This paper reports on X-band Gallium Nitride (GaN) chipsets for cost-effective 20W transmit-receive (T/R) modules. The chipset components include a GaN-on-Si monolithic microwave integrated circuit (MMIC) driver amplifier (DA), a GaN-on-SiC high power amplifier (HPA) with GaAs matching circuits, a high-gain GaN-on-Si HPA with a GaAs output matching circuit, and a GaN-on-Si MMIC switch (SW). By utilizing either combination of the DA or single high-gain HPA, the configurations of two T/R module types can be realized. The GaN-on-Si MMIC DA demonstrates an output power of 6.4-7.4W, an associate gain of 22.3-24.6dB and a power added efficiency (PAE) of 32-36% over 9.0-11.0GHz. A GaN-on-SiC HPA with GaAs matching circuits exhibited an output power of 20-28W, associate gain of 7.8-10.7dB, and a PAE of 40-56% over 9.0-11.0GHz. The high-gain GaN-on-Si HPA with a GaAs output matching circuit exhibits an output power of 15-30W, associate gain of 27-30dB, and PAE of 26-33% over 9.0-11.0GHz. The GaN-on-Si MMIC switch demonstrates insertion losses of 1.1-1.3dB and isolation of 10.1-14.7dB over 8.0-11.5GHz. By employing cost-effective circuit configurations, the costs of these chipsets are estimated to be about half that of conventional chipsets.

GaAs MMICs (Monolithic Microwave Integrated Circuits) reliability is a critical part of the overall reliability of the thermal solution in semiconductor devices. With MMICs reliability improved, GaAs MMICs failure rates will reach levels which are impractical to measure with conventional methods in the near future. This letter proposes a methodology to predict the GaAs MMICs reliability by combining empirical and statistical methods based on zero-failure GaAs MMICs life testing data. Besides, we investigate the effect of accelerated factors on MMICs degradation and make a comparison between the Weibull and lognormal distributions. The method has been used in the reliability evaluation of GaAs MMICs successfully.

Heterostructure field-effect transistors (HFETs) composed of antimonide-based compound semiconductor (ABCS) materials have intrinsic performance advantages due to the attractive electron and hole transport properties, narrow bandgaps, low ohmic contact resistances, and unique band-lineup design flexibility within this material system. These advantages can be particularly exploited in applications where high-speed operation and low-power consumption are essential. In this paper, we report on recent advances in the design, material growth, device characteristics, oxidation stability, and MMIC performance of Sb-based HEMTs with an InAlSb upper barrier layer. The high electron mobility transistors (HEMTs) exhibit a transconductance of 1.3 S/mm at VDS = 0.2 V and an fTLg product of 33 GHz-µm for a 0.2 µm gate length. The design, fabrication and improved performance of InAlSb/InGaSb p-channel HFETs are also presented. The HFETs exhibit a mobility of 1500 cm2/V-sec, an fmax of 34 GHz for a 0.2 µm gate length, a threshold voltage of 90 mV, and a subthreshold slope of 106 mV/dec at VDS = -1.0 V.

The GaAs industry has been growing immensely during recent years. This is mainly driven by the tremendous growth of the wireless communication market, which is still continuously growing. Additionally, an emerging mmW market with applications in automotive, defense and optoelectronics is further driving the demand for GaAs components. The two largest European GaAs fabrication companies, UMS and Filtronic are very well positioned to address the complete frequency range from 1 GHz up to 100 GHz for commercial, high volume low cost markets, as well as individual niche applications. An overview of the companies' structures, their processes and design capabilities and also their new product developments will be presented in this paper.

A millimeter-wave low-loss, high-isolation and high-power terminated MMIC switch is developed, and the design theory is formulated. Our invented switch is designed based on a non-linear relationship between the parallel resistance of an FET and its gate width. Our measurements of the parallel resistance with different gate width have revealed that the resistance is inverse proportion to a square of the gate width. By using this relationship, we have found the fact that the multiple FET resonators with smaller gate width and high inductance elements realize high-Q performance for the same resonant frequency. Since the power handling capability is determined by the total gate width, our switch circuit could reduce its insertion loss, keeping the high-power performance. We additionally describe the design method of this switch circuit. The relationships between the gate widths of the FETs and the electrical performances are described analytically. The required gate widths of the FETs for handling high power signal are represented, and the design equations to obtain lower insertion loss and higher isolation performances keeping high power capability are presented. To verify this methodology, we fabricated a MMIC switch. The MMIC had insertion loss of 2.86 dB, isolation of 37 dB and power handling capability of more than 33 dBm at 32 GHz.

Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.