This paper describes two circuit techniques useful for the design of high density and high speed low cost double data rate memories. One is a highly flexible row and column redundancy circuit which allows the division of flexible row redundancy unit into multiple column redundancy unit for higher flexibility, with a new test mode circuit which enables the use of the finer pitch laser fuse. Another is a compact read data path which allows the smooth data flow without wait time in the high frequency operation with less area penalty. These circuit techniques achieved the compact chip size with the cell efficiency of 60.6% and the high bandwidth of 400 MHz operation with CL=2.5.

Embedded system approaches to edge computing in IoT implementations are proposed and discussed. Rationales of edge computing and essential core capabilities for IoT data supply innovation are identified. Then, innovative roles and development of MCU and embedded flash memory are illustrated by technology and applications, expanding from CPS to big-data and nomadic/autonomous elements of IoT requirements. Conclusively, a technology roadmap construction specific to IoT is proposed.