This paper presents a novel disturb mitigation scheme which achieves low-energy operation for a deep sub-micron 8T SRAM macro. The classic write-back scheme with a dedicated read port overcame both half-select and read-disturb problems. Moreover, it improved the yield, particularly in the low-voltage range. The conventional scheme, however, consumed more power because of charging and discharging all write bitlines in a sub-block. Our proposed scheme reduces the power overhead of the write-back scheme using a floating write bitline technique and a low-swing bitline driver (LSBD). The floating bitline and the LSBD respectively consist of a precharge-less CMOS equalizer (transmission gate) and an nMOS write-back driver. The voltage on the floating write bitline is at an intermediate voltage between the ground and the supply voltage before a write cycle. The write target cells are written by normal CMOS drivers, whereas the write bitlines in half-selected columns are driven by the LSBDs in the write cycle, which suppresses the write bitline voltage to VDD - Vtn and therefore saves the active power in the half-selected columns (where Vtn is a threshold voltage of an nMOS). In addition, the proposed scheme reduces a leakage current from the write bitline because of the floating write bitline. The active leakage is reduced by 33% at the FF corner, 125. The active energy in the write operation is reduced by 37% at the FF corner. In other process corners, more writing power reduction can be expected because it depends on the Vtn in the LSBD. We fabricated a 512-Kb 8T SRAM test chip that operates at a single 0.5-V supply voltage. The test chip with the proposed scheme respectively achieves 1.52-µW/MHz writing energy and 72.8-µW leakage power, which are 59.4% and 26.0% better than those of the conventional write-back scheme. The total energy is 12.9 µW/MHz (12.9 pJ/access) at a supply voltage of 0.5 V and operating frequency of 6.25 MHz in a 50%-read/50%-write operation.

This paper proposes 7T SRAM which realizes block-level simultaneous copying feature. The proposed SRAM can be used for data transfer between local memories such as checkpoint data storage and transactional memory. The 1-Mb SRAM is comprised of 32-kb blocks, in which 16-kb data can be copied in 33.3 ns at 1.2 V. The proposed scheme reduces energy consumption in copying by 92.7% compared to the conventional read-modify-write manner. By applying the proposed scheme to transactional memory, the number of write back cycles is possibly reduced by 98.7% compared with the conventional memory system.

This paper presents a new 8T (8-transistor) SRAM cell layout mitigating multiple-bit upset (MBU) in a divided wordline structure. Because bitlines along unselected columns are not activated, the divided wordline structure eliminates a half-select problem and achieves low-power operation, which is often preferred for low-power/low-voltage applications. However, the conventional 8T SRAM with the divided wordline structure engenders MBUs because all bits in the same word are physically adjoining. Consequently, it is difficult to apply an error correction coding (ECC) technique to it. In this paper, we propose a new 8T cell layout pattern that separates internal latches in SRAM cells using both an n-well and a p-substrate. We saw that a SEU cross section of nMOS is 3.5–4.5 times higher than that of pMOS (SEU: single event upset; a cross section signifies a sensitive area to soft error effects). By using a soft-error simulator, iRoC TFIT, we confirmed that the proposed 8T cell has better neutron-induced MBU tolerance. The simulator includes soft-error measurement data in a commercial 65-nm process. The MBU in the proposed 8T SRAM is improved by 90.70% and the MBU soft error rate (SER) is decreased to 3.46 FIT at 0.9 V when ECC is implemented (FIT: failure in time). Additionally, we conducted Synopsys 3-D TCAD simulation, which indicates that the linear energy transfer (LET) threshold in SEU is also improved by 66% in the proposed 8T SRAM by a common-mode effect.

We propose a novel substrate-bias control scheme for an FD-SOI SRAM that suppresses inter-die variability. The proposed circuits detect inter-die threshold-voltage variation automatically, and then maximize read/write margins of memory cells to supply the substrate bias. We confirmed that a 486-kb 6T SRAM operates at 0.42 V, in which an FS corner can be compared as much as 0.14 V or more.

This paper presents a proposed NMOS-centered 6T SRAM cell layout that reduces a neutron-induced multiple-cell-upset (MCU) SER on a same wordline. We implemented an 1-Mb SRAM macro in a 65-nm CMOS process and irradiated neutrons as a neutron-accelerated test to evaluate the MCU SER. The proposed 6T SRAM macro improves the horizontal MCU SER by 67–98% compared with a general macro that has PMOS-centered 6T SRAM cells.

This paper presents a resilient cache memory for dynamic variation tolerance in a 40-nm CMOS. The cache can perform sustained operations under a large-amplitude voltage droop. To realize sustained operation, the resilient cache exploits 7T/14T bit-enhancing SRAM and on-chip voltage/temperature monitoring circuit. 7T/14T bit-enhancing SRAM can reconfigure itself dynamically to a reliable bit-enhancing mode. The on-chip voltage/temperature monitoring circuit can sense a precise supply voltage level of a power rail of the cache. The proposed cache can dynamically change its operation mode using the voltage/temperature monitoring result and can operate reliably under a large-amplitude voltage droop. Experimental result shows that it does not fail with 25% and 30% droop of Vdd and it provides 91 times better failure rate with a 35% droop of Vdd compared with the conventional design.

