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Masahiro SHIMIZU Masahide INUISHI Katsuhiro TSUKAMOTO Hideaki ARIMA Hirokazu MIYOSHI
A novel isolation structure which has a buried insulator between polysilicon electrodes (BIPS) has been developed. The BIPS isolation employs the refilling CVD-oxides in openings between polysilicon electrodes by photoresist etchback process. Device characteristics and parasitic effects of BIPS isolation have been compared with that of LOCOS isolation. Using BIPS isolation, we can almost suppress the narrow-channel effects and achieve the deep submicron isolation. No degradation on the subthreshold decay of devices with BIPS isolation can be obtained. The use of BIPS isolation technology yields a DRAM cell of small area. The successful fabrication of deep submicron devices with BIPS isolation clearly demonstrates that this technology has superior ability to overcome the LOCOS isolation.
Yoshikazu MIYAWAKI Takeshi NAKAYAMA Shin-ichi KOBAYASHI Natsuo AJIKA Makoto OHI Yasushi TERADA Hideaki ARIMA Tsutomu YOSHIHARA
To improve the performance of high-density flash memories, several circuit technologies have been developed. A word-line boost and clamp scheme realizes low supply voltage read operations. A flash programming scheme utilizing Fowler-Nordheim (F-N) tunneling for programming before erasure and a negative gate biased erasing scheme accomplish low-power, high-speed, and 5-V-only erase operations. The chip size penalty is estimated to be only 3% for the 16-Mb flash memories.
Kazuo KOBAYASHI Yasushi TERADA Masanori HAYASHIKOSHI Takeshi NAKAYAMA Hideaki ARIMA Takayuki MATSUKAWA Tsutomu YOSHIHARA
High density and high speed nonvolatile random access memory is described. Using the conventional floating gate EEPROM process, a dynamic RAM cell has been merged into an EEPROM cell. Data stored on the DRAM cell can be backed up by the EEPROM cell. The data transfer between the DRAM and the EEPROM is executed simultaneously on all memory cells on a same word line. An experimental 16 kbit memory has been manufactured by 1.5 µm design rule CMOS process. The cell size is 17 µm17 µm and the chip size is 57.2 mm3.75 mm. The address access time of 100 ns and the page read access time of 20 ns have been achieved. A nonvolatile CAM (Content Addressable Memory) cell will also be proposed.