This paper describes an in-depth analysis of crosstalk in a high-bandwidth 3D-stacked memory using a multi-hop inductive coupling interface and proposes two countermeasures. This work analyzes the crosstalk among seven stacked chips using a 3D electromagnetic (EM) simulator. The detailed analysis reveals two main crosstalk sources: concentric coils and adjacent coils. To suppress these crosstalks, this paper proposes two corresponding countermeasures: shorted coils and 8-shaped coils. The combination of these coils improves area efficiency by a factor of 4 in simulation. The proposed methods enable an area-efficient inductive coupling interface for high-bandwidth stacked memory.

ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.

A 0.13mJ/prediction with 68.6% accuracy wired-logic deep neural network (DNN) processor is developed in a single 16-nm field-programmable gate array (FPGA) chip. Compared with conventional von-Neumann architecture DNN processors, the energy efficiency is greatly improved by eliminating DRAM/BRAM access. A technical challenge for conventional wired-logic processors is the large amount of hardware resources required for implementing large-scale neural networks. To implement a large-scale convolutional neural network (CNN) into a single FPGA chip, two technologies are introduced: (1) a sparse neural network known as a non-linear neural network (NNN), and (2) a newly developed raster-scan wired-logic architecture. Furthermore, a novel high-level synthesis (HLS) technique for wired-logic processor is proposed. The proposed HLS technique enables the automatic generation of two key components: (1) Verilog-hardware description language (HDL) code for a raster-scan-based wired-logic processor and (2) test bench code for conducting equivalence checking. The automated process significantly mitigates the time and effort required for implementation and debugging. Compared with the state-of-the-art FPGA-based processor, 238 times better energy efficiency is achieved with only a slight decrease in accuracy on the CIFAR-100 task. In addition, 7 times better energy efficiency is achieved compared with the state-of-the-art network-optimized application-specific integrated circuit (ASIC).

This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.

A 6.5Gb/s shared bus that uses a 65nm CMOS pulse transceiver chip with a low frequency equalizer and electromagnetic connectors based on two types of transmission line couplers is presented. The amount of backplane wiring is reduced by a factor of 1/16 and total connector volume by a factor of 1/246. It reduces the size and weight of a satellite processor system by 60%, increases the data rate by a factor of 2.6, and satisfies the EMC standard for withstanding the strong shock of rocket launch.