In the realization of Gigabit scale DRAM's, one of the most serious problems is how to reduce the array power consumption without degradation of the operating margin and other characteristics. This paper proposes a new array architecturte called cell-plate-line/bit-line complementary sensing(CBCS) architecture which realizes drastic array power reduction for both read/write operations and refersh operations, and develops a large readout voltage difference on the bit-line and cell-plate-line. For read/write operations, the array power reduces to only 0.2%, and for refresh operations becomes 36%. This architecture requires no unique process technology and no additional chip area. Using a test device with a 64-Mb DRAM process, the basic operation has been successfully demonstrated. This new memory core diesign realizes a high-density DRAM suitable for the 1-Gb level and beyond with power consumption significantly reduced.

This paper describes an approach to a low power and high speed data transfer scheme in the internal data bus of AS-Memory which has ASIC circuitry and memory array. Pulse width modulation, which is operated asynchronously, is applied to the wide internal data bus. The automatic gain controlled amplifier which amplifies many small signals from the memory array is also newly developed to achieve a fast data output. Applying this architecture to AS-Memory, the area and power consumption of the internal data bus interface can be reduced to 25% and 36%, respectively.

The voltage margin of an embedded DRAM's sense operation has been shrinking with the scaling of process technology. A method to estimate this margin would be a key to optimizing the memory array configuration and the size of the sense transistor. In this paper, the voltage margin of the sense operation is theoretically analyzed. The accuracy of the proposed voltage margin model was confirmed on a 0.13-µm eDRAM test chip, and the results of calculation were generally in agreement with the measured results.

A 23.3 mm2 32 Mb embedded DRAM (eDRAM) macro has been fabricated using 0.18 µm triple-well 4-metal embedded DRAM process technology to realize an accelerated 3-D graphics controller. The array architecture, using a dual-port sense amplifier, achieves the column access latency of two cycles at 222 MHz and a peak data rate of 14.2 4 GB/s at 4 macros. The process cost has been kept low by using VT-MOS circuit technology and taking advantage of a characteristic of dual-gate oxide process technology. A tRAC of 11.6 ns at 2.0 V is achieved using a 'pre-detect redundancy' circuit.

This paper proposes a new test mode circuit which enables the massively parallel test of DRAMs with a standard LSI tester with little chip area penalty. It is useful to enhance the test throughput that can't be improved by the conventional multi-bit test mode. And a new redundancy circuit that detects and repairs the short circuit failures in the memory cell array is also proposed. It greatly improves the yield of super low power 256 Mbit DRAMs.

This paper describes an Embedded DRAM Hybrid Macro, which supports various memory specifications. The eDRAM module generator with Hybrid Macro provides more than 120,000 eDRAM configurations. This eDRAM includes a new architecture called Auto Signal Management (ASM) architecture, which automatically adjusts the timing of the control signals for various eDRAM configurations, and reduces the design Turn Around Time. An Enhanced-on-chip Tester performs the maximum 512b I/O pass/fail simultaneous judgments and the real time repair analysis. The eDRAM testing time is reduced to about 1/64 of the time required using the conventional technique. A test chip is fabricated using a 0.18 µm 4-metal embedded DRAM technology, which utilizes the triple-well, dual-Tox, and Co salicide process technologies. This chip achieves a wide voltage range operation of 1.2 V at 100 MHz to 1.8 V at 200 MHz.

New circuit techniques were proposed to realize a high-density and high-performance content addressable memory (CAM). A dynamic register which functions as a status flag, and some logic circuits are organically combined and flexibly perform complex search operations, despite the compact layout area. Any kind of logic operations for the search results, that are AND, OR, INVERT, and the combinations of them, can be implemented in every word simultaneously. These circuits are implemented in an experimental 288 kbit dynamic CAM using 0.8 µm CMOS process technology. We consider these techniques to be indispensable for high-density and high-performance dynamic CAM.

An efficient back-bias (Vbb) generator with a newly introduced hybrid pumping circuit (HPC) is described. This system attains a Vbb level of 1.44 V at Vcc1.5 V, compared to a conventional system in which Vbb only reaches 0.6 V. HPC can pump without the threshold voltage (Vth) loss that conventional systems suffer. HPC is indispensable for 1.5-V DRAM's, because a Vbb level lower than 1.0 V is necessary to meet the limitations of the Vth of the access transistor. HPC uses one NMOS and one PMOS pumping transistor. By adopting a triple-well structure at the pumping circuit area, the NMOS can be employed as a pumping transistor without minority carrier injection.

