In this work, the metal-oxide-metal (MOM) capacitor in the scaled CMOS process has been modeled at high frequencies using an EM simulator, and its layout has been optimized. The modeled parasitic resistance consists of four components, and the modeled parasitic inductance consists of the comb inductance and many mutual inductances. Each component of the parasitic resistance and inductance show different degrees of dependence on the finger length and on the number of fingers. The substrate network parameters also have optimum points. As such, the geometric dependence of the characteristics of the MOM capacitor is investigated and the optimum layout in the constant-capacitance case is proposed by calculating the results of the model. The proposed MOM capacitor structures for 50fF at f =60GHz are L =5μm with M =3, and, L =2μm with M =5 and that for 100fF at f =30GHz are L =9μm with M =3, and L =4μm with M =5. The target process is 65-nm CMOS.

This paper evaluates impact of self-heating in wire interconnection on signal propagation delay in an upcoming 32 nm process technology, using practical physical parameters. This paper examines a 64-bit data transmission model as one of the most heating cases. Experimental results show that the maximum wire temperature increase due to the self-heating appears in the case where the ratio of interconnect delay becomes largest compared to the driver delay. However, even in the most significant case which induces the maximum temperature rise of 11.0, the corresponding increase in the wire resistance is 1.99% and the resulting delay increase is only 1.15%, as for the assumed 32 nm process. A part of the impact reduction of wire self-heating on timing comes from the size-effect of nano-scale wires.

This paper describes a 1.2-V, 12-bit, 200-MSample/s current-steering CMOS digital-to-analog (D/A) converter for wireless-communication terminals. To our knowledge, the supply voltage of this converter is the lowest for high-speed applications. To overcome increasing device mismatch in low-voltage operation, we propose an H-shaped, 3-dimensional structure for reducing influence of voltage drops (IR drops) along power supplies. This technique relaxes mismatch requirements and allows use of small devices with small parasitics. By using this technique, a low-voltage, high-speed D/A converter was realized. The converter was implemented in a 90-nm CMOS technology. The modulator achieves the intrinsic accuracy of 12 bits and a spurious-free dynamic range (SFDR) above 55 dB over a 100-MHz bandwidth.

An advanced characterization method for sub-micron DRAM cell transistors has been proposed for the analysis of transistor test structures using memory cell patterns. When the actual memory cell layout is used as a test structure, the parasitic source and drain resistance of the test structure affected conventional transistor parameters such as threshold voltage. To solve this problem, reduced drain current measurement methods have been proposed to suppress the parasitic resistance voltage drop. In these measurements, two new transistor parameters, Vgoff and Vgsat, have been proposed which are related to off-leakage and full writing, respectively. These parameters are found to be good parameters for monitoring DRAM bit failures. A new threshold voltage measurement methodology has also been proposed for test structures with high parasitic resistance.