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Hiroshi TAKAHASHI Shigeshi ABIKO Shintaro MIZUSHIMA Yuji OZAWA Kenichi TASHIRO Shigetoshi MURAMATSU Masahiro FUSUMADA Akemi TODOROKI Youichi TANAKA Masayasu ITOIGAWA Isao MORIOKA Hiroyuki MIZUNO Miki KOJIMA Giovanni NASO Emmanuel EGO Frank CHIRAT
A 100MIPS high speed and low power fixed point Digital Signal Processor (DSP) has been developed applying 0.45µm CMOS TLM technology. The DSP contains a 16-bit32K full CMOS static RAM with a hierarchical low power architecture. The device is a RAM based DSP with a total of 4.2 million transistors and a new low power design and process which enabled an approximate 50% reduction in power as compared to conventional DSPs at 40 MHz. In order to cover very wide application requirements, this DSP is capable of operating at 1.0 V for DSP core and 3.3 V for I/O. This was achieved by new level shifter circuitry to interface with cost effective 3 V external commodity products and confirmed 80% of power reduction at Core VDD=2.0 V, I/O VDD=3.3 V at 40MHz. This paper describes the new features of the high speed and low power DSP.
Hiroyuki MIZUNO Takahiro NAGANO
A novel SRAM cell architecture for sub-1-V high-speed operation is proposed operation is proposed that uses neither low-Vth MOSFET's nor modified cell layout patterns. A source-line, connected to the source terminals of the driver MOSFET's is controlled so that it is negative and floating in the read and write cycles, respectively. This improved the bit-line access time by 1/4-1/2 at supply voltages of 0.5-1.0 V. Limiting the bit-line swing reduces by 1/10 the writing power needed to charge them and allows faster write-recovery, as well. The achievability of low-power 100-MHz operation over a wide range of supply voltages is demonstrated.
Yusuke KANNO Hiroyuki MIZUNO Nobuhiro OODAIRA Yoshihiko YASU Kazumasa YANAGISAWA
A power-aware interconnect circuit design--called µI/O architecture--has been developed to provide low-cost system solutions for System-on-Chip (SoC) and System-in-Package (SiP) technologies. The µI/O architecture provides a common interface throughout the module enabling hierarchical I/O design for SoC and SiP. The hierarchical I/O design allows the driver size to be optimized without increasing design complexity. Moreover, it includes a signal-level converter for integrating wide-voltage-range circuit blocks and a signal wall function for turning off each block independently--without invalid signal transmission--by using an internal power switch.