The method of extracting impedance parameters of surface mounted (SMD) electronic components by test is suitable for components with unknown model or material information, but requires consideration of errors caused by non-coaxial and measurement fixtures. In this paper, a fixture for impedance measurement is designed according to the characteristics of passive devices, and the fixture de-embedding method is used to eliminate errors and improve the test accuracy. The method of obtaining S parameters of fixture based on full wave simulation proposed in this paper can provide a thought for obtaining S parameters in de-embedding. Taking a certain patch capacitor as an example, the S parameters for de-embedding were obtained using methods based on full wave simulation, 2×Thru, and ADS simulation, and de-embedding tests were conducted. The results indicate that obtaining the S parameter of the testing fixture based on full wave simulation and conducting de-embedding testing compared to ADS simulation can accurately extract the impedance parameters of SMD electronic components, which provides a reference for the study of electromagnetic interference (EMI) coupling mechanism.

In and we have presented a simulation-based algorithm for optimizing the average reward in a parameterized continuous-time, finite-state semi-Markov Decision Process (SMDP). We approximated the gradient of the average reward. Then, a simulation-based algorithm was proposed to estimate the approximate gradient of the average reward (called GSMDP), using only a single sample path of the underlying Markov chain. GSMDP was proved to converge with probability 1. In this paper, we give bounds on the approximation and estimation errors for GSMDP algorithm. The approximation error of that approximation is the size of the difference between the true gradient and the approximate gradient. The estimation error, the size of the difference between the output of the algorithm and its asymptotic output, arises because the algorithm sees only a finite data sequence.

Optical surface mount technology (O-SMT), which was proposed to provide a possible solution to growing serious problems in manufacturing process of optoelectronic products, is introduced. After discussing the basic idea of O-SMT, experimental results are also described to show its feasibility.

This paper describes a high-density, high-pin-count flexible SMD connector used for high-speed data buses between MCMs or daughter boards. This connector consists of a flexible film cable interconnection with accurately controlled characteristic impedance, and a contact housing composed of double-line contacts and SMD type leads. It has 98 contacts each with a pitch of 0.4 mm. The connector mounting area is 6 mm wide and 23 mm long. The flexible cable has a double-sided triple-parallel micro stripline structure with an insertion force of less than 2.9 kgf and characteristic impedance of 48 to 50 Ω. Insertion loss is -0.5 dB at 600 MHz and crosstalk noise is less than 110 mV at 250 ps rising time. This connector can be used for high-speed data transmission of up to 300 ps rising time.

This paper describes a trial coaxial surface mounted connector for PGA-type high-speed multichip modules (MCM). An MCM connector is needed to ensure testability and connection reliability of MCMs mounted on a printed circuit board. Our connector consists of a coaxial elements, a common ground housing made of conductive resin, and a ground contact spring plate. It has 68 signal contacts. We investigated the performance of this connector by experiment and simulation. Its insertion force is only about 53 gf per signal pin. The characteristic impedance is from 45.6 Ω to 61.4 Ω. The average resistance between two contacts is 28 mΩ with a deviation of less than plus or minus 5 mΩ. The insertion is -0.4 dB at 1.0 GHz. Crosstalk noise is less than 1.2%. This prototype connector can transmit pulses of up to 1.2 Gb/s, showing that it is applicable to high-speed MCMs.