This paper compares a stub and a decoupling capacitor for power supply noise reduction. A quarter-length stub attached to the power supply line of an LSI chip works as a band-eliminate filter, and suppresses the power supply bounce of the designed frequency. The conditions where the stub is more effective than the same-area decoupling capacitor are clarified. The stub will work more efficiently and on-chip integration will be possible on high frequency operation LSIs.

In this paper we show that self synchronous circuits can provide robust operation in both soft error prone and low voltage operating environments. Self synchronous circuits are shown to be self checking, where a soft error will either cause a detectable error or halt operation of the circuit. A watchdog circuit is proposed to autonomously detect dual-rail '11' errors and prevent propagation, with measurements in 65 nm CMOS showing seamless operation from 1.6 V to 0.37 V. Compared to a system without the watchdog circuit size and energy-per-operation is increased 6.9% and 16% respectively, while error tolerance to noise is improved 83% and 40% at 1.2 V and 0.4 V respectively. A circuit that uses the dual-pipeline circuit style as redundancy against permanent faults is also presented and 40 nm CMOS measurement results shows correct operation with throughput of 1.2 GHz and 810 MHz at 1.1 V before and after disabling a faulty pipeline stage respectively.

This paper demonstrates an on-chip di/dt detector circuit. The di/dt detector circuit consists of a power supply line, an underlying spiral inductor and an amplifier. The mutual inductor induces a di/dt proportional voltage, and the amplifier amplifies and outputs the value. The measurement results show that the di/dt detector output and the voltage difference between a resistor have good agreement. The di/dt reduction by a decoupling capacitor is also measured using the di/dt detector.

We propose a high-sensitivity and wide-dynamic-range position sensor using logarithmic-response and correlation circuit. The 3-D measurement system using the proposed position sensor has advantages to applications, for example a walking robot and a recognition system on vehicles, which require both of availability in various backgrounds and safe light projection for human eyes. The position sensor with a 64 64 pixel array has been developed and successfully tested. We describe the sensitivity of position detection as SBR (Signal-to-Background Ratio). The minimum SBR of the sensor is -13.9 dB lower than standard sensors. High sensitivity under -10 dB SBR is realized in a dynamic range of 41.7 dB in terms of background illumination. Experimental results of position detection and 3-D measurement in a strong background illumination are also presented.

Dynamic performance of ultra-thin SIMOX (Separation by IMplanted OXgen) CMOS circuits has been studied using ring oscillators. A novel concept of current-delay product, along with an equivalent linear resistance of MOSFETs, is applied for deriving effective load capacitance of near 0.1 µm gate CMOS circuits. Calculation results showed quatitative agreement with measurement data. It was found that the gate-fringing capacitance limits the delay time is the case of under 0.2 µm gate-length. The lower bound of power-delay product of SIMOX/SOI is expected as low as 0.2 fJ for the gate length of 0.15 µm at the supply voltage of 1.5 V.

We have proposed a generic architecture that can integrate the aspects of confidentiality and integrity into the A/D conversion framework. A conceptual account of the development of the proposed architecture is presented. Using the principle of this architecture we have presented a CMOS circuit design to facilitate a fully integrated Authenticated-Encrypted ADC (AE-ADC). We have implemented and demonstrated a partial 8-bit ADC Analog Front End of this proposed circuit in 0.18µm CMOS with an ENOB of 7.64 bits.

In this paper, we present a hierarchical multi-chip architecture which employs fully digital and word-parallel associative memories based on Hamming distance. High capacity scalability is critically important for associative memories since the required database capacity depends on the various applications. A multi-chip structure is most efficient for the capacity scalability as well as the standard memories, however, it is difficult for the conventional nearest-match associative memories. The present digital implementation is capable of detecting all the template data in order of the exact Hamming distance. Therefore, a hierarchical multi-chip structure is simply realized by using extra register buffers and an inter-chip pipelined priority decision circuit hierarchically embedded in multiple chips. It achieves fully chip- and word-parallel Hamming distance search with no throughput decrease, additional clock latency of O(log P), and inter-chip wires of O(P) in a P-chip structure. The feasibility of the architecture and circuit implementation has been demonstrated by post-layout simulations. The performance has been also estimated based on measurement results of a single-chip implementation.

