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Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.
Takahiro NAKAMURA
PETRA
Kenichiro YASHIKI
AIO Core
Kenji MIZUTANI
PETRA
Takaaki NEDACHI
PETRA
Junichi FUJIKATA
PETRA
Masatoshi TOKUSHIMA
PETRA
Jun USHIDA
PETRA
Masataka NOGUCHI
PETRA
Daisuke OKAMOTO
PETRA
Yasuyuki SUZUKI
PETRA
Takanori SHIMIZU
PETRA
Koichi TAKEMURA
PETRA
Akio UKITA
PETRA
Yasuhiro IBUSUKI
PETRA
Mitsuru KURIHARA
AIO Core
Keizo KINOSHITA
AIO Core
Tsuyoshi HORIKAWA
AIST
Hiroshi YAMAGUCHI
PETRA
Junichi TSUCHIDA
PETRA
Yasuhiko HAGIHARA
AIO Core
Kazuhiko KURATA
AIO Core
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Takahiro NAKAMURA, Kenichiro YASHIKI, Kenji MIZUTANI, Takaaki NEDACHI, Junichi FUJIKATA, Masatoshi TOKUSHIMA, Jun USHIDA, Masataka NOGUCHI, Daisuke OKAMOTO, Yasuyuki SUZUKI, Takanori SHIMIZU, Koichi TAKEMURA, Akio UKITA, Yasuhiro IBUSUKI, Mitsuru KURIHARA, Keizo KINOSHITA, Tsuyoshi HORIKAWA, Hiroshi YAMAGUCHI, Junichi TSUCHIDA, Yasuhiko HAGIHARA, Kazuhiko KURATA, "Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 4, pp. 333-339, April 2019, doi: 10.1587/transele.2018ODI0005.
Abstract: Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018ODI0005/_p
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@ARTICLE{e102-c_4_333,
author={Takahiro NAKAMURA, Kenichiro YASHIKI, Kenji MIZUTANI, Takaaki NEDACHI, Junichi FUJIKATA, Masatoshi TOKUSHIMA, Jun USHIDA, Masataka NOGUCHI, Daisuke OKAMOTO, Yasuyuki SUZUKI, Takanori SHIMIZU, Koichi TAKEMURA, Akio UKITA, Yasuhiro IBUSUKI, Mitsuru KURIHARA, Keizo KINOSHITA, Tsuyoshi HORIKAWA, Hiroshi YAMAGUCHI, Junichi TSUCHIDA, Yasuhiko HAGIHARA, Kazuhiko KURATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA},
year={2019},
volume={E102-C},
number={4},
pages={333-339},
abstract={Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.},
keywords={},
doi={10.1587/transele.2018ODI0005},
ISSN={1745-1353},
month={April},}
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TY - JOUR
TI - Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA
T2 - IEICE TRANSACTIONS on Electronics
SP - 333
EP - 339
AU - Takahiro NAKAMURA
AU - Kenichiro YASHIKI
AU - Kenji MIZUTANI
AU - Takaaki NEDACHI
AU - Junichi FUJIKATA
AU - Masatoshi TOKUSHIMA
AU - Jun USHIDA
AU - Masataka NOGUCHI
AU - Daisuke OKAMOTO
AU - Yasuyuki SUZUKI
AU - Takanori SHIMIZU
AU - Koichi TAKEMURA
AU - Akio UKITA
AU - Yasuhiro IBUSUKI
AU - Mitsuru KURIHARA
AU - Keizo KINOSHITA
AU - Tsuyoshi HORIKAWA
AU - Hiroshi YAMAGUCHI
AU - Junichi TSUCHIDA
AU - Yasuhiko HAGIHARA
AU - Kazuhiko KURATA
PY - 2019
DO - 10.1587/transele.2018ODI0005
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 2019
AB - Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.
ER -