This paper describes an Embedded DRAM Hybrid Macro, which supports various memory specifications. The eDRAM module generator with Hybrid Macro provides more than 120,000 eDRAM configurations. This eDRAM includes a new architecture called Auto Signal Management (ASM) architecture, which automatically adjusts the timing of the control signals for various eDRAM configurations, and reduces the design Turn Around Time. An Enhanced-on-chip Tester performs the maximum 512b I/O pass/fail simultaneous judgments and the real time repair analysis. The eDRAM testing time is reduced to about 1/64 of the time required using the conventional technique. A test chip is fabricated using a 0.18 µm 4-metal embedded DRAM technology, which utilizes the triple-well, dual-Tox, and Co salicide process technologies. This chip achieves a wide voltage range operation of 1.2 V at 100 MHz to 1.8 V at 200 MHz.

A novel body potential-controlling technique for floating SOI CMOS circuits is proposed and verified in this study. High-speed operation is realized with a small chip size by using body-floating SOI transistors. The use of this technique allows the threshold voltage of the body-floating transistors to be varied transitionally. Therefore, the standby current of SOI CMOS logic is reduced to less than 1/50th of that required by the non-controlled operation of the body potential, and the logic operates at a high speed during the active period. There is no speed penalty for the recovery operation from the standby mode. This technique supports sub-1 V operation, which will be required by future battery-operated devices with wide-range covering.

A low power 16 Mb embedded DRAM (eDRAM) macro is fabricated using 0.15 µm logic -based embedded DRAM process technology. A 0.5 µm2 CUB (apacitor nder it-line) DRAM cell is newly developed for this process. Novel start-up and dynamic fuse-data loading circuit are developed to realize easy customization of memory capacities with minimum area penalty. A new write-mask control circuit using write-gate sense-amplifier is adopted in order to apply column shift-redundancy circuit. Various low power technologies including unique "non-precharge read-data bus" method are applied. In the test-chip adopting new process-technology and three original circuit-design techniques, random column operation of 166 MHz and data retention power of 123 µW are demonstrated at 1.5 V power supply.

We propose a novel capacitorless twin-transistor random access memory (TTRAM). The 2 Mb test device has been fabricated on 130 nm SOI-CMOS process. We demonstrate the TTRAM cell has two data-storage states and confirm the data retention time of 100 ms at 80. TTRAM process is compatible with the conventional SOI-CMOS and never requires any additional processes. A 6.1 ns row-access time is achieved and 250 MHz operation can be realized by using 2 bank 8 b-burst mode.

Adaptive voltage management (AVM) scheme is proposed for worst-caseless lower voltage SoC design. The AVM scheme detects the temperature accurately by using two oscillators with different temperature characteristics, and sets supply voltage most suitable with a table look-up method corresponding to the process variation. Also, the AVM can supply the stable voltage with a local shift type regulator even at lower voltage. Thereby, this supply-voltage control system considering PVT variations can control the internal voltage corresponding to process and temperature variations and can realize a wide-operating-margin, DFM function for low voltage SoC. The experimental chip is fabricated on a 90 nm CMOS process, and it was confirmed that the proposed architecture controls the voltage accurately and has a wide operating margin at a lower voltage.

SOI DRAM's are candidates for giga-bit scale DRAM's due to the inherent features of SOI structure, and are also desired to be used as low-voltage memories which will be used in portable systems in the forthcoming multimedia era. However, some drawbacks are also anticipated owing to floating substrate effects. In this report, the advantages and problems concerning SOI DRAM's were reconsidered by evaluation of our test devices and also by analysis with device and circuit simulators for their future prospects. The following advantages of SOI DRAM's were verified. Low-voltage operation, active current reduction and speed gain were obtained by the reduced junction capacitance and the back-gate-bias effect. Static refresh characteristics were improved due to the reduced junction area. Soft error immunity was improved greatly by the complete isolation of the active region when the body potential is fixed. The problems that need to be resolved are closely related to the floating substrate effect. The soft error immunity in a floating body condition and the dynamic refresh characteristics were degraded by the instability of the floating body potential. Process and device approaches such as the field-shield-body-fixing method as well as circuit approaches like the BSG scheme are required to eliminate the floating substrate effects. From these investigations it can be said that a low-voltage DRAM with a current design rule would be possible if we pay close attention to the floating-substrate-related issues by optimizing various process/device and circuit techniques. With further development of the technology to suppress the floating substrate effects, it will be possible to develop simple and low-cost giga-bit level SOI DRAM's which use the SOI's inherent features to the full.

It is confirmed by simulation that SOI-DRAMs can be operated at high speed by using the floating body structures. Several floating body effects are analyzed. It is described that the dynamic retention characteristics are not dominated by capacitive coupling and hole redistribution. And it is described that those characteristics are determined by the leakage current in the small pn-junction region of the floating body. Reducing pn junction leakage current is important for realizing a long retention time. If the pn junction leakage is suppressed to 10-18 A/µm, a dynamic retention time of 520 sec at a VBSG of 0.5 V can be achieved at 27. On those conditions, the refresh current of SOI-DRAMs is reduced by 54% compared with bulk-Si DRAMs.

