Visual defects, called mura in the field, sometimes occur during the manufacturing of the flat panel liquid crystal displays. In this paper we propose an automatic inspection method that reliably detects and quantifies TFT-LCD region-mura defects. The method consists of two phases. In the first phase we segment candidate region-muras from TFT-LCD panel images using the modified regression diagnostics and Niblack's thresholding. In the second phase, based on the human eye's sensitivity to mura, we quantify mura level for each candidate, which is used to identify real muras by grading them as pass or fail. Performance of the proposed method is evaluated on real TFT-LCD panel samples.

For more than twenty-five years software inspections have been considered an effective method for defect detection. Inspections have been investigated through controlled experiments in university environment and industry case studies. However, in most cases software inspections have been used for defect detection in documents of conventional structured development process. Therefore, there is a significant lack of information about how inspections should be applied to Object-Oriented artifacts, such as Object-Oriented code and design diagrams. In addition, extensive work is needed to determine whether some inspection techniques can be more beneficial than others. Most inspection experiments include inspection meetings after individual inspection is completed. However, several researchers suggested that inspection meetings may not be necessary since an insignificant number of new defects are found as a result of inspection meeting. Moreover, inspection meetings have been found to suffer from process loss. This paper presents the findings of a controlled experiment that was conducted to investigate the performance of individual inspectors as well as 3-person teams in Object-Oriented design document inspection. Documents were written using the notation of Unified Modelling Language. Two reading techniques, namely Checklist-based reading (CBR) and Perspective-based reading (PBR), were used during experiment. We found that both techniques are similar with respect to defect detection effectiveness during individual inspection as well as during inspection meetings. Investigating the usefulness of inspection meetings, we found out that the teams that used CBR technique exhibited significantly smaller meeting gains (number of new defect first found during team meeting) than meeting losses (number of defects first identified by an individual but never included into defect list by a team); meanwhile the meeting gains were similar to meeting losses of the teams that used PBR technique. Consequently, CBR 3-person team meetings turned out to be less beneficial than PBR 3-person team meetings.

Software inspection is one of the most effective methods to detect defects. However, inspections are not always worthwhile. This letter proposes an inspection cost model to describe inspections-related costs and extended metrics to evaluate the cost effectiveness of software inspections.

An analysis of the phase difference spectrum between two images allows precise image shift detection. Image shifts are directly evaluated from the phase difference spectrum without Fourier inversion. In the calculation, the weight function containing the frequency and the cross spectrum is used and an unlapping procedure is carried out. In an experiment using synthetic and real images of typical image patterns, accuracy as high as 0.01-0.02 pixel was achieved stably and reliably for most of the image patterns.

Automatic image inspector inspects the quality of printed circuit boards using image-processing technology. In this study, we change an automatic inspection problem into a problem for detecting the signal singularities. Based on the wavelet theory that the wavelet transform can focus on localized signal structures with a zooming procedure, a novel singularity detection and measurement algorithm is proposed. Singularity positions are detected with the local wavelet transform modulus maximum (WTMM) line, and the Lipschitz exponent is estimated at each singularity from the decay of the wavelet transform amplitude along the WTMM line. According to the theoretical analysis and computer simulation results, the proposed algorithm is shown to be successful for solving the automatic inspection problem and calculating the Lipschitz exponents of signals. These Lipschitz exponents successfully characterize singular behavior of signals at singularities.

An automatic LSI package lead inspection system for backside lead specification is proposed. The proposed system inspects not only lead backside contamination but also the mechanical lead specification such as lead pitch, lead offset and lead overhangs (variations in lead lengths). The total inspection time of a UQFP package with a lead count of 256 is less than the required time of 1 second. Our proposed method is superior to the threshold method used usually, especially for the defect between leads.

We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the board on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference device) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 µm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.

The visual inspection of printed circuit boards (PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate (0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.

The defects in the cold rolled strips have textural characteristics, which are nonuniform due to its irregularities and deformities in geometrical appearance. In order to handle the textural characteristics of images with defects, this paper proposes a surface inspection method based on textural feature extraction using the wavelet transform. The wavelet transform is employed to extract local features from textural images with defects both in the frequency and in the spatial domain. To extract features effectively, an adaptive wavelet packet scheme is developed, in which the optimum number of features are produced automatically through subband coding gain. The energies for all subbands of the optimal quadtree of the adaptive wavelet packet algorithm and four entropy features in the level one LL subband, which correspond to the local features in the spatial domain, are extracted. A neural network is used to classify the defects of these features. Experiments with real image data show good training and generalization performances of the proposed method.

