Silicon-quantum-dots (Si-QDs) with an areal density as high as 1012 cm - 2 were self-assembled on thermally-grown SiO2 by low pressure CVD using Si2H6, in which OH-terminated SiO2 surface prior to the Si CVD was exposed to GeH4 to create nucleation sites uniformly. After thermal oxidation of Si-QDs surface, two-dimensional electronic transport through the Si-QDs array was measured with co-planar Al electrodes evaporated on the array surface. Random telegraph signals were clearly observed at constant applied bias conditions in dark condition and under light irradiation at room temperature. The result indicates the charging and discharging of a dot adjacent to the percolation current path in the dots array.

We have succeeded in highly selective growth and positioning of Si- and SiGe-quantum-dots (QDs) on SiO2 patterns by controlling the reactive area, whose surface is terminated with OH bonds for Si nucleation in low-pressure chemical vapor deposition (LPCVD). The selective growth of QDs on thermally grown SiO2 line-patterns was demonstrated in LPCVD of SiH4 and GeH4 just after Si nucleation by controlling the early stages of Si2H6-LPCVD, which indicates effectively enhanced initial nucleation on OH-terminated SiO2 surface and suppression of the nucleation and growth of dots on as-grown SiO2 surface during Si2H6-LPCVD prior to SiH4-LPCVD.

An SiO2/Si-cap/Si0.55Ge0.45 heterostructure was fabricated on p-type Si(100) and strained silicon on insulator (SOI) substrates by low pressure chemical vapor deposition (LPCVD) and subsequent thermal oxidation in an O2 + H2 gas mixture. Chemical bonding features and valence band offsets in the heterostructures were evaluated by using high-resolution x-ray photoelectron spectroscopy (XPS) measurements and thinning the stack layers with a wet chemical solution.

As means to control interface reactions between HfO2 and Ge(100), chemical vapor deposition (CVD) of ultrathin Ta-rich oxide using Tri (tert-butoxy) (tert-butylimido) tantalum (Ta-TTT) on chemically-cleaned Ge(100) has been conducted prior to atomic-layer controlled CVD of HfO2 using tetrakis (ethylmethylamino) hafnium (TEMA-Hf) and O3. The XPS analysis of chemical bonding features of the samples after the post deposition N2 annealing at 300 confirms the formation of TaGexOy and the suppression of the interfacial GeO2 layer growth. The energy band structure of HfO2/TaGexOy/Ge was determined by the combination of the energy bandgaps of HfO2 and TaGexOy measured from energy loss signals of O 1s photoelectrons and from optical absorption spectra and the valence band offsets at each interface measured from valence band spectra. From the capacitance-voltage (C-V) curves of Pt-gate MIS capacitors with different HfO2 thicknesses, the thickness reduction of TaGexOy with a relative dielectric constant of 9 is a key to obtain an equivalent SiO2 thickness (EOT) below 0.7 nm.

We have fabricated MOS capacitors with a hybrid floating gate (FG) consisting of Ni silicide nanodots (NiSi-NDs) and silicon-quantum-dots (Si-QDs) and studied electron transfer characteristics in the hybrid FG structures induced by the irradiation of 1310 nm light. The flat-band voltage shift due to the charging of the hybrid FG under light irradiation was lower than that in the dark. The observed optical response can be attributed to the shift of the charge centroid in the hybrid FG caused by the photoexcitation of electrons in NiSi-NDs and their transfer to Si-QDs. The photoexcited electron transfer from the NiSi-NDs to the Si-QDs in response to pulsed gate voltages was also evaluated from the increase in transient current caused by the light irradiation. The amount of transferred charge is likely to increase in proportion to pulse gate voltage.

Ni nanodots (NDs) used as nano-scale top electrodes were formed on a 10-nm-thick Si-rich oxide (SiO$_{mathrm{x}}$)/Ni bottom electrode by exposing a 2-nm-thick Ni layer to remote H$_{2}$-plasma (H$_{2}$-RP) without external heating, and the resistance-switching behaviors of SiO$_{mathrm{x}}$ were investigated from current-voltage ( extit{I--V}) curves. Atomic force microscope (AFM) analyses confirmed the formation of electrically isolated Ni NDs as a result of surface migration and agglomeration of Ni atoms promoted by the surface recombination of H radicals. From local extit{I--V} measurements performed by contacting a single Ni ND as a top electrode with a Rh coated Si cantilever, a distinct uni-polar type resistance switching behavior was observed repeatedly despite an average contact area between the Ni ND and the SiO$_{mathrm{x}}$ as small as $sim$ 1.9 $ imes$ 10$^{-12}$cm$^{2}$. This local extit{I--V} measurement technique is quite a simple method to evaluate the size scalability of switching properties.

