An open/folded bit-line (BL) arrangement for scaled DRAM's is proposed. This BL arrangement offers small die size and good array noise immunity. In this arrangement, one BL of an open BL pair is placed in between a folded BL pair, and the sense amplifiers (SA's) for open BL's and those for folded BL's are placed alternately between the memory arrays. This arrangement features a small 6F2 memory cell where F is the device feature size, and a relaxed SA pitch of 6F. The die size of a 64-Mb DRAM can be reduced to 81.6% compared with the one using the conventional folded BL arrangement. The BL-BL coupling noise is reduced to one-half of that of the conventional folded BL arrangement, thanks to the shield effect. Two new circuit techniques, 1) a multiplexer for connecting BL's to SA's, and 2) a binary-to-ternary code converter for the multiplexer have been developed to realize the new BL arrangement.

An ultra low voltage CMOS pass-gate logic using body-bias controlled SOI MOSFETs has been developed. The logic is composed of gate-body connected SOI pass-gates and a CMOS buffer with the body-bias controlled by the complementary double-rail input. The full-adder using the proposed logic improved the lowest operation voltage by 27%, compared with the SOI CPL (Complementary Pass-Gate Logic). For a 16 16 bit multiplier, the power-delay product achieved 70 pJ (including 50 pF I/O) at 0.5 V power supply, which was more than 1 order of magnitude improvement over the bulk CPL.

A Unique word-line voltage control method for the 64-Mb DRAM and beyond, which realizes a constant lifetime for thin gate oxide, is proposed. This method controls word-line voltage and compensates reliability degradation in the thin gate oxide for cell-transfer transistors. It keeps constant time-dependent dielectric breakdown (TDDB) lifetime, under any conditions concerning gate oxide thickness fluctuation, temperature variation, and supply voltage variation. This method was successfully implemented in a 64-Mb DRAM to realize high reliability. This chip achieved a 105 times reliability improvement, or a 0.3 1.8-V larger word-line voltage margin to write ONE data into the cell.

A new memory cell arrangement for a gigabit-scale NAND DRAM is proposed. Although the conventional NAND DRAM in which memory cells are connected in series realizes the small die size, it faces a crucial array noise problem in the 1 gigabit generation and beyond because of its inherent noise of the open bitline arrangement. By introducing the new cell arrangement to a NAND DRAM, the folded bitline scheme is realized, resulting in good noise immunity. The basic operation of the proposed folded bitline scheme was successfully verified using the 64 kbit test chip. The die size of the proposed NAND DRAM with the folded bitline scheme (F-NAND DRAM) at the 1 Gbit generation is reduced to 63% of that of the conventional 1 Gbit DRAM with the folded bitline scheme, assuming the bitlines and the wordlines are fabricated with the same pitch. The new 4/4 bitline grouping scheme in which cell data are read out to four neighboring bitlines is also introduced to reduce the bitline-to-bitline coupling noise to half of that of the conventional folded bitline scheme. The array noise of the proposed F-NAND DRAM with the 4/4 bitline grouping scheme at 1 Gbit generation is reduced to 10% of the read-out signal, while that of the conventional NAND DRAM with open bitline scheme is 29%, and that of the conventional DRAM with the folded bitline scheme is 22%.

This paper proposes a small 1/4Vcc bit-line swing scheme and a related sense amplifier scheme for low power 1 V operating DRAM. Using the proposed small bit-line swing scheme, the stress bias of memory cell transistor and capacitor is reduced to half that of the conventional DRAM, resulting in improvement of device reliability. The proposed sense amplifier scheme achieves high speed and stable sensing/restoring operation at 250mV bit-line swing, which is much smaller than threshold voltage. The proposed scheme reduces the total power dissipation of bit-line sensing/restoring operation to 40% of the conventional one. This paper also proposes a small 4F2 size memory cell and a new twisted bit-line scheme. The array noise is reduced to 8.6% of the conventional DRAM.

The module-wise dynamic voltage and frequency scaling (MDVFS) scheme is applied to a single-chip H.264/MPEG-4 audio/visual codec LSI. The power consumption of the target module with controlled supply voltage and frequency is reduced by 40% in comparison with the operation without voltage or frequency scaling. The consumed power of the chip is 63 mW in decoding QVGA H.264 video at 15 fps and MPEG-4 AAC LC audio simultaneously. This LSI keep operating continuously even during the voltage transition of the target module by introducing the newly developed dynamic de-skewing system (DDS) which watches and control the clock edge of the target module.

This paper describes the new α-particle induced soft error mechanism, the Minority Carrier Outflow (MCO) effect, which may seriously affect the reliability of the scaled DRAMs with three dimensional capacitors. The MCO chargge increases as the device size miniaturizes because of the three dimensional capacitor effect as below. As the device scales down, the storage node volume decreases which results in the higher minority carrier density in the storage node and larger outflow charge. Also as the device plan view miniaturizes, the stack capacitor height or trench depth does not scales down or even increases to keep the storage node capacitance, therefore the initially generated minority carrier becomes larger. A simple analytical MCO model is introduced to evaluate the MCO effect quantitatively. The model agrees well with the three dimensional device simulation. The MCO model predicts that the life time of the minority carrier in the storage node strongly affects the MCO charge, however, even when the life time is as small as the order of 100 ps, the MCO effect can be the major soft error mechanism.

New gate logics, standby/active mode logic and , for future 1 G/4 Gb DRAM's and battery operated memories are proposed. The circuits realize sub-1-V supply voltage operation with a small 1-µA standby subthreshold leakage current, by allowing 1 mA leakage in the active cycle. Logic is composed of logic gates using dual threshold voltate (Vt) transistors, and it can achieve low standby leakage by adopting high Vt transistors only to transistors which cause a standby leakage current. Logic uses dual supply voltage lines, and reduces the standby leakage by controlling the supply voltage of transistors dissipating a standby leakage current. The gate delay of logic is reduced by 30-37% at the supply voltage of 1.5-1.0 V, and the gate delay of logic is reduced by 40-85% at the supply voltage of 1.5-0.8 V, as compared to that of the conventional CMOS logic.