With the increasing demand for SoCs to include rich functionality, SoCs are being designed with hundreds of small memories with different sizes and frequencies. If memory BIST logics were individually added to these various memories, the area overhead would be very high. To reduce the overhead, memory BIST logic must therefore be shared. This paper proposes a memory-grouping method for memory BIST logic sharing. A memory-grouping problem is formulated and an algorithm to solve the problem is proposed. Experimental results show that the proposed method reduced the area of the memory BIST wrapper by up to 40.55%. The results also show that the ability to select from two types of connection methods produced a greater reduction in area than using a single connection method.

Due to outsourcing of numerous stages of the IC manufacturing process to different foundries, the security risk, such as hardware Trojan becomes a potential threat. In this paper, we present a layout aware localized hardware Trojan detection method that magnifies the detection sensitivity for small Trojan in power-based side-channel analysis. A scan segmentation approach with a modified launch-on-capture (LoC) transition delay fault test pattern application technique is proposed so as to maximize the dynamic power consumption of any target region. The new architecture allows activating any target region and keeping others quiet, which reduces total circuit toggling activity. We evaluate our approach on ISCAS89 benchmark and two practical circuits to demonstrate its effectiveness in side-channel analysis.

Embedded memory is extensively being used in SoCs, and is rapidly growing in size and density. It contributes to SoCs to have greater features, but at the expense of taking up the most area. Due to continuous scaling of nanoscale device technology, large area size memory introduces aging-induced faults and soft errors, which affects reliability. In-field test and repair, as well as ECC, can be used to maintain reliability, and recently, these methods are used together to form a combined approach, wherein uncorrectable words are repaired, while correctable words are left to the ECC. In this paper, we propose a novel in-field repair strategy that repairs uncorrectable words, and possibly correctable words, for an ECC-based memory architecture. It executes an adaptive reconfiguration method that ensures 'fresh' memory words are always used until spare words run out. Experimental results demonstrate that our strategy enhances reliability, and the area overhead contribution is small.

This paper presents a power-constrained test scheduling method for multi-clock domain SoCs that consist of cores operating at different clock frequencies during test. In the proposed method, we utilize virtual TAM to solve the frequency gaps between cores and the ATE. Moreover, we present a technique to reduce power consumption of cores during test while the test time of the cores remain the same or increase a little by using virtual TAM. Experimental results show the effectiveness of the proposed method.

This paper proposes a test methodology for core-based testing of System-on-Chips by utilizing the functional bus as a test access mechanism. The functional bus is used as a transportation channel for the test stimuli and responses from a tester to the cores under test (CUT). To enable test concurrency, local test buffers are added to all CUTs. In order to limit the buffer area overhead while minimizing the test application time, we propose a packet-based scheduling algorithm called PAcket Set Scheduling (PASS), which finds the complete packet delivery schedule under a given power constraint. The utilization of test packets, consisting of a small number of bits of test data, for test data delivery allow an efficient sharing of bus bandwidth with the help of an effective buffer-based test architecture. The experimental results show that the methodology is highly effective, especially for smaller bus widths, compared to previous approaches that do not use the functional bus.

The rapid advancement of VLSI technology has made it possible for chip designers and manufacturers to embed the components of a whole system onto a single chip, called System-on-Chip or SoC. SoCs make use of pre-designed modules, called IP-cores, which provide faster design time and quicker time-to-market. Furthermore, SoCs that operate at multiple clock domains and very low power requirements are being utilized in the latest communications, networking and signal processing devices. As a result, the testing of SoCs and multi-clock domain embedded cores under power constraints has been rapidly gaining importance. In this research, a novel method for designing power-aware test wrappers for embedded cores with multiple clock domains is presented. By effectively partitioning the various clock domains, we are able to increase the solution space of possible test schedules for the core. Since previous methods were limited to concurrently testing all the clock domains, we effectively remove this limitation by making use of bandwidth conversion, multiple shift frequencies and properly gating the clock signals to control the shift activity of various core logic elements. The combination of the above techniques gains us greater flexibility when determining an optimal test schedule under very tight power constraints. Furthermore, since it is computationally intensive to search the entire expanded solution space for the possible test schedules, we propose a heuristic 3-D bin packing algorithm to determine the optimal wrapper architecture and test schedule while minimizing the test time under power and bandwidth constraints.