The most troublesome problem in automated X-ray mask inspection is how to exactly determine the threshold level for extracting the pattern portions of each scanning electron microscopic (SEM) image. An exact determination is difficult because the histogram shows, in most cases, a complicated multi-modal pattern and the true threshold level often varies with each successive image. This paper presents a novel thresholding approach for segmenting SEM images of X-ray masks. In this approach, the shape of the histogram of each image is iteratively analyzed until a threshold value minimizing the cost of the correspondence with a reference histogram and satisfying criteria for determining thresholds is obtained. This new approach is used in an automated inspection system. When the input image resolution is set to 0.05µm/pixel, experiments confirm 0.1µm defects are unfailingly detected.

This paper discusses the design of a small sensing device for EMI measurement which has equivalent characteristics to the absorbing clamp method, and reports the results on evaluation of the device. The device can be applied to the inspection apparatus for products such as power tools to examine conformance to EMI regulations of electromagnetic radiation spectrum. For reducing the scale of the EMI inspection apparatus, new matching circuit being replaced with the absorbing clamp method is adopted in the sensing device. Length of the sensing device is smaller than one twelfth of a wavelength of the measuring frequency in order to regard the sensing device as a concentrated constant circuit. The matching circuit is a resonant circuit which consists of a coaxial coupled transformer and a variable capacitor, and the transformer is a spiral copper tube in which a pair of AC power line wires passes. Resonant frequency of the circuit is tuned to the measuring frequency by adjusting the variable capacitor so that the circuit would terminate the power line by impedance zero. Thus interference current propagating along the power line from a product is absorbed, and observed by means of a VHF current probe which is settled in the matching circuit. A simple circuit for measurement of noise amplitude distribution (NAD) of interference current was developed as well as an equation to estimate quasi-peak value from the NAD. Result of measurement by the sensing device and proposed procedure confirmed good correlation with the standard absorbing clamp method, and deviation was within 3dB. Measurement time was reduced to 25 s per product, and the in-line EMI checker with new sensing device can be employed in a mass production line.

A new electron-beam wafer inspection system has been developed. The system has a resolution of 5 nm or better, and is applicable to quarter-micron devices such as 256 Mbit DRAMs. The most remarkable feature of this system is that a specimen stage is built in the objective lens and allows a working distance (WD) of 0. "WD=0"minimizes the effect of lens aberrations, and maximizes the resolving power. Innovative designs to achieve WD=0 are as follows: (1)A large objective lens of 730-mm width 730-mm depth 620-mm height that serves as a specimen chamber, has been developed. (2)A hollow specimen stage made of non-magnetic materials has been developed.It allows the lower pole piece and magnetic coile of the objective lens inside it. (3)Acoustic motors made of non-magnetic materials are em-ployed for use in vacuum.

We studied effects of 50-200-keV electrons on semiconductor devices using BEASTLI (backscattered electron assisting LSI inspection) method. When irradiating semiconduc-tor devices with such high-energy electrons, we have to note two phenomena. The first is surface charging and the second is device damage. In our study of surface charging, we found that a net positive charge was formed on the device surface. The positive surface charges do not cause serious influence for observation so that we can inspect wafers without problems. The positive surface charging may be brought about because most incident electrons penetrate the device layer and reach the conducting substrate of the semiconductor device. For the device damage, we studied MOS devices which were sensitive to electron-beam irradiation. By applying a 400- annealing to electron-beam irradiated MOS devices, we could restore the initial characteris-tics of MOS devices. However, in order to recover hot-carrier degradation due to neutral traps, we had to apply a 900- annealing to the electron-beam irradiated MOS devices. Thus, BEASTLI could be successfully used by providing an apporopri-ate annealing to the electron-beam irradiated MOS devices.

In this study, an extraction method of failure sound signal which is strongly contaminated by noise is investigated by genetic algorithm and statistical tests of the frequency domain for the failure diagnosis of machinery. In order to check the extraction accuracy of the failure signal and obtain the optimum extraction of failure signal, the "existing probability Ps (t*k) of failure signal" and statistical information Iqp are defined as the standard indices for evaluation of the extraction results. It has been proven by practical field data and application of the inspection and diagnosis robot that the extraction method discussed in this paper is effective for detection of a failure and distinction of it's origin in the diagnosis of machinery.

The fast and highly reliable method reported here uses two techniques to detect all types of defects, such as unsoldered leads, solder bridges, and misalignes leads in the minute solder joints of high density mounted devices. One technique uses external force applied by an air jet that vibrates or shifts unsoldered leads. The vibration and shift is detected as a change in the speckle pattern produced by laser illumination of the solder joints. The other technique uses fluorescence generated by short-wavelength laser illumination. The fluorescence from a printed circuit board produces a silhouette of the solder joint and this image is processed to detect defects. Experimental results show that this inspection method detects all kinds of defects accurately and with a very low false alarm rate.