We propose a chip identification (ID) generating scheme with random variation of transistor characteristics in SRAM bitcells. In the proposed scheme, a unique fingerprint is generated by grounding both bitlines in write operations. Through minor modifications, this scheme can be implemented for existing SRAMs. It has high speed, and it can be implemented in a very small area overhead. The generated fingerprint mainly reflects threshold voltages of load transistors in the bitcells. We fabricated test chips in a 65-nm process and obtained 12,288 sets of unique 128-bit fingerprints, which are evaluated in this paper. The failure rate of the IDs is found to be 2.110-12.

This paper presents measurement results of bit error rate (BER) and soft error rate (SER) improvement on 150-nm FD-SOI 7T/14T (7-transistor/ 14-transistor) SRAM test chips. The reliability of the 7T/14T SRAM can be dynamically changed by a control signal depending on an operating condition and application. The 14T dependable mode allocates one bit in a 14T cell and improves the BER in a read operation and SER in a retention state, simultaneously. We investigate its error rate mitigating mechanisms using Synopsys TCAD simulator. In our measurements, the minimum operating voltage was improved by 100 mV, the alpha-induced SER was suppressed by 80.0%, and the neutron-induced SER was decreased by 34.4% in the 14T dependable mode over the 7T normal mode.

This paper describes a soft-error tolerant and margin-enhanced nMOS-pMOS reversed 6T SRAM cell. The 6T SRAM bitcell comprises pMOS access and driver transistors, and nMOS load transistors. Therefore, the nMOS and pMOS masks are reversed in comparison with those of a conventional bitcell. In scaled process technology, The pMOS transistors present advantages of small random dopant fluctuation, strain-enhanced saturation current, and small soft-error sensitivity. The four-pMOS and two-nMOS structure improves the soft-error rate plus operating margin. We conduct SPICE and neutron-induced soft-error simulations to evaluate the n-p reversed 6T SRAM bitcell in 130-nm to 22-nm processes. At the 22-nm node, a multiple-cell-upset and single-bit-upset SERs are improved by 34% and 51% over a conventional 6T cell. Additionally, the static noise margin and read cell current are 2.04× and 2.81× improved by leveraging the pMOS benefits.

This paper presents a novel disturb mitigation scheme which achieves low-energy operation for a deep sub-micron 8T SRAM macro. The classic write-back scheme with a dedicated read port overcame both half-select and read-disturb problems. Moreover, it improved the yield, particularly in the low-voltage range. The conventional scheme, however, consumed more power because of charging and discharging all write bitlines in a sub-block. Our proposed scheme reduces the power overhead of the write-back scheme using a floating write bitline technique and a low-swing bitline driver (LSBD). The floating bitline and the LSBD respectively consist of a precharge-less CMOS equalizer (transmission gate) and an nMOS write-back driver. The voltage on the floating write bitline is at an intermediate voltage between the ground and the supply voltage before a write cycle. The write target cells are written by normal CMOS drivers, whereas the write bitlines in half-selected columns are driven by the LSBDs in the write cycle, which suppresses the write bitline voltage to VDD - Vtn and therefore saves the active power in the half-selected columns (where Vtn is a threshold voltage of an nMOS). In addition, the proposed scheme reduces a leakage current from the write bitline because of the floating write bitline. The active leakage is reduced by 33% at the FF corner, 125. The active energy in the write operation is reduced by 37% at the FF corner. In other process corners, more writing power reduction can be expected because it depends on the Vtn in the LSBD. We fabricated a 512-Kb 8T SRAM test chip that operates at a single 0.5-V supply voltage. The test chip with the proposed scheme respectively achieves 1.52-µW/MHz writing energy and 72.8-µW leakage power, which are 59.4% and 26.0% better than those of the conventional write-back scheme. The total energy is 12.9 µW/MHz (12.9 pJ/access) at a supply voltage of 0.5 V and operating frequency of 6.25 MHz in a 50%-read/50%-write operation.

