Nano crystalline zinc oxide (ZnO) is deposited by room temperature atomic layer deposition (RT-ALD) using dimethylzinc and a plasma excited humidified Ar without thermal treatments. The TEM observation indicated that the deposited ZnO films were crystallized with grain sizes of ∼20 nm on Si in the course of the RT-ALD process. The crystalline ZnO exhibited semiconducting characteristics in a thin film transistor, where the field-effect mobility was recorded at 1.29×10-3cm2/V·s. It is confirmed that the RT deposited ZnO film has an anticorrosion to hot water. The water vapor transmission rate of 8.4×10-3g·m-2·day-1 was measured from a 20 nm thick ZnO capped 40 nm thick Al2O3 on a polyethylene naphthalate film. In this paper, we discuss the crystallization of ZnO in the RT ALD process and its applicability to flexible electronics.

We review our recent achievements in monolithic 3D-ICs and flexible electronics based on single-grain Si TFTs that are fabricated inside a single-grain with a low-temperature process. Based on pulsed-laser crystallization and submicron sized cavities made in the substrate, amorphous-Si precursor film was converted into poly-Si having grains that are formed on predetermined positions. Using the method called µ-Czochralski process and LPCVD a-Si precursor film, two layers of the SG Si TFT layers with the grains having a diameter of 6µm were vertically stacked with a maximum process temperature of 550°C. Mobility for electrons and holes were 600cm2/Vs and 200cm2/Vs, respectively. As a demonstration of monolithic 3D-ICs, the two SG-TFT layers were successfully implemented into CMOS inverter, 3D 6T-SRAM and single-grain lateral PIN photo-diode with in-pixel amplifier. The SG Si TFTs were applied to flexible electronics. In this case, the a-Si precursor was prepared by doctor-blade coating of liquid-Si based on pure cyclopentasilane (CPS) on a polyimide (PI) substrate with maximum process temperature of 350°C. The µ-Czochralski process provided location-controlled Si grains with a diameter of 3µm and mobilities of 460 and 121cm2/Vs for electrons and holes, respectively, were obtained. The devices on PI were transferred to a plastic foil which can operate with a bending diameter of 6mm. Those results indicate that the SG TFTs are attractive for their use in both monolithic 3D-ICs and flexible electronics.

This report describes a crystallization method we developed for amorphous (a)-Si film by using 405-nm laser diodes (LDs). The proposed method has been used to fabricate bottom gate (BG) microcrystalline (µc)-Si TFTs for the first time. A µc-Si film with high crystallinity was produced and high-performance BG µc-Si TFTs with a field effect mobility of 3.6 cm2/Vs and a current on/off ratio exceeding 108 were successfully demonstrated. To determine the advantages of a 405-nm wavelength, a heat flow simulation was performed with full consideration of light interference effects. Among commercially available solid-state lasers and LDs with wavelengths having relatively high optical absorption coefficients for a-Si, three (405, 445, and 532 nm) were used in the simulation for comparison. Results demonstrated that wavelength is a crucial factor for the uniformity, efficiency, and process margin in a-Si crystallization for BG µc-Si TFTs. The 405-nm wavelength had the best simulation results. In addition, the maximum temperature profile on the gate electrode through the simulation well explained the actual crystallinity distributions of the µc-Si films.

A precision in thickness recycling modus for a displays' color filter surface using a gear-form cathode in microelectrochemical removal is developed in the study. Through the precise removal processes of optical materials of nanostructure of Indium-Tin-Oxide crystallization, the optoelectronic semiconductor industry can effectively recycle defective products, and reducing production costs.

The role of electric field in metal-induced lateral crystallization (MILC) of amorphous Si (a-Si) under limited Ni-supply condition has been investigated. The nominal lateral-growth rate was increased from 3.6 µm/h (no-electric field) to 23 µm/h at the positive electrode side and reduced to 2.8 µm/h at the negative electrode side in presence of the electric field of 20 V/cm. However, spontaneously nucleated needle-like Si crystals were observed in the enhanced positive electrode side, which have been found to be independent of the MILC. Further investigation under the condition where Ni in the supply region was removed on the way of crystallization revealed that the electric field enhanced crystallization greatly reduced. These results indicate that the electric field does not enhance the MILC growth but enhances the diffusion of Ni in a-Si which takes place prior to the MILC growth.

Recently, millimeter-wave energy has attracted much attention as a new and novel energy source for materials processing. In the present paper, several unique features of millimeter-wave heating in materials processing are reviewed briefly and development of materials processing machines by mm-wave radiation is also described. In the application of mm-wave heating, sintering of high quality alumina ceramics having a high bending strength of about 800 MPa are first demonstrated and followed by preparation of aluminum nitride with a high thermal conductivity over 200 W/(mK) at a sintering temperature lower by 473-573 K than the conventional method, by which this processing can be expected to be one of the environment-conscious energy saving processes. A newly developed post-annealing process with mm-wave radiation is described, in which crystallization of amorphous perovskite oxide films prepared by plasma sputtering was attained at temperatures lower than that by the conventional heating and the dielectric constant of post-annealed SrTiO3 (STO) films by mm-wave radiation were drastically improved.