This paper prsesnts a reduced swing signal data transmission method for the bus architectures in VLSIs, which consists of small size bus drivers of inverters, dual rail transmission lines, termination resistors and sense amplifiers for regenerating signal swing. The optimum value of signal swing and driving capacity of sense amplifier are given as functions of transmission line capacitance based on a criterion of areadelay2 for guideline. Using results of analysis, we propose a self-controlled data transmission module for the optimum reduced swing signal. Applying the method to a 32bit bus architecture, it is shown that total area, cycle time and total power consumption are 66,070[µm2], 0.90[ns], 32.2[mW], respectively, while those are 284,000[µm2], 1.12[ns], 173.4[mW], respectively, in the conventional chained buffer module. The proposed method is less noisy than the conventional chained buffer method.

This paper demonstrates a power supply noise reduction using on-board stubs. A quarter-length stub attached to the power supply line of an LSI chip works as a band-eliminate filter, and suppresses the power supply noise of the designed frequency. Preliminary experiments show that 87% of the designed frequency noise component is suppressed when stub patterns are written on a power supply area on a PCB board for a 1.25 GHz operating LSI. The results show the possibility of the stub on-chip integration when the operating frequency of LSIs becomes higher and the stub length becomes shorter.

We propose a shot reduction technique of character projection (CP) Electron Beam Direct Writing (EBDW) using combined cell stencil (CCS) or the advanced process technology. CP EBDW is expected both to reduce mask costs and to realize quick turn around time. One of major issue of the conventional CP EBDW, however, is a throughput of lithography. The throughput is determined by numbers of shots, which are proportional to numbers of cell instances in LSIs. The conventional shot reduction techniques focus on optimization of cell stencil extraction, without any modifications on designed LSI mask patterns. The proposed technique employs the proposed combined cell stencil, with proposed modified design flow, for further shot reduction. We demonstrate 22.4% shot reduction within 4.3% area increase for a microprocessor and 28.6% shot reduction for IWLS benchmarks compared with the conventional technique.

This paper presents a structural approach for synthesizing arbitrary multi-output multi-stage static CMOS circuits at the transistor level, targeting the reduction of transistor counts. To make the problem tractable, the solution space is restricted to the circuit structures which can be obtained by performing algebraic transformations on an arbitrary prime-and-irredundant two-level circuit. The proposed algorithm is guaranteed to find the optimal solution within the solution space. The circuit structures are implicitly enumerated via structural transformations on a single graph structure, then a dynamic-programming based algorithm efficiently finds the minimum solution among them. Experimental results on a benchmark suite targeting standard cell implementations demonstrate the feasibility and effectiveness of the proposed approach. We also demonstrated the efficiency of the proposed algorithm by a numerical analysis on randomly-generated problems.

This paper demonstrates a feedforward active substrate noise cancelling technique using a power supply di/dt detector. Since the substrate is usually tied with the ground line with a low impedance, the substrate noise is closely related to the ground bounce which is proportional to the di/dt when inductance is dominant on the ground line impedance. Our active cancelling detects the di/dt of the power supply, and injects an anti-phase current into the substrate so that the di/dt-proportional substrate noise is cancelled out. Our first trial shows that 34% substrate noise reduction is achieved on our test circuit, and the theoretical analysis shows that the optimized canceller design will enhance the substrate noise suppression ratio up to 56%.

This paper describes the design and development of a module generator for a dual-rail PLA with embedded 2-input logic cells for 0.35 µm CMOS technology. In order to automatically generate logic-cell based PLA layouts from circuit specifications, a module generator as a design automation tool of logic-cell based PLA is developed with a structural improvement. This module generator is based on a timing-driven design methodology and consists of logic synthesis, transistor sizing and logic cell generation, stimulus generation, HDL model generation parts. This generator uses a design constraint to achieve a flexible transistor sizing in a logic cell generation part. In addition, generated logic cells can be easily adapted to a layout generator. The layout is generated by using 0.35 µm, 3-metal-layer CMOS technology. Moreover, an HDL model generator is developed to create delay behavior models easily and quickly with precise timing parameters. The design complexity which is becoming an important issue for VLSI circuits can be reduced partially and human caused errors are minimized by module generator. A PLA layout in GDS-II form and an HDL model behavior of a Boolean function which has 64-bit input, 1-bit output and 220 product term can be generated within 8 minutes on a SunUltraSPARC-III 900 MHz processor. A very short time is required to compile the module, and this makes it feasible for designers to try many different design configurations in order to get the better one.