A novel body potential-controlling technique for floating SOI CMOS circuits is proposed and verified in this study. High-speed operation is realized with a small chip size by using body-floating SOI transistors. The use of this technique allows the threshold voltage of the body-floating transistors to be varied transitionally. Therefore, the standby current of SOI CMOS logic is reduced to less than 1/50th of that required by the non-controlled operation of the body potential, and the logic operates at a high speed during the active period. There is no speed penalty for the recovery operation from the standby mode. This technique supports sub-1 V operation, which will be required by future battery-operated devices with wide-range covering.

This paper proposes a low voltage operation technique for a voltagedown converter(VDC) using a mixed-mode VDC(MM-VDC), that combines an analog VDC and a digital VDC, and provides high frequency application using an impedance adjustment circuitry (LAC). The MM-VDC operates with a small response delay and a large supply current. Moreover, the IAC is adopted to the MM-VDC for wide range frequency operation under low voltage conditions. The IAC can change the supply current capability in accordance with the load operation frequency to avoid the overshoot and undershoot problpems caused by the unmatched supply current. A 64 Mb-DRAM test device operated with the MM-VDC achieves well-controlled internal voltage (VCI) level and achieves high frequency operation. These systems, the MM-VDC and the ILVDC, can be applicable for both low voltage and high frequency operation.

This paper proposes a fully self-timing data-bus (FSD) architecture which includes a dual data-bus driven by the read-out data itself and a complementary output differential (COD) amplifier. The proposed COD amplifier achieves a high voltage gain and a high speed data transfer with low power consumption. The read-out data is transmitted from the COD amplifier to the output terminal without the timing control caused by the fluctuation of the device parameters. Therefore the proposed FSD architecture eliminates the timing delay and achieves a timing-free data transfer even in DRAMs with a small signal level at the sense amplifier and the data line. Applying this architecture to a 64-Mb DRAM, a fast column address access time of 16 ns and a RAS access time of 32 ns have been achieved.

A low power 16 Mb embedded DRAM (eDRAM) macro is fabricated using 0.15 µm logic -based embedded DRAM process technology. A 0.5 µm2 CUB (apacitor nder it-line) DRAM cell is newly developed for this process. Novel start-up and dynamic fuse-data loading circuit are developed to realize easy customization of memory capacities with minimum area penalty. A new write-mask control circuit using write-gate sense-amplifier is adopted in order to apply column shift-redundancy circuit. Various low power technologies including unique "non-precharge read-data bus" method are applied. In the test-chip adopting new process-technology and three original circuit-design techniques, random column operation of 166 MHz and data retention power of 123 µW are demonstrated at 1.5 V power supply.

This paper describes DRAM array driving techniques and the parameter scaling techniques for a low voltage operation using the boosted sense ground (BSG) scheme and further improved methods. A temperature compensation and adjustable internal voltage levels maintain a small subthreshold leakage current of a memory cell transistor (MC-Tr), and a distributed BSG (DBSG) scheme and a column decoded sensing (CDS) scheme achieve the effective scaling. These schemes can set the DRAM array free from a leakage current problem and free them from an influence of temperature variations. Therefore, parameters for the MC-Tr, threshold voltage (Vth), and the boosted voltage for the gate bias can be scaled down, and it is possible to determine the Vth of the MC-Tr easy (0.45 V at K = 0.4) for the satisfaction of the small leakage current, for the high speed and stable operation, and for the high reliability (VPP is below 2 VCC). They are applicable to the subquarter micron DRAM's of 256 Mb and more.

This paper describes a bitline control circuit and redundancy technique for high-density dynamic content addressable memories (CAMs). The proposed bitline control circuit can efficiently manage a dynamic CAM cell accompanied by complex operations; that is, a refresh operation, a masked search operation, and partial writing, in addition to normal read/write/search operations. By adding a small supplementary circuit to the bitline control circuit, a circuit scheme with redundancy which prevents disabled column circuits from affecting a match operation can also be obtained. These circuit technologies achieve higher-density dynamic CAMs than conventional static CAMs. These technologies have been successfully applied to a 288-kbit CAM with a typical cycle time of 150 ns.