A method to detect open node defects that cannot be detected by the conventional IDDQ test method has previously been proposed employing a sinusoidal wave superposed on the DC supply voltage. The present paper proposes a strategy to improve the detectability of the test method by means of frequency analysis of the supply current. In this strategy, defects are detected by determining whether secondary harmonics of the sinusoidal wave exist in the supply current. The effectiveness of the method is confirmed by experiments on two CMOS NAND gate packages (SSIs).

This paper presents a new built-in current sensor (BICS) that detects defects using the current testing technique in CMOS integrated circuits. The proposed circuit is a negligible impact on the performance of the circuit under test (CUT). In addition, no extra power dissipation and high-speed fault detection are achieved. It can be applicable in deep sub-micron process. The area overhead of the BICS versus the entire chip is about 9.2%. The chip was fabricated with Hynix 0.35 µm standard CMOS technology.

A novel concurrent core test approach is proposed to reduce the test cost of SOC. Prior to test, the test sets corresponding to cores under test (CUT) are merged by using the proposed merging algorithm to obtain a minimum merged test set. During test, the proposed scan tree architecture is employed to support the concurrent core test using the merged test set. The approach achieves concurrent core test with one scan input and low hardware overhead. Moreover, the approach does not need any additional test generation, and it can be used in conjunction with general compression/decompression techniques to further reduce test cost. Experimental results for ISCAS 89 benchmarks have proven the efficiency of the proposed approach.

In this paper, a test method is proposed to detect lead opens in CMOS LSIs. The test method is based on supply current which flows when test input vectors and AC electric field are provided from the outside of the ICs. Also, an application method of the test input vectors is proposed in this paper. It is shown experimentally that lead opens of SSIs and LSIs will be detected by providing each of the test input vectors per the period of AC electric field applied.

This paper proposes a new supply current test method for detecting floating gate defects in CMOS ICs. In the method, unusual increase of the supply current caused by defects is promoted by superposing an AC component on the DC power supply. Feasibility of the test is examined by some experiments on four DUTs with an intentionally caused defect. The results showed that our method could detect clearly all the defects, one of which may be detected by neither any functional logic test nor any conventional supply current test.

In this paper, test time reduction for IDDQ testing is discussed. Although IDDQ testing is known to be effective to detect faults in CMOS circuit, test time of IDDQ testing is larger than that of logic testing since supply current is measured after a circuit is in its quiescent state. It is shown by simulation that test time of IDDQ test mostly depends on switching current. A procedure to modify test vectors and a procedure to arrange test vectors are presented for reducing the test time of IDDQ testing. A test sequence is modified such that switching current quickly disappears. The procedure utilizes a unit delay model to estimate the time of the last transition of logic value from L to H in a circuit. Experimental results for benchmark circuits show the effectiveness of the procedure.

In this paper, supply current testing for detecting open defects in CMOS circuits is discussed. It is known that open defects cause unpredictable faulty effects and are difficult to be detected. In our test method, an AC electric field is applied during testing. The voltage at a floating node caused by an open defect is varied by the applied electric field and then the defect can be detected. The test pattern generation procedure for open defects is proposed and is applied to benchmark circuits. The experimental results shows that the number of test vectors for opens are much smaller than that for stuck-at faults. The experimental evaluation for an LSI chip is also shown to present the feasibility of our test method.

This paper proposes a novel CMOS built-in current sensor (BICS) for on-line current testing. Proposed BICS detects abnormal current in circuit under test (CUT) and makes a Pass/Fail signal through comparison between the CUT current and the duplicated inverter current. This circuit consists of two current-to-voltage conversion transistors, a full swing generator, a voltage comparator, and an inverter block. It requires 16 transistors. Since this BICS does not require the extra clock, the added extra pin is only one output pin. Furthermore, the BICS does not require test mode selection. Therefore the BICS can be applied to on-line current testing. The validity and effectiveness are verified through the HSPICE simulation of circuits with defects. When the CUT is an 8 8 parallel multiplier, the area overhead of the BICS is about 4.34%.

In this paper, a new test method is proposed for detecting open defects in CMOS logic ICs. The method is based on supply current of ICs generated by supplying time-variable supply voltage and electric field from the outside of the ICs. Also, test input vectors for the test method are proposed and it is shown that they can be generated more easily than functional test methods based on stuck-at fault models. The feasibility of the test is examined by some experiments. The empirical results promise us that by using the method, open defects in CMOS ICs can be detected.

Current testing has been proposed as an alternative technique for testing fully CMOS digital LSIs. Current testing has higher fault coverage than conventional stuck-at fault (SAF) testing and is more economical because it detects a wide range of faults and requires fewer test vectors than does SAF testing. We have proposed a current testing that measures the integral of the power supply current (IDD) during one clock period including the switching current. Since this method cannot be affected by the switching current, it can be used to test an LSI operating at a relatively high clock freuqnecy. This paper presents an improved current testing method for CMOS digital and analog LSIs. The method uses two current values (i.e., an upper limit and a lower limit) and judges the circuit under test to be faulty if the measured IDD is outside these limits. The proposed current testing is evaluated here for some kinds of faults (e.g., the bridging fault and the breaking fault) in digital and mixed-signal LSIs, and its efficiency of the current testing using SPICE3.