Rapid advances in semiconductor manufacturing technology have led to higher chip power densities, which places greater emphasis on packaging and temperature control during testing. For system-on-chips, peak power-based scheduling algorithms have been used to optimize tests under specified power constraints. However, imposing power constraints does not always solve the problem of overheating due to the non-uniform distribution of power across the chip. This paper presents a TAM/Wrapper co-design methodology for system-on-chips that ensures thermal safety while still optimizing the test schedule. The method combines a simplified thermal-cost model with a traditional bin-packing algorithm to minimize test time while satisfying temperature constraints. Furthermore, for temperature checking, thermal simulation is done using cycle-accurate power profiles for more realistic results. Experiments show that even a minimal sacrifice in test time can yield a considerable decrease in test temperature as well as the possibility of further lowering temperatures beyond those achieved using traditional power-based test scheduling.

Current NoC test scheduling methodologies in the literature are based on a dedicated path approach; a physical path through the NoC routers and interconnects are allocated for the transportation of test data from an external tester to a single core during the whole duration of the core test. This approach unnecessarily limits test concurrency of the embedded cores because a physical channel bandwidth is typically larger than the scan rate of any core-under-test. We are proposing a bandwidth sharing approach that divides the physical channel bandwidth into multiple smaller virtual channel bandwidths. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using two complementary NoC wrappers. Experimental results showed that the area overhead can be optimized (to an extent) without compromising the test application time. Compared to other NoC scheduling approaches based on dedicated paths, our bandwidth sharing approach can reduce the test application time by up to 75.4%.

Nano-scale VLSI design is facing the problems of increased test data volume. Small delay defects are becoming possible sources of test escapes, and high delay test quality and therefore a greater volume of test data are required. The increased test data volume requires more tester memory and test application time, and both result in test cost inflation. Test pattern ordering gives a practical solution to reduce test cost, where test patterns are ordered so that more defects can be detected as early as possible. In this paper, we propose a test pattern ordering method based on SDQL (Statistical Delay Quality Level), which is a measure of delay test quality considering small delay defects. Our proposed method orders test patterns so that SDQL shrinks fast, which means more delay defects can be detected as early as possible. The proposed method efficiently orders test patterns with minimal usage of time-consuming timing-aware fault simulation. Experimental results demonstrate that our method can obtain test pattern ordering within a reasonable time, and also suggest how to prepare test sets suitable as inputs of test pattern ordering.

The IEEE 1500 standard wrapper requires that its inputs and outputs be interfaced directly to the chip's primary inputs and outputs for controllability and observability. This is typically achieved by providing a dedicated Test Access Mechanism (TAM) between the wrapper and the primary inputs and outputs. However, when reusing the embedded Network-on-Chip (NoC) interconnect instead of the dedicated TAM, the standard wrapper cannot be used as is because of the packet-based transfer mechanism and other functional requirements by the NoC. In this paper, we describe two NoC-compatible wrappers, which overcome these limitations of the 1500 wrapper. The wrappers (Type 1 and Type 2) complement each other to optimize NoC bandwidth utilization while minimizing the area overhead. The Type 2 wrapper uses larger area overhead to increase bandwidth efficiency, while Type 1 takes advantage of some special configurations which may not require a complex and high-cost wrapper. Two wrapper optimization algorithms are applied to both wrapper designs under channel-bandwidth and test-time constraints, resulting in very little or no increase in the test application time compared to conventional dedicated TAM approaches.

We present a graph model and an ILP model for TAM design for transparency-based SoC testing. The proposed method is an extension of a previous work proposed by Chakrabarty with respect to the following three points: (1) constraint relaxation by considering test data flow for each core separately, (2) optimization of the cost for transparency as well as the cost for additional interconnect area simultaneously and (3) consideration of additional bypass paths. Therefore, the proposed ILP model can represent various problems including the same problem as the previous work and produce better results. Experimental results show the effectiveness and flexibility of the proposed method compared to the previous work.