This paper proposes a novel dependable SRAM with 7T/14T memory cells, and introduces a new concept, "quality of a bit (QoB)" for it. The proposed SRAM has three modes: a normal mode, high-speed mode, and dependable mode, and dynamically scales its reliability, power and speed by combining two memory cells for one-bit information (i.e. 14 T/bit). By carrying out Monte Carlo simulation in a 65-nm process technology, the minimum voltages in read and write operations are improved by 0.21 V and 0.26 V, respectively, with a bit error rate of 10-8 kept. In addition, we confirm that the dependable mode achieves a lower bit error rate than the error correction code (ECC) and multi module redundancy (MMR). Furthermore, we propose a new memory array structure to avoid the half-selection problem in a write operation. The respective cell area overheads in the normal mode are 26% and 11% in the cases where additional transistors are pMOSes and nMOSes, compared to the conventional 6T memory cell.

We propose a low-power non-precharge-type two-port SRAM for video processing that exploits statistical similarity in images. To minimize the charge/discharge power on a read bitline, the proposed memory cell (MC) has ten transistors (10T), comprised of the conventional 6T MC, a readout inverter and a transmission gate for a read port. In addition, to incorporate three wordlines, we propose a shared wordline structure, with which the vertical cell size of the 10T MC is fitted to the same size as the conventional 8T MC. Since the readout inverter fully charges/discharges a read bitline, there is no precharge circuit on the read bitline. Thus, power is not consumed by precharging, but is consumed only when a readout datum is changed. This feature is suitable to video processing since image data have spatial correlation and similar data are read out in consecutive cycles. As well as the power reduction, the prechargeless structure shortens a cycle time by 38% compared with the conventional SRAM, because it does not require a precharge period. This, in turn, demonstrates that the proposed SRAM operates at a lower voltage, which achieves further power reduction. Compared to the conventional 8T SRAM, the proposed SRAM reduces a charge/discharge possibility to 19% (81% saving) on the bitlines. As the measurement result, we confirmed that the proposed 64-kb video memory in a 90-nm process achieves an 85% power saving on the read bitline, when considered as an H.264 reconstructed image memory. The area overhead is 14.4%.

This paper presents an adaptive cache architecture for wide-range reliable low-voltage operations. The proposed associativity-reconfigurable cache consists of pairs of cache ways so that it can exploit the recovery feature of the novel 7T/14T SRAM cell. Each pair has two operating modes that can be selected based upon the required voltage level of current operating conditions: normal mode for high performance and dependable mode for reliable low-voltage operations. We can obtain reliable low-voltage operations by application of the dependable mode to weaker pairs that cannot operate reliably at low voltages. Meanwhile leaving stronger pairs in the normal mode, we can minimize performance losses. Our chip measurement results show that the proposed cache can trade off its associativity with the minimum operating voltage. Moreover, it can decrease the minimum operating voltage by 140 mV achieving 67.48% and 26.70% reduction of the power dissipation and energy per instruction. Processor simulation results show that designing the on-chip caches using the proposed scheme results in 2.95% maximum IPC losses, but it can be chosen various performance levels. Area estimation results show that the proposed cache adds area overhead of 1.61% and 5.49% in 32-KB and 256-KB caches, respectively.

We propose a chip identification (ID) generating scheme with random variation of transistor characteristics in SRAM bitcells. In the proposed scheme, a unique fingerprint is generated by grounding both bitlines in write operations. Through minor modifications, this scheme can be implemented for existing SRAMs. It has high speed, and it can be implemented in a very small area overhead. The generated fingerprint mainly reflects threshold voltages of load transistors in the bitcells. We fabricated test chips in a 65-nm process and obtained 12,288 sets of unique 128-bit fingerprints, which are evaluated in this paper. The failure rate of the IDs is found to be 2.110-12.

This paper presents measurement results of bit error rate (BER) and soft error rate (SER) improvement on 150-nm FD-SOI 7T/14T (7-transistor/ 14-transistor) SRAM test chips. The reliability of the 7T/14T SRAM can be dynamically changed by a control signal depending on an operating condition and application. The 14T dependable mode allocates one bit in a 14T cell and improves the BER in a read operation and SER in a retention state, simultaneously. We investigate its error rate mitigating mechanisms using Synopsys TCAD simulator. In our measurements, the minimum operating voltage was improved by 100 mV, the alpha-induced SER was suppressed by 80.0%, and the neutron-induced SER was decreased by 34.4% in the 14T dependable mode over the 7T normal mode.