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Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology
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Summary :
Silica-LiNbO3 (LN) hybrid modulators have a hybrid configuration of versatile passive silica-based planar lightwave circuits (PLCs) and simple LN phase modulators arrays. By combining the advantages the two components, these hybrid modulators offer large-scale, highly-functionality modulators with low losses for advanced modulation formats. However, the reliability evaluation necessary to implement them in real transmissions has not been reported yet. In terms of reliability characteristics, there are issues originating from the difference in thermal expansion coefficients between silica PLC and LN. To resolve these issues, we propose design guidelines for hybrid modulators to mitigate the degradation induced by the thermal expansion difference. We fabricated several tens of silica-LN dual polarization quadrature phase shift keying (DP-QPSK) modulators based on the design guidelines and evaluated their reliability. The experiment results show that the modules have no degradation after a reliability test based on GR-468, which confirms the validity of the design guidelines for highly reliable silica-LN hybrid modulators. We can apply the guidelines for hybrid modules that realize heterogeneous device integration using materials with different coefficients of thermal expansion.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E103-C No.8 pp.353-361
- Publication Date
- 2020/08/01
- Publicized
- 2020/02/13
- Online ISSN
- 1745-1353
- DOI
- 10.1587/transele.2019ECP5044
- Type of Manuscript
- PAPER
- Category
- Optoelectronics
Authors
Atsushi ARATAKE
NTT Corporation
Ken TSUZUKI
NTT Corporation
Motohaya ISHII
NTT Electronics Corporation
Takashi SAIDA
NTT Corporation
Takashi GOH
NTT Corporation
Yoshiyuki DOI
NTT Corporation
Hiroshi YAMAZAKI
NTT Corporation
Takao FUKUMITSU
NTT Corporation
Takashi YAMADA
NTT Corporation
Shinji MINO
NTT Electronics Corporation
Keyword
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Atsushi ARATAKE, Ken TSUZUKI, Motohaya ISHII, Takashi SAIDA, Takashi GOH, Yoshiyuki DOI, Hiroshi YAMAZAKI, Takao FUKUMITSU, Takashi YAMADA, Shinji MINO, "Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology" in IEICE TRANSACTIONS on Electronics,
vol. E103-C, no. 8, pp. 353-361, August 2020, doi: 10.1587/transele.2019ECP5044.
Abstract: Silica-LiNbO3 (LN) hybrid modulators have a hybrid configuration of versatile passive silica-based planar lightwave circuits (PLCs) and simple LN phase modulators arrays. By combining the advantages the two components, these hybrid modulators offer large-scale, highly-functionality modulators with low losses for advanced modulation formats. However, the reliability evaluation necessary to implement them in real transmissions has not been reported yet. In terms of reliability characteristics, there are issues originating from the difference in thermal expansion coefficients between silica PLC and LN. To resolve these issues, we propose design guidelines for hybrid modulators to mitigate the degradation induced by the thermal expansion difference. We fabricated several tens of silica-LN dual polarization quadrature phase shift keying (DP-QPSK) modulators based on the design guidelines and evaluated their reliability. The experiment results show that the modules have no degradation after a reliability test based on GR-468, which confirms the validity of the design guidelines for highly reliable silica-LN hybrid modulators. We can apply the guidelines for hybrid modules that realize heterogeneous device integration using materials with different coefficients of thermal expansion.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2019ECP5044/_p
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@ARTICLE{e103-c_8_353,
author={Atsushi ARATAKE, Ken TSUZUKI, Motohaya ISHII, Takashi SAIDA, Takashi GOH, Yoshiyuki DOI, Hiroshi YAMAZAKI, Takao FUKUMITSU, Takashi YAMADA, Shinji MINO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology},
year={2020},
volume={E103-C},
number={8},
pages={353-361},
abstract={Silica-LiNbO3 (LN) hybrid modulators have a hybrid configuration of versatile passive silica-based planar lightwave circuits (PLCs) and simple LN phase modulators arrays. By combining the advantages the two components, these hybrid modulators offer large-scale, highly-functionality modulators with low losses for advanced modulation formats. However, the reliability evaluation necessary to implement them in real transmissions has not been reported yet. In terms of reliability characteristics, there are issues originating from the difference in thermal expansion coefficients between silica PLC and LN. To resolve these issues, we propose design guidelines for hybrid modulators to mitigate the degradation induced by the thermal expansion difference. We fabricated several tens of silica-LN dual polarization quadrature phase shift keying (DP-QPSK) modulators based on the design guidelines and evaluated their reliability. The experiment results show that the modules have no degradation after a reliability test based on GR-468, which confirms the validity of the design guidelines for highly reliable silica-LN hybrid modulators. We can apply the guidelines for hybrid modules that realize heterogeneous device integration using materials with different coefficients of thermal expansion.},
keywords={},
doi={10.1587/transele.2019ECP5044},
ISSN={1745-1353},
month={August},}
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TY - JOUR
TI - Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology
T2 - IEICE TRANSACTIONS on Electronics
SP - 353
EP - 361
AU - Atsushi ARATAKE
AU - Ken TSUZUKI
AU - Motohaya ISHII
AU - Takashi SAIDA
AU - Takashi GOH
AU - Yoshiyuki DOI
AU - Hiroshi YAMAZAKI
AU - Takao FUKUMITSU
AU - Takashi YAMADA
AU - Shinji MINO
PY - 2020
DO - 10.1587/transele.2019ECP5044
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E103-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2020
AB - Silica-LiNbO3 (LN) hybrid modulators have a hybrid configuration of versatile passive silica-based planar lightwave circuits (PLCs) and simple LN phase modulators arrays. By combining the advantages the two components, these hybrid modulators offer large-scale, highly-functionality modulators with low losses for advanced modulation formats. However, the reliability evaluation necessary to implement them in real transmissions has not been reported yet. In terms of reliability characteristics, there are issues originating from the difference in thermal expansion coefficients between silica PLC and LN. To resolve these issues, we propose design guidelines for hybrid modulators to mitigate the degradation induced by the thermal expansion difference. We fabricated several tens of silica-LN dual polarization quadrature phase shift keying (DP-QPSK) modulators based on the design guidelines and evaluated their reliability. The experiment results show that the modules have no degradation after a reliability test based on GR-468, which confirms the validity of the design guidelines for highly reliable silica-LN hybrid modulators. We can apply the guidelines for hybrid modules that realize heterogeneous device integration using materials with different coefficients of thermal expansion.
ER -
English