We have fabricated Al-gate MOS capacitors with a Si quantum-dots (Si-QDs) floating gate, the number of dots was changed in the range of 1.6-4.81011 cm-2 in areal density with repeating the formation of Si dots and their surface oxidation a couple of times. The capacitance-voltage (C-V) characteristics of Si-QDs floating gate MOS capacitors on p-Si(100) confirm that, with increasing number of dots density, the flat-band voltage shift due to electron charging in Si-QDs is increased and the accumulation capacitance is decreased. Also, in the negative bias region beyond the flat-band condition, the voltage shift in the C-V curves due to the emission of valence electrons from intrinsic Si-QDs was observed with no hysterisis presumably because holes generated in Si-QDs can smoothly recombine with electrons tunneling through the 2.8 nm-thick bottom SiO2. In addition, we have demonstrated the charge retention characteristic improves in the Si-QDs stacked structure.

We fabricated Fe-silicide nanodots (NDs) on an ultrathin SiO2 layer and evaluated changes in electron transport properties with and without magnetic field application. High-density NDs with an areal density as high as ∼1011cm-2 were formed on thermally grown SiO2 by exposing ultrathin Fe/Si-NDs structures to a remote H2 plasma without external heating. In electron transport properties related to current-time characteristics for a diode with Fe electrode and charging energy to NDs, clear changes in current levels through NDs and electron injection modulation of NDs depending on intensity of magnetic fields were observed.

We have fabricated multiple-stacked Si quantum dots (QDs) with and without Ge core embedded in a SiO2 network on n-Si(100) and studied their field electron emission characteristics under DC bias application. For the case of pure Si-QD stacks with different dot-stack numbers, the average electric field in dot-stacked structures at which electron emission current appeared reached minimum value at a stack number of 11. This can be attributed to optimization of the electron emission due to enhanced electric field concentration in the upper layers of the dot-stacked structures and reduction of the electron injection current from the n-Si substrate, with an increased stack number. We also found that, by introducing Ge core into Si-QDs, the average electric field for the electron emission can be reduced below that from pure Si-QDs-stacked structures. This result implies that the electric field is more concentrated in the upper Si-QDs with Ge core layers due to deep potential well for holes in the Ge core.

Hydrogen termination of HF-treated Si surfaces and the oxidation kinetics have been studied by x-ray photoelectron spectroscopy (XPS) and Fourier Transform Infrared Spectroscopy (FT-IR) Attenuated Total Reflection (ATR). The oxidation of hydrogen-terminated Si in air or in pure water proceeds parallel to the surface presumably from step edges, resulting in the layer-by-layer oxidation. The oxide gryowth rate on an Si(100) surface is faster than (110) and (111) when the wafer is stored in pure water. This is interpreted in terms of the steric hindrance against molecular oxygen penetration throughth the (110) and (111) surfaces where the atom void size is equal to or smaller than O2 molecule. The oxide growth rate in pure water for heavily doped n-type Si is significantly high compared to that of heavily doped p-type Si. This is explained by the conduction electron tunneling from Si to absorbed O2 molecule to form the O2- state. O2- ions easily decompose and induce the surface electric field, enhancing the oxidation rate. It is found that the oxidation of heavily doped n-type Si in pure water is effectively suppressed by adding a small amount (1003600 ppm) of HCl.

