In response to fast charging systems, Silicon Carbide (SiC) power semiconductor devices are of great interest of the automotive power electronics applications as the next generation of fast charging systems require high voltage batteries. For high voltage battery EVs (Electric Vehicles) over 800V, SiC power semiconductor devices are suitable for 3-phase inverters, battery chargers, and isolated DC-DC converters due to their high voltage rating and high efficiency performance. However, SiC-MOSFETs have two characteristics that interfere with high-speed switching and high efficiency performance operations for SiC MOS-FET applications in automotive power electronics systems. One characteristic is the low voltage rating of the gate-source terminal, and the other is the large internal gate-resistance of SiC MOS-FET. The purpose of this work was to evaluate a proposed hybrid gate drive circuit that could ignore the internal gate-resistance and maintain the gate-source terminal stability of the SiC-MOSFET applications. It has been found that the proposed hybrid gate drive circuit can achieve faster and lower loss switching performance than conventional gate drive circuits by using the current source gate drive characteristics. In addition, the proposed gate drive circuit can use the voltage source gate drive characteristics to protect the gate-source terminals despite the low voltage rating of the SiC MOS-FET gate-source terminals.

In this work, the effect of device dimension variation and metal wiring scheme on the RF performance of MOSFETs based on 0.13-µm RFCMOS technology has been investigated. Two sets of experiments have been carried out. In the first experiment, two types of source metal wiring options, each with various gate poly pitches, have been investigated. The results showed that the extrinsic capacitances (Cegs, Cegd) and parasitic resistances tend to increase with increasing gate poly pitch. Both cutoff frequency (fT) and maximum oscillation frequency (fmax) showed substantial degradation for the larger gate poly pitches. Based on measurement, we propose a simplified model for extrinsic parasitic capacitance as a function of gate poly pitch with different source metal wiring schemes. For the second experiment, the impact of gate metal wiring scheme and the number of gate fingers Nf on the RF performance of MOSFET has been studied. Two different types of gate metal wiring schemes, one with poly layer and the other with M2 layer, are compared. The measurement showed that the capacitance is slightly increased, while gate resistance significantly reduced, with the M2 gate wiring. As a result, fT is slightly degraded but fmax is significantly improved, especially for larger Nf, with the M2 gate wiring. The results in this work provide useful information regarding device dimension and metal wiring scheme for various RF applications of RF CMOS technology.

This paper describes the fabrication of 0.1 µm gate length CMOS devices and analysis of delay time by circuit simulation. In order to reduce the gate resistance, TiN capped cobalt salicide technology is applied to the fabrication of 0.1 µm CMOS devices. Gate sheet resistance with a 0.1 µm gate is as low as 5 Ω/sq. Propagation delay times of 0.1 µm and 0.15 µm CMOS inverter are 21 ps and 36 ps. Simulated propagation delay time agreed fairly well with experimental results. For gate length over 0.15 µm, intrinsic delay in CMOS devices is the main dalay factor. This suggests that increasing current drivability is the most efficient way to improve propagation delay time. At 0.1 µm, each parasitic component and intrinsic delay have similar contributions on device speed due to the short channel effect. To improve delay time, we used rapid thermal annealing or a high dose LDD structure. With this structure, drain current increases by more than 1.3 times and simulation predicted a delay time of 28 ps is possible with 0.15 µm CMOS inverters.

Using Ti self-aligned silicide (salicide) process, we fabricated subquarter-micron complementary metal-oxide semiconductor (CMOS) devices, and studied the mechanism of increasing resistivity of TiSi2 on poly-Si gates from 0.075 to 20 µm long and 10 µm wide. In the gates less than 0.1 µm long, we found that agglomeration of TiSi2 takes place during low temperature annealing at 675 for 30 seconds leading to discontinuous TiSi2 lines. The discontinuity of TiSi2 abruptly increases the gate resistance, and remarkably reduces the circuit speed of CMOS ring oscillators. On the other hand, Raman spectroscopy reveals that the phase transition from high-resistivity C49 to low-resistivity C54 occurs in plane TiSi2 by annealing at 800 for 30 seconds, while it does not occur in TiSi2 gates less than 5 µm long. From these results we found that the gate sheet resistance can not be reduced to less than 5 Ω/sq by conventional Ti salicide technology in gates shorter than 0.4 µm due to increase in gate resistance caused by agglomeration and lack of phase transition.