This paper presents a decoupling capacitance boosting method for the resonant supply noise reduction by fast voltage hopping of DVS systems. The proposed method utilizes a foot transistor as a switch between a conventional decoupling capacitor (decap) and GND. The switching controls of the foot transistor depending on the supply noise states achieve an effective noise reduction as well as fast settling time compared with the conventional passive decaps. The measurement results of a test chip fabricated in a 0.18 µm CMOS technology show 12X boost of effective decap value, and 65.8% supply noise reduction with 96% settling time improvement.

This paper proposes a cell layout synthesis method via Boolean Satisfiability (SAT). Cell layout synthesis problems are first transformed into SAT problems by our formulations. Our method realizes a high-speed layout synthesis for CMOS logic cells and guarantees to generate the minimum-width cells with routability under our layout styles. It considers complementary P-/N-MOSFETs individually during transistor placement, and can generate smaller width layout compared with pairing the complementary P-/N-MOSFETs case. To demonstrate the effectiveness of our SAT-based cell synthesis, we present experimental results which compare it with the 0-1 ILP-based transistor placement method and a commercial cell generation tool. The experimental results show that our SAT-based method can generate minimum-width placements in much shorter run time than the 0-1 ILP-based transistor placement method, and can generate the cell layouts of 32 static dual CMOS logic circuits in 54% run time compared with the commercial tool. Area increase of our method without compaction is only 3% compared with the commercial tool with compaction.

In this paper we present an on-chip noise detection circuit. In contrast with the previous works concerning on-chip noise measurement, this detector does not assume specific noise properties such as periodicity. The detector is able to continuously capture 10 nano-second time window from the measured signal with a resolution equal to 100 pico-second. The requested bandwidth of the output channel can be adjusted freely, therefore, the user can avoid the effect of on-chip parasites and the need to off-chip sophisticated monitoring tools. The detector is equipped with an on-chip programmable voltage divider, which enables measuring the high and low swing fluctuations accurately. Therefore, the detector is suitable to measure the non-periodic/single event noise for the purpose of reliability evaluation and performance modeling. The detector is implemented in a test chip using Hitachi 0.18 µm technology.

Character projection (CP) is a high-speed mask-less exposure technique for electron-beam direct writing (EBDW). In CP exposure of VIA layers, higher throughput is realized if more VIAs are exposed in each EB shot, but it will result in huge number of VIA characters to cover arbitrary VIA arrangements. We adopt one-dimensional VIA arrays as the basic CP character architecture to increase VIA numbers in an EB shot while saving the stencil area by superposed character arrangement. In addition, CP throughput is further improved by layout constraints on the VIA placement in the detail routing phase. Our experimental results proved the feasibility of our exposure strategy in the practical CP use in 14nm lithography.

This paper describes an area-efficient dual-rail array logic architecture, a logic-cell-embedded PLA (LCPLA), which has 2-input logic cells in the structure. The 2-input logic cells composed of pass-transistors can realize any 2-input Boolean function and are embedded in a dual-rail PLA. The logic cells can be designed by connecting some local wires and do not require additional transistors over logic cells of the conventional dual-rail PLA. By using the logic cells, some classes of logic functions can be implemented efficiently, so that high-speed and low-power operations are also achieved. The advantages over the conventional PLAs and standard-cell-based designs were demonstrated by using benchmark circuits, and the LCPLA is shown to be effective to reduce the number of product terms. In a structure with a 64-bit input and a 1-bit output including 220 product terms, the LCPLA achieved an area reduction by 35% compared to the conventional high-speed dual-rail PLA, and the power-delay product was reduced by 74% and 46% compared to the conventional high-speed single-rail PLA and the conventional high-speed dual-rail PLA, respectively. A test chip of this configuration was fabricated using a 0.35-µm, 3-metal-layer CMOS technology, and was verified with a functional test using a logic tester and an electron-beam tester at frequencies of up to 100 MHz with a supply voltage of 3.3 V.