This paper proposes 7T SRAM which realizes block-level simultaneous copying feature. The proposed SRAM can be used for data transfer between local memories such as checkpoint data storage and transactional memory. The 1-Mb SRAM is comprised of 32-kb blocks, in which 16-kb data can be copied in 33.3 ns at 1.2 V. The proposed scheme reduces energy consumption in copying by 92.7% compared to the conventional read-modify-write manner. By applying the proposed scheme to transactional memory, the number of write back cycles is possibly reduced by 98.7% compared with the conventional memory system.

This paper presents a new 8T (8-transistor) SRAM cell layout mitigating multiple-bit upset (MBU) in a divided wordline structure. Because bitlines along unselected columns are not activated, the divided wordline structure eliminates a half-select problem and achieves low-power operation, which is often preferred for low-power/low-voltage applications. However, the conventional 8T SRAM with the divided wordline structure engenders MBUs because all bits in the same word are physically adjoining. Consequently, it is difficult to apply an error correction coding (ECC) technique to it. In this paper, we propose a new 8T cell layout pattern that separates internal latches in SRAM cells using both an n-well and a p-substrate. We saw that a SEU cross section of nMOS is 3.5–4.5 times higher than that of pMOS (SEU: single event upset; a cross section signifies a sensitive area to soft error effects). By using a soft-error simulator, iRoC TFIT, we confirmed that the proposed 8T cell has better neutron-induced MBU tolerance. The simulator includes soft-error measurement data in a commercial 65-nm process. The MBU in the proposed 8T SRAM is improved by 90.70% and the MBU soft error rate (SER) is decreased to 3.46 FIT at 0.9 V when ECC is implemented (FIT: failure in time). Additionally, we conducted Synopsys 3-D TCAD simulation, which indicates that the linear energy transfer (LET) threshold in SEU is also improved by 66% in the proposed 8T SRAM by a common-mode effect.

We propose a novel substrate-bias control scheme for an FD-SOI SRAM that suppresses inter-die variability. The proposed circuits detect inter-die threshold-voltage variation automatically, and then maximize read/write margins of memory cells to supply the substrate bias. We confirmed that a 486-kb 6T SRAM operates at 0.42 V, in which an FS corner can be compared as much as 0.14 V or more.

This paper presents a proposed NMOS-centered 6T SRAM cell layout that reduces a neutron-induced multiple-cell-upset (MCU) SER on a same wordline. We implemented an 1-Mb SRAM macro in a 65-nm CMOS process and irradiated neutrons as a neutron-accelerated test to evaluate the MCU SER. The proposed 6T SRAM macro improves the horizontal MCU SER by 67–98% compared with a general macro that has PMOS-centered 6T SRAM cells.

This paper presents a low-power and low-voltage 64-kb 8T three-port image memory using 28-nm FD-SOI process technology. Our proposed SRAM accommodates eight-transistor bit cells comprising one-write/two-read ports and a majority logic circuit to save active energy. The test chip operates at a supply voltage of 0.46V and access time of 140ns. The minimum energy point is a supply voltage of 0.54V and an access time of 55ns (= 18.2MHz), at which 484fJ/cycle in a write operation and 650fJ/cycle in a read operation are achieved assisted by majority logic. These factors are 69% and 47% smaller than those in a conventional 6T SRAM using the 28-nm FD-SOI process technology.

This paper reports a 65nm 8Mb spin transfer torque magnetoresistance random access memory (STT-MRAM) operating at a single supply voltage with a process-variation-tolerant sense amplifier. The proposed sense amplifier comprises a boosted-gate nMOS and negative-resistance pMOSs as loads, which maximizes the readout margin at any process corner. The STT-MRAM achieves a cycle time of 1.9µs (=0.526MHz) at 0.38V. The operating power is 1.70µW at this voltage. The minimum energy per access is 1.12 pJ/bit when the supply voltage is 0.44V. The proposed STT-MRAM operates at a lower energy than an SRAM when the utilization of the memory bandwidth is 14% or less.