This paper demonstrates a FinFET operational amplifier (opamp), which is suitable to be integrated with digital circuits in a scaled low-standby-power (LSTP) technology and operates at extremely low voltage. The opamp is consisting of an adaptive threshold-voltage (Vt) differential pair and a low-voltage source follower using independent-double-gate- (IDG-) FinFETs. These two components enable the opamp to extend the common-mode voltage range (CMR) below the nominal Vt even if the supply voltage is less than 1.0 V. The opamp was implemented by our FinFET technology co-integrating common-DG- (CDG-) and IDG-FinFETs. More than 40-dB DC gain and 1-MHz gain-bandwidth product in the 500-mV-wide input CMR at the supply voltage of 0.7 V was estimated with SPICE simulation. The fabricated chip successfully demonstrated the 0.7-V operation with the 480-mV-wide CMR, even though the nominal Vt was 400 mV.

Voltage multiplier (VM) circuits for RF (2.45GHz)-to-DC conversion are developed for battery-less sensor nodes. Converted DC power is charged on a storage capacitor before driving a wireless sensor module. A charging time of the storage capacitor of the proposed VM circuits is reduced 1/10 of the conventional VM circuits, because they have constant current characteristics owing to self-control of body bias in diode-connected SOI MOSFETs. The wireless sensor system composed of the fabricated VM chip and a commercially available sensor module is operated using an RF signal of a wireless LAN modem (2.45GHz) as a power source.

Aiming at drastically reducing standby leakage current, an SRAM using Four-Terminal- (4T-) FinFETs, named Flex-Vth SRAM, with a dynamic row-by-row threshold voltage control (RRTC) was developed. The Flex-Vth SRAM realizes an extremely low standby-leakage current thanks to the flexible threshold-voltage (Vth) controllability of the 4T-FinFETs, while its access speed and static noise margin (SNM) are maintained. A TCAD-based Monte Carlo simulation indicates that even when the process-induced random variation in the device performance is taken into account, the Flex-Vth SRAM reduces the leakage current to 1/100 of that of a standard SRAM in a 256256 array, where 20-nm-gate-length technologies with the same on-current are assumed.

This paper presents a precise characterization of high-frequency characteristics of intrinsic channel of FinFET. For the de-embedding of the parasitics attached to the source, drain and gate terminals, it proposes special calibration patterns which can place the reference surface just beside the intrinsic part of the FinFET. It compares the measured S parameter data up to 40 GHz with the device simulation and shows good matching. The experimental data of the through pattern also confirms the accuracy of the de-embedded parasitics and extracted intrinsic part of FinFET.