We have fabricated Pt/Si-rich oxide (SiOx)/TiN stacked MIM diodes and studied an impact of the structural asymmetry on their resistive switching characteristics. XPS analyses show that a TiON interfacial layer was formed during the SiOx deposition on TiN by RF-sputtering in an Ar + O2 gas mixture. After the fabrication of Pt top electrodes on the SiOx layer, and followed by an electro-forming process, distinct bi-polar type resistive switching was confirmed. For the resistive switching from high to low resistance states so called SET process, there is no need to set the current compliance. Considering higher dielectric constant of TiON than SiOx, the interfacial TiON layer can contribute to regulate the current flow through the diode. The clockwise resistive switching, in which the reduction and oxidation (Red-Ox) reactions can occur near the TiN bottom electrode, shows lower RESET voltages and better switching endurance than the counter-clockwise switching where the Red-Ox reaction can take place near the top Pt electrode. The result implies a good repeatable nature of Red-Ox reactions at the interface between SiOx and TiON/TiN in consideration of relatively high diffusibility of oxygen atoms through Pt.

We have fabricated highly-dense Si nano-columnar structures accompanied with Si nanocrystals on W-coated quartz, and characterized their local electrical transport in the thickness direction using atomic force microscopy (AFM) with a conductive cantilever. By applying DC negative bias to the bottom W electrode with respect to a grounded top electrode made of 10-nm-thick Au on the sample surface, current images reflecting highly-localized conduction were obtained in both contact and non-contact modes. This result is attributable to electron emission due to quasi-ballistic transport through Si nanocrystals via nanocolumnar structure.

We have fabricated two-tiered heterostructures consisting of phosphorus δ-doped Si quantum dots (Si-QDs) and undoped Si-QDs and studied their electron field emission properties. Electron emission was observed from the P-doped Si-QDs stack formed on the undoped Si-QDs stack by applying a forward bias of ∼6 V, which was lower than that for pure Si-QDs stack. This result is attributed to electric field concentration on the upper P-doped Si-QD layers beneath the layers of the undoped Si-QDs stack due to the introduction of phosphorus atom into the Si-QDs, which was positively charged due to the ionized P donor. The results lead to the development of planar-type electron emission devices with a low-voltage operation.

Hydrogenated germanium films were fabricated in the thickness range of 7-98 nm on SiO2 at 150 by an rf glow discharge decomposition of 0.25% GeH4 diluted with H2, and the nucleation and growth of Ge nanocrystallites were measured from topographic and current images simultaneously taken by a conductive AFM probe after Cr contact formation on films so prepared. We have demonstrated that current images show fine grains in comparison with topographic images and the lateral evolution of the Ge grains with progressive film growth. The contrast in current images can be interpreted in terms of the difference in electron concentration between nanocrystalline grains and their boundaries.

We have studied the formation of Pd-nanodots on SiO2 from ultrathin Pd films being exposed to remote hydrogen plasma at room temperature, in which parameters such as the gas pressure and input power to generate H2 plasma and the Pd film thickness were selected to get some insights into surface migration of Pd atoms induced with atomic hydrogen irradiation and resultant agglomeration with cohesive action. The areal dot density was controlled in the range from 3.4 to 6.51011 cm - 2 while the dot size distribution was changed from 7 to 1.5 in average dot height with 40% variation in full-width at half maximum. We also fabricated MOS capacitors with a Pd-nanodots floating gate and confirmed the flat-band voltage shift in capacitance-voltage characteristic due to electron injection to and emission from the dots floating gate.

We fabricated highly dense Si nano-columnar structures accompanied with Si nanocrystals on W-coated quartz and characterized their local electrical transport in the thickness direction in a non-contact mode by using a Rh-coated Si cantilever with pulse bias application, in which Vmax, Vmin, and the duty ratio were set at +3.0V, -14V, and 50%, respectively. By applying a pulse bias to the bottom W electrode with respect to a grounded top electrode made of ∼10-nm-thick Au on a sample surface, non-uniform current images in correlation with surface morphologies reflecting electron emission were obtained. The change in the surface potential of the highly dense Si nano-columnar structures accompanied with Si nanocrystals, which were measured at room temperature by using an AFM/Kelvin probe technique, indicated electron injection into and extraction from Si nanocrystals, depending on the tip bias polarity. This result is attributable to efficient electron emission under pulsed bias application due to electron charging from the top electrode to the Si nanocrystals in a positively biased duration at the bottom electrode and subsequent quasi-ballistic transport through Si nanocrystals in a negatively biased duration.

