Substrate noise analysis has become increasingly important in recent LSI design. This is because substrate noise, which affects PLLs, causes jitter that results in timing error. Conventional analysis techniques of substrate noise are, however, impractical for large-scale designs that have hundreds of millions of transistors because the computational complexity is too huge. To solve this problem, we have developed a fast substrate noise analysis technique for large-scale designs, in which a chip is divided into multiple domains and the circuits of each domain are reduced into a macro model. Using this technique, we have designed a processor chip for use in the supercomputer (die size: 20 mm
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Mikiko Sode TANAKA, Mikihiro KAJITA, Naoya NAKAYAMA, Satoshi NAKAMOTO, "Full Chip Circuit/Substrate Macro Modeling Method Which Controls the Analysis Accuracy and CPU Time by Using Current Density" in IEICE TRANSACTIONS on Fundamentals,
vol. E93-A, no. 2, pp. 448-455, February 2010, doi: 10.1587/transfun.E93.A.448.
Abstract: Substrate noise analysis has become increasingly important in recent LSI design. This is because substrate noise, which affects PLLs, causes jitter that results in timing error. Conventional analysis techniques of substrate noise are, however, impractical for large-scale designs that have hundreds of millions of transistors because the computational complexity is too huge. To solve this problem, we have developed a fast substrate noise analysis technique for large-scale designs, in which a chip is divided into multiple domains and the circuits of each domain are reduced into a macro model. Using this technique, we have designed a processor chip for use in the supercomputer (die size: 20 mm
URL: https://global.ieice.org/en_transactions/fundamentals/10.1587/transfun.E93.A.448/_p
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@ARTICLE{e93-a_2_448,
author={Mikiko Sode TANAKA, Mikihiro KAJITA, Naoya NAKAYAMA, Satoshi NAKAMOTO, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Full Chip Circuit/Substrate Macro Modeling Method Which Controls the Analysis Accuracy and CPU Time by Using Current Density},
year={2010},
volume={E93-A},
number={2},
pages={448-455},
abstract={Substrate noise analysis has become increasingly important in recent LSI design. This is because substrate noise, which affects PLLs, causes jitter that results in timing error. Conventional analysis techniques of substrate noise are, however, impractical for large-scale designs that have hundreds of millions of transistors because the computational complexity is too huge. To solve this problem, we have developed a fast substrate noise analysis technique for large-scale designs, in which a chip is divided into multiple domains and the circuits of each domain are reduced into a macro model. Using this technique, we have designed a processor chip for use in the supercomputer (die size: 20 mm
keywords={},
doi={10.1587/transfun.E93.A.448},
ISSN={1745-1337},
month={February},}
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TY - JOUR
TI - Full Chip Circuit/Substrate Macro Modeling Method Which Controls the Analysis Accuracy and CPU Time by Using Current Density
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 448
EP - 455
AU - Mikiko Sode TANAKA
AU - Mikihiro KAJITA
AU - Naoya NAKAYAMA
AU - Satoshi NAKAMOTO
PY - 2010
DO - 10.1587/transfun.E93.A.448
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E93-A
IS - 2
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - February 2010
AB - Substrate noise analysis has become increasingly important in recent LSI design. This is because substrate noise, which affects PLLs, causes jitter that results in timing error. Conventional analysis techniques of substrate noise are, however, impractical for large-scale designs that have hundreds of millions of transistors because the computational complexity is too huge. To solve this problem, we have developed a fast substrate noise analysis technique for large-scale designs, in which a chip is divided into multiple domains and the circuits of each domain are reduced into a macro model. Using this technique, we have designed a processor chip for use in the supercomputer (die size: 20 mm
ER -