A novel operation of a flash memory cell, named DINOR (DIvided bit line NOR) operation, is proposed. This operation is based on gate-biased FN programming/FN erasing, and we found that it satisfies all basic cell characteristics such as program/erase, disturb immunity and a cycling endurance. Making a good use of this cell operation, we also proposed a new array structure applied to DINOR type cell whose bit line is divided into the main and sub bit line, having 1.82 µm2 cell size, suitable for 32 Mbit flash memory based on 0.5 µm CMOS process. In the last part of this paper, the useful and practical application of the DINOR operation to a virtual ground array architecture, realizing 1.0 µm2 cell size for a 0.5 µm 64 Mbit flash memory, is described.

The Double-Sided Rugged poly Si (DSR) technology has been developed for high density DRAMs. The DSR technology was achieved using transformation of rugged poly Si caused by ion implantation. The DSR can increase the surface area of the storage electrode, because it has rugged surfaces on both upper and lower sides. The 2-FINs STC (STacked Capacitor cell) with DSR was fabricated in the cell size of 0.72 µm2, and it is confirmed that the DSR can increase the surface area 1.8 times larger than that of smooth poly Si. It is expected that 25 fF/bit is obtained with a 300 nm-thick storage electrode. These effects show that sufficient capacitance for 256 Mb DRAMs is obtained with a low storage electrode. It is confirmed that there is no degradation in C-V and I-V characteristics. Moreover, the DSR needs neither complicated process steps nor special technologies. Therefore, the DSR technology is one of the most suitable methods for 256 Mb DRAMs and beyond.

A memory array architecture and row decoding scheme for a 3 V only DINOR (divided bit line NOR) flash memory has been designed. A new sector organization realizes one word line driver per two word lines, which is conformable to tight word line pitch. A hierarchical negative voltage switching row decoder and a compact source line driver have been developed for 1 K byte sector erase without increasing the chip size. A bit-by-bit programming control and a low threshold voltage detection circuit provide a high speed random access time at low Vcc and a narrow program threshold voltage distribution. A 4 Mb DINOR flash memory test device was fabricated from 0.5 µm, double-layer metal, triple polysilicon, triple well CMOS process. The cell measures 1.81.6 µm2 and the chip measures 5.85.0 mm2. The divided bit line structure realizes a small NOR type memory cell.