We have fabricated two-tiered heterostructures consisting of phosphorus δ-doped Si quantum dots (Si-QDs) and undoped Si-QDs and studied their electron field emission properties. Electron emission was observed from the P-doped Si-QDs stack formed on the undoped Si-QDs stack by applying a forward bias of ∼6 V, which was lower than that for pure Si-QDs stack. This result is attributed to electric field concentration on the upper P-doped Si-QD layers beneath the layers of the undoped Si-QDs stack due to the introduction of phosphorus atom into the Si-QDs, which was positively charged due to the ionized P donor. The results lead to the development of planar-type electron emission devices with a low-voltage operation.

We have fabricated multiple-stacked Si quantum dots (QDs) with and without Ge core embedded in a SiO2 network on n-Si(100) and studied their field electron emission characteristics under DC bias application. For the case of pure Si-QD stacks with different dot-stack numbers, the average electric field in dot-stacked structures at which electron emission current appeared reached minimum value at a stack number of 11. This can be attributed to optimization of the electron emission due to enhanced electric field concentration in the upper layers of the dot-stacked structures and reduction of the electron injection current from the n-Si substrate, with an increased stack number. We also found that, by introducing Ge core into Si-QDs, the average electric field for the electron emission can be reduced below that from pure Si-QDs-stacked structures. This result implies that the electric field is more concentrated in the upper Si-QDs with Ge core layers due to deep potential well for holes in the Ge core.

We have succeeded in highly selective growth and positioning of Si- and SiGe-quantum-dots (QDs) on SiO2 patterns by controlling the reactive area, whose surface is terminated with OH bonds for Si nucleation in low-pressure chemical vapor deposition (LPCVD). The selective growth of QDs on thermally grown SiO2 line-patterns was demonstrated in LPCVD of SiH4 and GeH4 just after Si nucleation by controlling the early stages of Si2H6-LPCVD, which indicates effectively enhanced initial nucleation on OH-terminated SiO2 surface and suppression of the nucleation and growth of dots on as-grown SiO2 surface during Si2H6-LPCVD prior to SiH4-LPCVD.

Silicon-quantum-dots (Si-QDs) with an areal density as high as 1012 cm - 2 were self-assembled on thermally-grown SiO2 by low pressure CVD using Si2H6, in which OH-terminated SiO2 surface prior to the Si CVD was exposed to GeH4 to create nucleation sites uniformly. After thermal oxidation of Si-QDs surface, two-dimensional electronic transport through the Si-QDs array was measured with co-planar Al electrodes evaporated on the array surface. Random telegraph signals were clearly observed at constant applied bias conditions in dark condition and under light irradiation at room temperature. The result indicates the charging and discharging of a dot adjacent to the percolation current path in the dots array.

Multiply-stacked structures of Si quantum dots (Si-QDs) in gate oxide are attracting much attention because of their potential importance to improve retention characteristics in a high density charge storage. In this work, we have fabricated 6-fold stacked Si-QDs with 2 nm-thick SiO2 interlayers, whose areal dot density and average dot size were 5.71011 cm-2 in each dot layer and 5 nm in height, and studied progress on electron distribution in 6-fold stacked Si-QDs with 2 nm-thick SiO2 interlayers from the measurements of temporal changes in the surface potential after electron charging and discharging locally at room temperature using an AFM/Kelvin probe technique in clean room air. First, by scanning an area of 22 µm2 with the AFM tip biased at +3 V with respect to the substrate in a tapping mode, the area was negatively charged due to electron injection from the substrate to the dot through the bottom tunnel oxide and subsequently, the central part of 100100 nm2 in the pre-charged area was scanned with the tip biased at -3 V to emit the electrons from the Si-QDs to the substrate. As a result, the negative charging level was markedly reduced in the central part in comparison to its peripheral region. And then, the surface potential of the negatively-charged peripheral region was decay monotonously with time as a result of progressive electron tunneling to the substrate. In contrast to this, the temporal change in the surface potential of the central part shows that the electron charging proceeds with time until the surface potential becomes almost the same as that in the peripheral region. This result can be interpreted in terms of lateral spreading of electrons stored in the Si-QDs layer due to the potential difference between the central part and its peripheral region more negatively charged.