Multiply-stacked structures of Si quantum dots (Si-QDs) in gate oxide are attracting much attention because of their potential importance to improve retention characteristics in a high density charge storage. In this work, we have fabricated 6-fold stacked Si-QDs with 2 nm-thick SiO2 interlayers, whose areal dot density and average dot size were 5.71011 cm-2 in each dot layer and 5 nm in height, and studied progress on electron distribution in 6-fold stacked Si-QDs with 2 nm-thick SiO2 interlayers from the measurements of temporal changes in the surface potential after electron charging and discharging locally at room temperature using an AFM/Kelvin probe technique in clean room air. First, by scanning an area of 22 µm2 with the AFM tip biased at +3 V with respect to the substrate in a tapping mode, the area was negatively charged due to electron injection from the substrate to the dot through the bottom tunnel oxide and subsequently, the central part of 100100 nm2 in the pre-charged area was scanned with the tip biased at -3 V to emit the electrons from the Si-QDs to the substrate. As a result, the negative charging level was markedly reduced in the central part in comparison to its peripheral region. And then, the surface potential of the negatively-charged peripheral region was decay monotonously with time as a result of progressive electron tunneling to the substrate. In contrast to this, the temporal change in the surface potential of the central part shows that the electron charging proceeds with time until the surface potential becomes almost the same as that in the peripheral region. This result can be interpreted in terms of lateral spreading of electrons stored in the Si-QDs layer due to the potential difference between the central part and its peripheral region more negatively charged.

We have investigated the impact of O2 annealing after SiOx deposition on the switching behavior to gain a better understanding of the resistance switching mechanism, especially the role of oxygen deficiency in the SiOx network. Although resistive random access memories (ReRAMs) with SiOx after 300 annealing sandwiched with Pt electrodes showed uni-polar type resistance switching characteristics, the switching behaviors were barely detectable for the samples after annealing at temperatures over 500. Taking into account of the average oxygen content in the SiOx films evaluated by XPS measurements, oxygen vacancies in SiOx play an important role in resistance switching. Also, the results of conductive AFM measurements suggest that the formation and disruption of a conducting filament path are mainly responsible for the resistance switching behavior of SiOx.

We have studied the electrical and breakdown characteristics of 5 nm-thick HfSiOxNy (Hf/(Hf + Si)=0.43, nitrogen content=4.5-17.8 at.%) in Al-gate and NiSi-gate capacitors. For Al-gate capacitors, the flat-band shift due to positive fixed charges increases with the nitrogen content in the dielectric layer. In contrast, for NiSi-gate capacitors, the flat band is almost independent of the nitrogen content, which is presumably controlled by the quality of the interface between NiSi and the dielectric layer. The leakage current markedly increases with nitrogen content. Correspondingly, although the time-to-soft breakdown, tSBD, gradually decreases with increasing nitrogen content, the charge-to-soft breakdown, QSBD, increases with the nitrogen content. For Al-gate capacitors, the Weibull slope of time-dependent dielectric breakdown (TDDB) under constant voltage stress (CVS) remains constant at 2 for a nitrogen content of up to 12.5 at.% and then decreases to unity at 17.8 at.%. This must be a condition critical to the formation of the percolation path for breakdown. In contrast, for NiSi gate capacitors, a Weibull slope smaller than unity was obtained, suggesting that structural inhomogeneity, involving defect generation, is introduced during the NiSi gate fabrication, but this negative impact is reduced with nitrogen incorporation.

Resistive switching of metal-insulator-metal (MIM), consisting of a metal-organic chemical vapour deposition (MOCVD) TiO2 layer sandwiched between Pt electrodes, has been measured systematically before and after thermal annealing in different ambiences. With H2 annealing at 400, the current level in the high-resistive state (HRS) significantly decreased while little change in the low-resistive state (LRS) was observed. As a result, the switching ratio over 7 orders of magnitude at the current level was obtained. From the analysis of current-voltage (I-V) characteristics in HRS and LRS, we found that the LRS was characterized with an ohmic conduction, while in the HRS after H2 annealing, charge trapping became significant as a result of a significant decrease in the current level. In a separate experiment, a partial reduction in TiO2 was detected using high-resolution X-ray photoelectron spectroscopy (XPS) after resistant-state switching from HRS to LRS by using a Hg probe as a top electrode, which is associated with filament formation.