As semiconductor device manufacturing technology evolves toward higher integration and reduced feature size, the gap between the defect level estimated at the design stage and that reported for fabricated devices has become wider, making it more difficult to control total manufacturing cost including test cost and cost for field failure. To estimate fault coverage more precisely considering occurrence probabilities of faults, we have proposed weighted fault coverage estimation based on critical area corresponding to each fault. Previously different fault models were handled separately; thus, pattern compression efficiency and runtime were not optimized. In this study, we propose a fast test pattern generation scheme that considers weighted bridge and open fault coverage in an integrated manner. The proposed scheme applies two-step test pattern generation, wherein test patterns generated at second step that target only bridge faults are reordered with a search window of fixed size, achieving O(n) computational complexity. Experimental results indicate that with 10% of the initial target fault size and a fixed, small window size, the proposed scheme achieves approximately 100 times runtime reduction when compared to simple greedy-based reordering, in exchange for about 5% pattern count increment.

Shrinking feature sizes and higher levels of integration in semiconductor device manufacturing technologies are increasingly causing the gap between defect levels estimated in the design stage and reported ones for fabricated devices. In this paper, we propose a unified weighted fault coverage approach that includes both bridge and open faults, considering the critical area as the incident rate of each fault. We then propose a test pattern reordering scheme that incorporates our weighted fault coverage with an aim to reduce test costs. Here we apply a greedy algorithm to reorder test patterns generated by the bridge and stuck-at automatic test pattern generator (ATPG), evaluating the relationship between the number of patterns and the weighted fault coverage. Experimental results show that by applying this reordering scheme, the number of test patterns was reduced, on average, by approximately 50%. Our results also indicate that relaxing coverage constraints can drastically reduce test pattern set sizes to a level comparable to traditional 100% coverage stuck-at pattern sets, while targeting the majority of bridge faults and keeping the defect level to no more than 10 defective parts per milion (DPPM) with a 99% manufacturing yield.

In order to accelerate yield improvement in semiconductor manufacturing, it is important to prevent the root causes of product-specific failures, such as systematic defects and parametric defects, which are different for each product. We herein propose a method for the investigation of product-specific failures by estimating differences between the actual failing bit signatures (FBSs) and the predicted FBSs caused by random defects. In order to estimate these differences accurately, we have developed a novel algorithm by which to extract the critical area for each FBS. The total failure rate errors of FBSs are within 0.5% for embedded SRAMs. The proposed method identified the root causes of product-specific failures in 150 and 65 nm technology node products.

This paper proposes a cell layout synthesis technique to minimize the sensitivity to wiring faults due to spot defects. We modeled the sensitivity to faults on intra-cell routings with consideration to the spot defects size distribution and the end effect of critical areas. The effect of the sensitivity reduction on the yield is also discussed. By using the model as a cost function, we comprehensively generate the minimum width layout of CMOS logic cells and select the optimal layouts. Experimental results show that our technique reduces about 15% of the fault sensitivities compared with the wire-length-minimum layouts for benchmark CMOS logic circuits which have up to 14 transistors.