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Masayuki HIRAO Daichi YAMANAKA Takanori YAZAKI Jun OSAKO Hokuto IIJIMA Takao SHIOKAWA Hikota AKIMOTO Takashi MEGURO
Negative electron affinity (NEA) surfaces can be formed by alternating supply of alkali metals (e.g. Cs, Rb, K) and oxygen on semiconductor surfaces. We have studied adsorption structures of Cs on an As-terminated (2×4) (001) GaAs surface using scanning tunneling microscopy (STM). We found that the initial adsorption of Cs atoms occurs around the step sites in the form of Cs clusters and that the size of clusters is reduced by successive exposure to O2, indicating that As-terminated (2×4) surfaces are relatively stable compared to Ga-terminated surfaces and are not broken by the Cs clusters adsorption.
Takaki NIWA Takashi ISHIGAKI Naoto KUROSAWA Hidenori SHIMAWAKI Shinichi TANAKA
The linear operation of a HBT with a GaAs/InGaP composite collector structure is demonstrated. The composite collector structure allows for a thin collector design that is suitable for the linear operation of a HBT without critical degradation of the breakdown voltage. The load pull measurements under a 1.95 GHz WCDMA signal have shown that a composite-collector HBT with a 400-nm thick collector layer operates with power-added-efficiency (PAE) as high as 53% at VCE = 3.5 V as a result of improved distortion characteristics. Despite the thin collector design, collector-emitter breakdown voltage of 11 V was achieved even at current density of 10 kA/cm2. The composite-collector HBT has even greater advantage for future low voltage (< 3 V) applications where maintaining PAE and linearity becomes one of the critical issues.
Yoshiko Matsuo IKEDA Masami NAGAOKA Hirotsugu WAKIMOTO Toshiki SESHITA Masakatsu MIHARA Misao YOSHIMURA Yoshikazu TANABE Keiji OYA Yoshiaki KITAURA Naotaka UCHITOMI
A GaAs linear power amplifier operating with a single 3-V supply has been developed for 5.8-GHz ISM band applications. Two kinds of refractory WNx/W self-aligned gate MESFETs, a P-pocket MESFET and an asymmetric MESFET with a buried p-layer (BP- MESFET ) have been compared in terms of DC characteristics, small signal characteristics and power performances at 5.8 GHz. To obtain both high gain and high efficiency in the case of single 3-V supply operation at 5.8 GHz, we used a highly efficient and linear P-pocket MESFET for the output-stage power FET and a high-gain asymmetric MESFET with a buried p-layer (BP- MESFET ) for the driver-stage FET. The bias condition for 1-mm output-stage P-pocket MESFET was set near class-AB, so as to obtain sufficient output power with high PAE. The two-stage power amplifier MMIC module which can include all matching and biasing circuits, has been designed and fabricated. The amplifier exhibits a high power gain of 17.9 dB and a high power-added efficiency of 25.7% with a sufficient output power of 18.7 dBm at the 1-dB compression point. This self-aligned gate GaAs MESFET technology is promising for near-future 5.8-GHz applications, because of such good power performance and good mass-producibility.
Masami NAGAOKA Hirotsugu WAKIMOTO Toshiki SESHITA Katsue K. KAWAKYU Yoshiaki KITAURA Atsushi KAMEYAMA Naotaka UCHITOMI
A GaAs power MESFET amplifier with a low-distortion, 10-dB gain-variable attenuator has been developed for 1. 9-GHz Japanese personal handy phone system (PHS). Independently of its gain, a very low 600-kHz adjacent channel leakage power (ACP) with sufficient output power was attained. In single low 2. 4-V supply operation, an output power of 21. 1 dBm, a low dissipated current of 157 mA and a high power-added efficiency (PAE) of 37. 2% were obtained with an ACP of -55 dBc.
Masami NAGAOKA Hironori NAGASAWA Katsue K. KAWAKYU Kenji HONMYO Shinji ISHIDA Yoshiaki KITAURA Naotaka UCHITOMI
A GaAs power amplifier IC has been developed for 1. 9-GHz digital mobile communication applications, such as the handsets of the Japanese personal handy phone system (PHS), which was assembled into a very small 0. 012-cc surface mount plastic package. This power amplifier using refractory WNx/W self-aligned gate MESFETs with p-pocket layers can operate with high efficiency and low distortion with a single 3-V supply. A very low dissipated current of 119 mA was obtained with an output power of 21. 1 dBm and a low 600-kHz adjacent channel leakage power (ACP) of -63 dBc for π/4-shifted quadrature phase shift keying (QPSK) modulated input.
Masami NAGAOKA Tomotoshi INOUE Katsue KAWAKYU Shuichi OBAYASHI Hiroyuki KAYANO Eiji TAKAGI Yoshikazu TANABE Misao YOSHIMURA Kenji ISHIDA Yoshiaki KITAURA Naotaka UCHITOMI
A monolithic linear power amplifier IC operating with a single low 2.7-V supply has been developed for 1.9-GHz digital mobile communication systems, such as the Japanese personal handy phone system (PHS). Refractory WNx/W self-aligned gate GaAs power MESFETs have been successfully developed for L-band power amplification, and this power amplifier operates with high efficiency and low distortion at a low voltage of 2.7 V, without any additional negative voltage supply, by virtue of small drain knee voltage, high transconductance and sufficient breakdown voltage of the power MESFET. An output power of 23.0 dBm and a high power-added efficiency of 30.8% were attained for 1.9-GHz π/4-shifted QPSK (quadrature phase shift keying) modulated input when adjacent channel leakage power level was less than -60 dBc at 600 kHz apart from 1.9 GHz.
Nobuo NAGANO Tetsuyuki SUZAKI Masaaki SODA Kensuke KASAHARA Kazuhiko HONJO
AlGaAs/GaAs HBT ICs for high bit-rate optical transmission systems, such as preamplifier, D-F/F, differential amplifier, and laser driver, have been newly developed using the hetero guard-ring fully self-aligned HBT (HGFST) fabrication process. In this process, the emitter mesa is ECR-RIBE dry etched using a thick emitter-metal system of WSi and Ti-Pt-Au as etching mask, and a hetero guard-ring composed of a depleted AlGaAs layer is fabricated on p GaAs extrinsic base regions. This process results in highly uniform HBT characteristics. The preamplifier IC exhibits a DC to 18.5-GHz transimpedance bandwidth with a transimpedance gain of 49 dBΩ. The rise time and fall time for the D-F/F IC are 30 and 23 ps, respectively. The laser driver IC has a 40-mAp-p output current swing. The differential amplifier exhibits a DC to 12.1-GHz bandwidth with a 14.2-dB power gain.
Noriyuki HIRAKATA Mitsuaki FUJIHIRA Akihiro NAKAMURA Tomihiro SUZUKI
High frequency and low power 128/129 dual modulus prescaler ICs are developed for mobile communication applications, using 0.5 µm GaAs MESFET technology. Provided with an on-chip voltage regulator, a prescaler IC with an input amplifier operates in a wide frequency range from 200 MHz to 1,500 MHz at input power from -15 dBm to +17 dBm at the temperature of -30 to +120 with supply voltage of 2.7 V, 3.0 V and 5.0 V. At the same time, it demonstrated its low power characteristics consuming 3.68 mA with 3.0 V at +30 in operation, 0.16 mA while powered-off. Another prescaler IC without an input amplifier operates up to 1,650 MHz with Vdd=2.7 V, 3.0 V and 5.0 V at +30, dissipating 2.74 mA/3.0 V.