The voltage margin of an embedded DRAM's sense operation has been shrinking with the scaling of process technology. A method to estimate this margin would be a key to optimizing the memory array configuration and the size of the sense transistor. In this paper, the voltage margin of the sense operation is theoretically analyzed. The accuracy of the proposed voltage margin model was confirmed on a 0.13-µm eDRAM test chip, and the results of calculation were generally in agreement with the measured results.

A low power 16 Mb embedded DRAM (eDRAM) macro is fabricated using 0.15 µm logic -based embedded DRAM process technology. A 0.5 µm2 CUB (apacitor nder it-line) DRAM cell is newly developed for this process. Novel start-up and dynamic fuse-data loading circuit are developed to realize easy customization of memory capacities with minimum area penalty. A new write-mask control circuit using write-gate sense-amplifier is adopted in order to apply column shift-redundancy circuit. Various low power technologies including unique "non-precharge read-data bus" method are applied. In the test-chip adopting new process-technology and three original circuit-design techniques, random column operation of 166 MHz and data retention power of 123 µW are demonstrated at 1.5 V power supply.