Three-Dimensional Passive Elements for Compact GaAs MMICs
Summary :
Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E76-C No.6 pp.961-967
- Publication Date
- 1993/06/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
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Makoto HIRANO, Yuhki IMAI, Ichihiko TOYODA, Kenjiro NISHIKAWA, Masami TOKUMITSU, Kazuyoshi ASAI, "Three-Dimensional Passive Elements for Compact GaAs MMICs" in IEICE TRANSACTIONS on Electronics,
vol. E76-C, no. 6, pp. 961-967, June 1993, doi: .
Abstract: Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e76-c_6_961/_p
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@ARTICLE{e76-c_6_961,
author={Makoto HIRANO, Yuhki IMAI, Ichihiko TOYODA, Kenjiro NISHIKAWA, Masami TOKUMITSU, Kazuyoshi ASAI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Three-Dimensional Passive Elements for Compact GaAs MMICs},
year={1993},
volume={E76-C},
number={6},
pages={961-967},
abstract={Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.},
keywords={},
doi={},
ISSN={},
month={June},}
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TY - JOUR
TI - Three-Dimensional Passive Elements for Compact GaAs MMICs
T2 - IEICE TRANSACTIONS on Electronics
SP - 961
EP - 967
AU - Makoto HIRANO
AU - Yuhki IMAI
AU - Ichihiko TOYODA
AU - Kenjiro NISHIKAWA
AU - Masami TOKUMITSU
AU - Kazuyoshi ASAI
PY - 1993
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E76-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1993
AB - Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.
ER -
English
