IEICE TRANSACTIONS on Electronics
Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology
Summary :
This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E90-C No.3 pp.641-643
- Publication Date
- 2007/03/01
- Publicized
- Online ISSN
- 1745-1353
- DOI
- 10.1093/ietele/e90-c.3.641
- Type of Manuscript
- LETTER
- Category
- Microwaves, Millimeter-Waves
Authors
Hiroyuki ITO
Hideyuki SUGITA
Kenichi OKADA
Tatsuya ITO
Kazuhisa ITOI
Masakazu SATO
Ryozo YAMAUCHI
Kazuya MASU
Keyword
Latest Issue
Copyrights notice of machine-translated contents
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Cite this
Copy
Hiroyuki ITO, Hideyuki SUGITA, Kenichi OKADA, Tatsuya ITO, Kazuhisa ITOI, Masakazu SATO, Ryozo YAMAUCHI, Kazuya MASU, "Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology" in IEICE TRANSACTIONS on Electronics,
vol. E90-C, no. 3, pp. 641-643, March 2007, doi: 10.1093/ietele/e90-c.3.641.
Abstract: This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90
URL: https://global.ieice.org/en_transactions/electronics/10.1093/ietele/e90-c.3.641/_p
Copy
@ARTICLE{e90-c_3_641,
author={Hiroyuki ITO, Hideyuki SUGITA, Kenichi OKADA, Tatsuya ITO, Kazuhisa ITOI, Masakazu SATO, Ryozo YAMAUCHI, Kazuya MASU, },
journal={IEICE TRANSACTIONS on Electronics},
title={Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology},
year={2007},
volume={E90-C},
number={3},
pages={641-643},
abstract={This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90
keywords={},
doi={10.1093/ietele/e90-c.3.641},
ISSN={1745-1353},
month={March},}
Copy
TY - JOUR
TI - Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology
T2 - IEICE TRANSACTIONS on Electronics
SP - 641
EP - 643
AU - Hiroyuki ITO
AU - Hideyuki SUGITA
AU - Kenichi OKADA
AU - Tatsuya ITO
AU - Kazuhisa ITOI
AU - Masakazu SATO
AU - Ryozo YAMAUCHI
AU - Kazuya MASU
PY - 2007
DO - 10.1093/ietele/e90-c.3.641
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E90-C
IS - 3
JA - IEICE TRANSACTIONS on Electronics
Y1 - March 2007
AB - This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90
ER -
English