SOI (Silicon On Insulator) transistors have certain problems due to the floating body. These problems become remarkable in the memory cell transistors of DRAMs. We propose a new refresh function and circuits for SOI DRAMs. And we obtained the result that this refresh function removed the injected hole from the body region and gave stable body potential by the device simulation. Therefore we can realize the long data retention characteristics for SOI DRAMs without an increase of the memory cell area or an additional refresh operation.

The proposed built-in Power-Cut scheme intended for a wide range of dynamically data retaining memories including embedded SoC memories enables the system-level power management to handle SoC on which the several high density and low voltage scalable memory macros are embedded. This scheme handles the deep standby mode in which the SoC memories keep the stored data in the ultra low standby current, and quick recovery to the normal operation mode and precise power management are realized, in addition to the conventional full power-off mode in which the SoC memories stay in the negligibly low standby current but allow the stored data to disappear. The unique feature of the statically or dynamically changeable internal voltages of memory in the deep standby mode brings about much further reduction of the standby current. This scheme will contribute to the further lowering power of the mobile applications requiring larger memory capacity embedded SoC memories.

This parer describes a silicon on insulator(SOI) DRAM which has a body bias controlling technique for high-speed circuit operation and a new type of redundancy for low standby power operation, aimed at high yield. The body bias controlling technique contributes to super-body synchronous sensing and body-bias controlled logic. The super-body synchronous sensing achieves 3.0 ns faster sensing than body synchronous sensing and the body-bias controlled logic realizes 8.0 ns faster peripheral logic operation compared with a conventional logic scheme, at 1.5 V in a 4 Gb-level SOI DRAM. The body-bias controlled logic also realizes a body-bias change current reduction of 1/20, compared with a bulk well-structure. A new type of redundancy that overcomes the standby current failure resulting from a wordline-bitline Short is also discussed in respect of yield and area penalty.

This paper proposes novel test techniques for high accuracy measurement of ADCs and a ramp generator on a CMOS image sensor (CIS) chip. The test circuit for the ADCs has a dual path and has an ability of multi-functional fine pattern generator that can define any input for each column to evaluate CIS specific characteristics electrically. The test circuit for the ramp generator can realize an on-chip current cell test and reject the current cell failure within 1LSB accuracy. We fabricated the test sensor using 55nm CIS process and measured the IP characteristics. Measured results show INL of 14.6LSB, crosstalk of 14.9LSB and column interference noise of 5.4LSB. These measured results agree with the designed values. By using this technique, we confirmed the accurate ADC measurement can be realized without being affected by the ambiguity of the optical input.

This paper describes a novel TCAM architecture designed for enhancing the soft-error immunity. An associated embedded DRAM and ECC circuits are placed next to TCAM macro to implement a unique methodology of recovering upset bits due to soft errors. The proposed configuration allows an improvement of soft-error immunity by 6 orders of magnitude compared with the conventional TCAM. We also propose a novel testing methodology of the soft-error rate with a fast parallel multi-bit test. In addition, the proposed architecture resolves the critical problem of the look-up table maintenance of TCAM. The design techniques reported in this paper are especially attractive for realizing soft-error immune, high-performance TCAM chips.

The advanced-DFM (Design For Manufacturability) RAM provides the solution for the limitation of SRAM voltage scaling down and the countermeasure of the process fluctuations. The characteristics of this RAM are the voltage scalability (@0.6 V operation) with wide operating margin and the reliability of long data retention time. The memory cell consists of 2 Cell/bit with the complementary dynamic memory operation and has the 1 Cell/bit test mode for the accelerated screening against the marginal cells. The GND bitline pre-charge sensing scheme and SSW (Sense Synchronized Write) peripheral circuit technologies are also adopted for the low voltage and DFV (Dynamic Frequency and Voltage) controllable SoC which will be strongly required from the many kinds of applications. This RAM supports the DFM functions with both good cell/bit for advanced process technologies and the voltage scalable SoC memory platform.

The voltage margin of an embedded DRAM's sense operation has been shrinking with the scaling of process technology. A method to estimate this margin would be a key to optimizing the memory array configuration and the size of the sense transistor. In this paper, the voltage margin of the sense operation is theoretically analyzed. The accuracy of the proposed voltage margin model was confirmed on a 0.13-µm eDRAM test chip, and the results of calculation were generally in agreement with the measured results.

A 23.3 mm2 32 Mb embedded DRAM (eDRAM) macro has been fabricated using 0.18 µm triple-well 4-metal embedded DRAM process technology to realize an accelerated 3-D graphics controller. The array architecture, using a dual-port sense amplifier, achieves the column access latency of two cycles at 222 MHz and a peak data rate of 14.2 4 GB/s at 4 macros. The process cost has been kept low by using VT-MOS circuit technology and taking advantage of a characteristic of dual-gate oxide process technology. A tRAC of 11.6 ns at 2.0 V is achieved using a 'pre-detect redundancy' circuit.