In this paper, we propose two methods to estimate clock jitter caused by power supply noise in a LSI (Large-Scale Integrated circuit). One of the methods enables estimation of clock jitter at the initial design stage before floor-planning. The other method reduces simulation time of clock distribution network to analyze clock jitter at the design verification stage after place-and-route of the chip. For an example design, the relative difference between clock jitter estimated at the initial design stage and that of the design verification stage is 23%. The example result also shows that the proposed method for the verification stage is about 24 times faster than the conventional one to analyze clock jitter.

Leakage current is an important qualitative metric of LSI (Large Scale Integrated circuit). In this paper, we focus on reduction of leakage current variation under the process variation. Firstly, we derive a set of quadratic equations to evaluate delay and leakage current under the process variation. Using these equations, we discuss the cases of varying leakage current without degrading delay distribution and propose a procedure to reduce the leakage current variations. From the experiments, we show the proposed method effectively reduces the leakage current variation up to 50% at 90 percentile point of the distribution compared with the conventional design approach.

This paper quantitatively analyzes thermal gradient of SoC and proposes a thermal flattening procedure. First, the impact of dominant parameters, such as area occupancy of memory/logic block, power density, and floorplan on thermal gradient are studied quantitatively. Temperature difference is also evaluated from timing and reliability standpoints. Important results obtained here are 1) the maximum temperature difference increases with higher memory area occupancy and 2) the difference is very floorplan sensitive. Then, we propose a procedure to amend thermal gradient. A slight floorplan modification using the proposed procedure improves on-chip thermal gradient significantly.

A method to derive design rules for SSO (Simultaneous Switching Outputs) considering jitter constraint on LSI outputs is proposed. Since conventional design rules do not consider delay change caused by SSO, timing errors have sometimes occurred in output signals especially for a high-speed memory interface which allows very small jitter. A design rule derived by the proposed method includes delay change characteristics of output buffers to consider the jitter constraint. The rule also gives mapping from the jitter constraint to constraint on design parameters such as effective power/ground inductance, number of SSO and drivability of buffers.

In this letter, we discuss the impact of intrinsic error in parasitic capacitance extraction programs which are commonly used in today's SoC design flows. Most of the extraction programs use pattern-matching methods which introduces an improvable error factor due to the pattern interpolation, and an intrinsically inescapable error factor from the difference of boundary conditions in the electro-magnetic field solver. Here, we study impact of the intrinsic error on timing and crosstalk noise estimation. We experimentally show that the resulting delay and noise estimation errors show a scatter which is normally distributed. Values of the standard deviations will help designers consider the intrinsic error compared with other variation factors.

This paper evaluates impact of self-heating in wire interconnection on signal propagation delay in an upcoming 32 nm process technology, using practical physical parameters. This paper examines a 64-bit data transmission model as one of the most heating cases. Experimental results show that the maximum wire temperature increase due to the self-heating appears in the case where the ratio of interconnect delay becomes largest compared to the driver delay. However, even in the most significant case which induces the maximum temperature rise of 11.0, the corresponding increase in the wire resistance is 1.99% and the resulting delay increase is only 1.15%, as for the assumed 32 nm process. A part of the impact reduction of wire self-heating on timing comes from the size-effect of nano-scale wires.