A new capacitor over bit-line (COB) stacked capacitor memory cell was developed using a local interconnect poly-silicon layer to arrange a capacitor contact between bit-lines. This memory cell enables usable capacitor area to increase and capacitor contact hole depth to decrease. The hemispherical grain (HSG) silicon, whose effective surface area is twice that of ordinary poly-silicon, was utilized for the storage node to increase the storage capacitance without increasing the storage node height. The feasibility of achieving a 1.8 µm2 memory cell with 30 fF storage capacitance using a 7 nm-SiO2-equivalent dielectric film and a 0.5 µm-high HSG storage node has been verified for 64 MbDRAMs by a test memory device using a 0.4 µm CMOS process.

We propose a writing circuit scheme to screen intermittent failure cells for toggle MRAM. The scheme, comprising a current waveform circuitry that controls rise/fall time of writing current, drastically decreases the probability of intermittent failure. To apply the scheme to large-capacity MRAMs, a current booster containing discharging capacitors has also been developed. It adjusts the waveform of writing current to that designed by the current waveform circuitry even in presence of parasitic capacitors and resistors along the writing current path. Such a technique is essential for achieving stability in large-capacity MRAMs.

Apart from magnetic random access memories (MRAM), nonvolatile memories cannot be used without causing fatigue. As the use of MRAMs can solve fatigue problems, MRAMs have a large potential to open up large new markets. The manufacturing cost of LSIs cannot be reduced while they have not been produced massively. To increase the size of the MRAM market, new applications, in which MRAMs create added value, are needed. A demo system that models a drive recorder was developed to introduce the novel features of MRAMs, and a 4-Mb MRAM was developed to be used in the demo system.

Effects of field edge steps on characteristics of MOSFETs with tungsten polycide stacked gate electrodes patterned by KrF excimer laser lithography was studied through an electrical gate length measurement technique. Sheet resistance of the gate electrodes on the field oxide, on the active region and across the field edge steps was determined from the relationship between gate conductance and designed gate linewidth. The sheet resistance of the gate electrode across the field edge steps was larger than that on the flat regions. Effects of field edge steps on gate linewidth variation were evaluated by SEM observations and electrical measurements. Distribution of gate linewidth in a wafer was measured by the MOSFET test structures with the linewidth down to sub-quarter micron. Gate linewidth variation near the field edge steps was found to influence the short channel MOSFET characteristics.

A practical method of measuring the contact resistance of a phosphorus-doped poly-Si plug formed on a lightly phosphorus-doped diffusion region in DRAM memory cells is described. Contact resistance was obtained electrically, using ordinary contact-chain test structures, by changing the measurement of the substrate bias. This separated the bias-dependent resistance of the lightly doped diffusion layer from the total resistance. The method was used experimentally to evaluate the feasibility of forming low-resistance contacts down to a diameter of 130 nm for giga-bit DRAMs. Electrical measurement showed that reducing the interface resistance between the poly-Si plug and the lightly doped diffusion layer was effective for forming low-resistance contacts, though a specific interface layer could not be detected by TEM observation.

We propose new test device structures, Gate-Last-formed structures, which are suitable for fundamental study of high-k gate insulator or metal gate electrode MISFETs. The gate insulator and electrode stack is formed after local interconnect pads connected with source and drain. The gate stack is build in trench formed by dry and wet etching and is non-self-aligned to the source and drain. The wet etching restricts damage formation on the exposed Si surface underneath the trench. Electrical characteristics are measurable just after exposure of surface of the local interconnect pads without conventional Al wiring. This structure can provide methods both for fundamental evaluation and for material selection of new gate stack materials by investigation of MISFET characteristics. This is achieved with short TAT and avoiding contamination penalty to a fab.

We propose an MRAM macro architecture for SoCs to reduce their area size. The shared write-selection transistor (SWST) architecture is based on 2T1MTJ MRAM cell technology, which enables the same fast access time with a smaller cell area than that of 6T SRAMs. We designed a 4-Mb macro using the SWST architecture with a 0.15-µm CMOS process and a 0.24-µm MRAM process. The macro cell array consists of 81T64MTJ cell array elements, each storing 64 bits of data. The area size is reduced by more than 30%. By introducing a leakage-replication (LR) read scheme, a wide read margin on a test chip is accomplished and 50-ns access time is achieved with SPICE simulation. The 2T1MTJ macro and 81T64MTJ macro can be integrated into a single SoC.