IEICE TRANSACTIONS on Fundamentals
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
Summary :
ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
- Publication
- IEICE TRANSACTIONS on Fundamentals Vol.E98-A No.12 pp.2584-2591
- Publication Date
- 2015/12/01
- Publicized
- Online ISSN
- 1745-1337
- DOI
- 10.1587/transfun.E98.A.2584
- Type of Manuscript
- Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
- Category
- Physical Level Design
Authors
Li-Chung HSU
Keio University
Junichiro KADOMOTO
Keio University
So HASEGAWA
Keio University
Atsutake KOSUGE
Keio University
Yasuhiro TAKE
Keio University
Tadahiro KURODA
Keio University
Keyword
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Li-Chung HSU, Junichiro KADOMOTO, So HASEGAWA, Atsutake KOSUGE, Yasuhiro TAKE, Tadahiro KURODA, "A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel" in IEICE TRANSACTIONS on Fundamentals,
vol. E98-A, no. 12, pp. 2584-2591, December 2015, doi: 10.1587/transfun.E98.A.2584.
Abstract: ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1587/transfun.E98.A.2584/_p
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@ARTICLE{e98-a_12_2584,
author={Li-Chung HSU, Junichiro KADOMOTO, So HASEGAWA, Atsutake KOSUGE, Yasuhiro TAKE, Tadahiro KURODA, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel},
year={2015},
volume={E98-A},
number={12},
pages={2584-2591},
abstract={ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.},
keywords={},
doi={10.1587/transfun.E98.A.2584},
ISSN={1745-1337},
month={December},}
Copy
TY - JOUR
TI - A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 2584
EP - 2591
AU - Li-Chung HSU
AU - Junichiro KADOMOTO
AU - So HASEGAWA
AU - Atsutake KOSUGE
AU - Yasuhiro TAKE
AU - Tadahiro KURODA
PY - 2015
DO - 10.1587/transfun.E98.A.2584
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E98-A
IS - 12
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - December 2015
AB - ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
ER -
English
