Shrinking feature sizes and higher levels of integration in semiconductor device manufacturing technologies are increasingly causing the gap between defect levels estimated in the design stage and reported ones for fabricated devices. In this paper, we propose a unified weighted fault coverage approach that includes both bridge and open faults, considering the critical area as the incident rate of each fault. We then propose a test pattern reordering scheme that incorporates our weighted fault coverage with an aim to reduce test costs. Here we apply a greedy algorithm to reorder test patterns generated by the bridge and stuck-at automatic test pattern generator (ATPG), evaluating the relationship between the number of patterns and the weighted fault coverage. Experimental results show that by applying this reordering scheme, the number of test patterns was reduced, on average, by approximately 50%. Our results also indicate that relaxing coverage constraints can drastically reduce test pattern set sizes to a level comparable to traditional 100% coverage stuck-at pattern sets, while targeting the majority of bridge faults and keeping the defect level to no more than 10 defective parts per milion (DPPM) with a 99% manufacturing yield.

A tri-template-based codes (TTBC) method is proposed to reduce test cost of intellectual property (IP) cores. In order to reduce test data volume (TDV), the approach utilizes three templates, i.e., all 0, all 1, and the previously applied test data, for generating the subsequent test data by flipping the inconsistent bits. The approach employs a small number of test channels I to supply a large number of internal scan chains 2I-3 such that it can achieve significant reduction in test application time (TAT). Furthermore, as a non-intrusive and automatic test pattern generation (ATPG) independent solution, the approach is suitable for IP core testing because it requires neither redesign of the core under test (CUT) nor running any additional ATPG for the encoding procedure. In addition, the decoder has low hardware overhead, and its design is independent of the CUT and the given test set. Theoretical analysis and experimental results for ISCAS 89 benchmark circuits have proven the efficiency of the proposed approach.

A novel concurrent core test approach is proposed to reduce the test cost of SOC. Prior to test, the test sets corresponding to cores under test (CUT) are merged by using the proposed merging algorithm to obtain a minimum merged test set. During test, the proposed scan tree architecture is employed to support the concurrent core test using the merged test set. The approach achieves concurrent core test with one scan input and low hardware overhead. Moreover, the approach does not need any additional test generation, and it can be used in conjunction with general compression/decompression techniques to further reduce test cost. Experimental results for ISCAS 89 benchmarks have proven the efficiency of the proposed approach.

In this paper, a complete X-tolerant test data compression solution is proposed for system-on-a-chip (SOC) testing. The solution achieves low-cost testing by employing not only selective Huffman vertical coding (SHVC) for test stimulus compression but also MISR-based time compactor for test response compaction. Moreover, the solution is non-intrusive, since it can tolerate any number of unknown states (also called X state) in test responses such that it does not require modifying the logic of core to eliminate or block the sources of unknown states. Furthermore, the solution achieves enhanced diagnosis capability over conventional MISR. The enhanced diagnosis requires the least hardware overhead by reusing the existing masking logic and achieves significant saving in diagnostic time. Experimental results for ISCAS 89 benchmarks as well as the evaluation of hardware implementation have proven the efficiency of the proposed test solution.

In the Reconfigurable System-On-a-Chip (RSOC), an FPGA core is embedded to improve the design flexibility of SOC. In this paper, we demonstrate that the embedded FPGA core is also feasible for use in implementing the proposed hybrid pattern Built-In Self-Test (BIST) in order to reduce the test cost of SOC. The hybrid pattern BIST, which combines Linear Feedback Shift Register (LFSR) with the proposed on-chip Deterministic Test Pattern Generator (DTPG), can achieve not only complete Fault Coverage (FC) but also minimum test sequence by applying a selective number of pseudorandom patterns. Furthermore, the hybrid pattern BIST is designed under the resource constraint of target FPGA core so that it can be implemented on any size of FPGA core and take full advantage of the target FPGA resource to reduce test cost. Moreover, the reconfigurable core-based approach has minimum hardware overhead since the FPGA core can be reconfigured as normal mission logic after testing such that it eliminates the hardware overhead of BIST logic. Experimental results for ISCAS 89 benchmarks and a platform FPGA chip have proven the efficiency of the proposed approach.

The increase of test time of embedded DRAMs (e-DRAM) is one of the key issues of System-on-chip (SOC) device test. This paper proposes to put the repair analysis function on chip as Built In Self Repair (BISR). BISR is performed at 166 MHz as at-speed of e-DRAM with using low cost automatic test equipment (ATE). The area of the BISR is 1.7 mm2. Using error storage table form contributes to realize small area penalty of repair analysis function. e-DRAM function test time by BISR was about 20% less than the conventional method at wafer level testing. Moreover, representative samples are produced to confirm repair analysis ability. The results show that all of the samples are actually repaired by repair information generated by BISR.