We have developed a V-band monolithic HEMT amplifier with single positive power supply. The amplifier used two types of RF grounds for coplanar waveguides (CPW) as transmission lines. One RF ground has a voltage of 0 V at DC, and the other RF ground has a voltage of more than 0 V at DC. A prototype of the monolithic amplifier was fabricated. The amplifier had a gain of 21.0 dB, a Rollett stability factor K of 2.35, an input VSWR of 1.82, and an output VSWR of 2.14 at 59.5 GHz.

An amplitude shift keying transmitter and receiver chipset with low power consumption using 40nm CMOS technology for wireless communication systems is described, in which a maximum data rate of 10Gbps and power consumption of 98.4mW are obtained with a carrier frequency of 135GHz. A simple circuit and a modulation method to reduce power consumption are selected for the chipsets. To realize multi-gigabit wireless communication, the receiver is designed considering the group delay optimization. In the receiver design, the low-noise amplifier and detector are designed considering the total optimization of the gain and group delay in the millimeter-wave modulated signal region.

A 60-GHz phase-locked loop (PLL) with an inductor-less prescaler is fabricated in a 90-nm CMOS process. The inductor-less prescaler has a smaller chip area than previously reported ones. The PLL operates from 61 to 63 GHz and consumes 78 mW from a 1.2 V supply. The phase noise at 100 kHz and 1 MHz offset from carrier are -72 and -80 dBc/Hz, respectively. The prescaler occupies 8040 µm2. The active area of the PLL is 0.31 mm2.

A four-stage power amplifier (PA) with 10 GHz 1-dB bandwidth (56–66 GHz) is presented. The broadband performance is achieved owing to π-section interstage matching network. Three-stage-current-reuse topology is proposed to enhance efficiency. The amplifier has been fabricated in 65 nm digital CMOS. 18 dB power gain and 9.6 dBm saturated power (Psat) are achieved at 60 GHz. The PA consumes current of 50 mA at 1.2 V supply voltage, and has a peak power-added efficiency (PAE) of 13.6%. To the best of the authors' knowledge, this work shows the highest PAE among the reported CMOS PAs that covers the worldwide 9 GHz ISM millimeter-wave band with less-than-1.2 V supply voltage.

A GaAs HEMT with flip-chip interconnections using a suitable transmission line has been developed. The underfill resin, which was not used for the conventional flip-chip interconnection structure, was adopted between GaAs chip and assembly substrate to obtain high reliability. The underfill resin is effective in relaxing the thermal stress between the chip and the substrate and in encapsulating the chip. There are various possible ground current paths for the GaAs chip in the structure with flip-chip interconnections. An actual ground current path is determined depending on the transmission line type for the chip. For an active device, it is important to utilize an assembly structure capable of realizing excellent high-frequency characteristics. In addition, each transmission line for the chip has its own transmission characterizations such as characteristic impedance. Therefore, it is necessary to choose a suitable transmission line for the chip. We evaluated the high-frequency characteristics of the HEMT test element groups (TEGs) with flip-chip interconnection for three types of transmission lines: with a microstrip line (MSL), with a coplanar waveguide (CPW), and with an inverted microstrip line (IMSL). All three types of TEGs had similar values of a maximum available power gain (MAG) at 30 GHz. However, it was found that the IMSL-type TEG, which had superior characteristics in high-frequency ranges of more than 30 GHz, is the most suitable type. The IMSL-type TEG had an MAG of 10.02 dB and a Rollett stability factor K of 1.20 at 30 GHz.

A 60-GHz-band monolithic HEMT amplifier for which BCB thin film layers are adopted on GaAs substrate has been developed. The MMIC utilized a thin film microstrip line for the bias circuit and a coplanar waveguide for the RF circuit. The coplanar waveguide has the advantage of low loss, whereas the thin film microstrip line has the advantage of small size. Two different types of transmission lines were selected to coexist in the monolithic amplifier. As a result, the MMIC achieved high gain over a wider frequency range at a small size. This MMIC had a gain of over 15 dB in a frequency bandwidth of 11 GHz. In particular, the high-frequency characteristics of the transmission lines and the HEMTs were evaluated in detail for the conventional MMIC structure and the new MMIC structure. It was confirmed that this newly developed MMIC using BCB thin film layers is attractive for millimeter-wave applications.

The authors have developed V-band high electron mobility transistor (HEMT) MMICs adopting benzo-cyclo-butene (BCB) thin-film layers on GaAs substrates. Since the BCB thin-film layers, which can change the thickness of arbitrary parts on a circuit, are used for these MMICs, both a thin-film microstrip (TFMS) line, offering the advantages of great flexibility in layout and small size, and a coplanar waveguide (CPW), offering the advantage of low loss, can be used according to the purpose of the MMIC. Here we introduce the four types of V-band MMICs that we fabricated: low noise amplifier (LNA), mixer, voltage controlled oscillator (VCO), and power amplifier (PA). The optimum transmission lines were chosen from the TFMS line and the CPW for these MMICs. Miniaturization of the LNA MMIC and the mixer MMIC were attained by adopting the TFMS line, whereas adoption of the CPW enabled the VCO MMIC to achieve high performance. These results indicate that it is important to choose the optimum transmission line according to the purpose of the circuit function for each MMIC. It was confirmed that these newly developed MMICs using the BCB thin-film dielectric layers are attractive for millimeter-wave applications.

A K-band monolithic driver amplifier with equalizer circuits has been developed. It is necessary for the equalizer circuit to be low losses in the high-frequency range and for its S21 values to increase as the operation frequency increases. In order to realize these features, it is desirable for the equalizer to have element location considering high-frequency current flows. In this paper, we present a novel low-loss, high-pass equalizer circuit layout that has superior characteristics in the high-frequency range. We used a high-pass filter as the equalizer circuit and performed a detailed evaluation of the high-frequency characteristics of the filter circuit test element groups (TEGs) for three layout types. It was found that the best filter circuit layout for the three types consisted of two capacitors and one resistor, placed with parallel connections. The resistor is located at the center and the capacitors are located at both sides of the resistor. This filter is called the CRC-type in this paper. An MMIC test sample, a K-band monolithic amplifier with CRC-type filter circuits, was fabricated. The amplifier had a gain of 21.6 dB, a Rollett stability factor K of 28.9, an input VSWR of 1.63, an output VSWR of 1.92, and a 1 dB compressed output power of 22.6 dBm at 26 GHz.