the SPICE models generated is also guaranteed. Computational efficiency on SPICE is demonstrated in performing the transient analysis of circuits containing the proposed macromodels.

With the progress of integration of circuits and PCBs (Printed Circuit Boards), novel techniques have been required for verification of signal integrity. Noise analysis of the power/ground planes is one of the most important issues. This paper describes a high-speed simulator for PCBs which contain the interconnects with nonlinear terminations. This simulator is based on the environmental tool ASSIST (Assistant System for Simulation Study) constructed for development of the circuit simulators, and is combined with PRIMA (Passive Reduced-Order Interconnect Macromodeling Algorithm). In this simulator, an efficient implementation of PRIMA is considered with using a voltage-controlled current source (VCCS) model. Finally, this simulator is applied to the analysis of power/ground planes of the simple PCBs, and the validity is verified.