This paper presents a practical fault model for delay testing, called a multiple-threshold gate-delay fault model, to obtain high quality tests that guarantee the detection of delay faults for various extra-delays. Fault efficiencies for multiple thresholds of the extra-delay are introduced as a coverage metric that describes the quality of tests. Our approach guarantees that each gate-delay fault is tested on the path that is almost the longest one passing through the faulty line by using two-pattern tests with pattern-independent timing. We present the procedures of the path selection, fault simulation, and the test generation, where the path-status graph technique is used as not to rely on the enumeration of paths. Experimental results for benchmark circuits demonstrate that the proposed metric gives useful information that transition fault efficiency cannot, and that the proposed test generation can achieve high fault efficiencies for multiple-threshold gate-delay faults.

This paper presents a new deterministic built-in test scheme using a neighborhood pattern generator (NPG) to guarantee complete fault efficiency with small test-data storage. The NPG as a decoding logic generates both a parent pattern and deterministic child patterns within a small Hamming distance from the parent pattern. A set of test cubes is encoded as a set of seeds for the NPG. The proposed method is practically acceptable because no impact on a circuit under test is required and the design of the NPG does not require the results of test generation. We also describe an efficient seed generation method for the NPG. Experimental results for benchmark circuits demonstrate that the proposed method can significantly reduce the storage requirements when compared with other deterministic built-in test methods.

Repairing embedded memories (e-memories) on an advanced system-on-chip (SoC) product is a key technique used to improve product yield. However, increasing the die area of SoC products equipped with various types of e-memories on the die is an issue. A fuse scheme can be used to resolve this issue. However, several fuse schemes that have been proposed to decrease the die area result in an increased repair time. Therefore, in this paper, we propose a novel fuse scheme that decreases both die area and repair time. Moreover, our approach is applied to a 65 nm SoC product. The results indicate that the proposed fuse scheme effectively decreases the die area and repair time of advanced SoC products.

This letter presents a practical approach for high-quality built-in test using a test pattern generator called neighborhood pattern generator (NPG). NPG is practical mainly because its structure is independent of circuit under test and it can realize high fault coverage not only for stuck-at faults but also for transition faults. Some techniques are also proposed for further improvement in practical applicability of NPG. Experimental results for large industrial circuits illustrate the efficiency of the proposed approach.

This paper presents an acceleration of test points selection for circuits designed by a full-scan based BIST scheme. In order to accelerate the test points selection based on cost minimization, and reflecting random pattern testability, we introduce three techniques, the simultaneous selection of plural test points, the simplified selection of test points by the cost reduction factor, and the reduction of the number of test point candidates. We implement a program based on the proposed techniques and evaluate its efficiency experimentally using large scale circuits (26 k-420 k gates).

To reduce the manufacturing cost of SoCs with many embedded SRAMs, we propose a scheme to reduce the area per good die for the SoC memory built-in self-test (MBIST). We first propose BIST hardware overhead reduction by application of an encoder-based comparator. For the repair of a faulty SRAM module with 2-D redundancy, we propose spare assignement algorithm. Based on an existing range-cheking-first algorithm (RCFA), we propose assign-all-row-RCFA (A-RCFA) which assign unused spare rows to faulty ones, in order to suppress the degradation of repair rate due to compressed fail location information output from the encoder-based comparator. Then, considering that an SoC has many SRAM modules, we propose a heuristic algorithm based on iterative improvement algorithm (IIA), which determines whether each SRAM should have a spare row or not, in order to minimize area per a good die. Experimental results on practical scale benchmark SoCs with more than 1,000 SRAM modules indicate that encoder-based comparators reduce hardware overhead by about 50% compared to traditional ones, and that combining the IIA-based algorithm for determining redundancy architecture with the encoder-based comparator effectively reduces the area per good die.