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Naoya WATANABE Fukashi MORISHITA Yasuhiko TAITO Akira YAMAZAKI Tetsushi TANIZAKI Katsumi DOSAKA Yoshikazu MOROOKA Futoshi IGAUE Katsuya FURUE Yoshihiro NAGURA Tatsunori KOMOIKE Toshinori MORIHARA Atsushi HACHISUKA Kazutami ARIMOTO Hideyuki OZAKI
This paper describes an Embedded DRAM Hybrid Macro, which supports various memory specifications. The eDRAM module generator with Hybrid Macro provides more than 120,000 eDRAM configurations. This eDRAM includes a new architecture called Auto Signal Management (ASM) architecture, which automatically adjusts the timing of the control signals for various eDRAM configurations, and reduces the design Turn Around Time. An Enhanced-on-chip Tester performs the maximum 512b I/O pass/fail simultaneous judgments and the real time repair analysis. The eDRAM testing time is reduced to about 1/64 of the time required using the conventional technique. A test chip is fabricated using a 0.18 µm 4-metal embedded DRAM technology, which utilizes the triple-well, dual-Tox, and Co salicide process technologies. This chip achieves a wide voltage range operation of 1.2 V at 100 MHz to 1.8 V at 200 MHz.
Takashi KONO Yasuhiko TAITO Hideto HIDAKA
Embedded system approaches to edge computing in IoT implementations are proposed and discussed. Rationales of edge computing and essential core capabilities for IoT data supply innovation are identified. Then, innovative roles and development of MCU and embedded flash memory are illustrated by technology and applications, expanding from CPS to big-data and nomadic/autonomous elements of IoT requirements. Conclusively, a technology roadmap construction specific to IoT is proposed.
Takeshi FUJINO Akira YAMAZAKI Yasuhiko TAITO Mitsuya KINOSHITA Fukashi MORISHITA Teruhiko AMANO Masaru HARAGUCHI Makoto HATAKENAKA Atsushi AMO Atsushi HACHISUKA Kazutami ARIMOTO Hideyuki OZAKI
A low power 16 Mb embedded DRAM (eDRAM) macro is fabricated using 0.15 µm logic -based embedded DRAM process technology. A 0.5 µm2 CUB (