A two-dimensional laser beam profiler has been developed that can measure the intensity distribution on a sample surface of a single-shot of an excimer-laser light beam from not only the macroscopic viewpoint, but also the microscopic viewpoint, which is important to excimer-laser triggered lateral large-grain growth of Si. A resolution as fine as 0.4 µm was obtained with a field of view of as large as 30 µm 30 µm. The effects of homogenizers, phase-shifters, and their combination on beam profiles were quantitatively investigated by using this apparatus. The relationship between the microscopic beam profile and the surface morphology of laterally grown grains was also examined.

The segregation of non-magnetic phases such as borosilicate and Cr was investigated by crystallization behavior during the surface and bulk crystallization of Co-based amorphous alloys. The concentration of metalloids (B and Si) determined the extent of grain boundary segregation of borosilicate glass during surface crystallization. During the bulk crystallization of (Co75Cr25)0.8Si5B15 amorphous alloy, solute rejection of Cr resulted in the nucleation of Cr-deficient ferromagnetic crystals and non-magnetic σ-phase was subsequently precipitated along the grain boundary. These results show that crystallization process, i.e. nucleation and growth can be controlled to optimize the microstructure to reduce media noises in Co-based recording media.

We have successfully produced laterally-grown grains on large (300 350 mm) glass substrates by means of a newly developed excimer laser crystallization system that features a high-precision mask stage and an auto-focusing system. The original grains were produced with a steep beam edge and their lateral growth was extended by repeated irradiation and translation. TFTs fabricated with these extended grains were found to have mobilities that remained almost constant at 270 cm2/Vs (n-ch. TFTs) and 230 cm2/Vs (p-ch. TFTs) over a wide range of laser fluence (400-600 mJ/cm2).

The crystallization process of Sr0. 7Bi2. 3Ta2O9 (SBT) ferroelectric thin films with different crystal orientations formed by chemical liquid deposition using an alkoxide precursor was investigated. One film showed strong c-axis orientation (a-type film), while another shows scarcely any c-axis orientation (b-type film). We report that the crystallization process was the same even when crystal orientation differed. Thin films first change from amorphous to fluorite fine grains; the fluorite grains then change to bismuth layer-structure grains. The different orientation of the SBT films is not caused by different crystallization process. Both SBT films with different crystal orientations consist of fine fluorite grains after 650 heat-treatment. Their leakage current density characteristics differ, however. The leakage current density of the a-type film was independent of the electric field, and showed a low value of 10-8 A/cm2. The leakage current density of the b-type film, however, was dependent on the electric field, and increased continuously with the increasing electric field. After 700 heat-treatment, both films consist of large grains with bismuth layer-structure and fine fluorite grains. The matrix of both films contains large grains with bismuth layer-structure that determines the leakage current density characteristics. Since the fluorite grain size after a 700 heat-treatment is the same as that after 650 heat-treatment, nucleation is predominant at the structural phase boundary from amorphous to fluorite. The bismuth layer-structure grains are large and single-crystal grains after both a 700 and 800 heat-treatment. Increased grain size predominates at the structural phase boundary from fluorite to bismuth layer-structure grains. Clearly, ferroelectric SBT films with bismuth layer-structure are crystallized in two steps, each having a different predominant crystal growth mechanism.

Amorphous films of YBCO and BSCCO (2212) sputtered on MgO substrate were crystallized using zonemelt technique. For YBCO films, thin Ag intermediate layer was found to be effective in enhancing crystal growth and preferred orientation. Zone-melted BSCCO films included both (2201) phase and Cu(Sr, Ca)O2 in a form of dendritic crystallites. Tc's obtained for YBCO and BSCCO films were 70 and 75 K, respectively.

The interface between laser-recrystallized Si and SiO2 is investigated by means of capacitance-voltage curve measurements. The recrystallization is performed by scanning cw Ar+ laser. The change in the C-V curves shows that the laser-recrystallization generates positive charge and the fast interface states at the Si-SiO2 interface, and creates n-type defects in recrystallized bulk silicon. Nominal interface charge increases linearly with a laser power. The increase in the charge is enhanced by fast laser-beam scanning velocity. The change in the C-V curve is suppressed, if a substrate is heated up to 450 during recrystallization. Complete recovery of the induced change in the C-V curves requires a subsequent furnace annealing at a temperature as high as 1100. These phenomena are explained by the generation of oxygen vacancy at the Si-SiO2 interface and quenched-in point defects in the recrystallized Si. The oxygen vacancy is produced by a reaction between the melted Si and SiO2. The quenched-in defects are produced during fast cooling of the melted Si.

We fabricated a 4 GHz thin-base (120 nm) lateral bipolar transistor on bonded SOI by applying our sidewall self-aligning base process. By applying this device to BiCMOS circuits, bipolar transistor base junction capacitance, and MOSFET source and drain capacitance were very small. Furthermore, MOSFET and bipolar transistors are completely isolated from each other. Thus, it is easy to optimize MOS and bipolar processes, and provide protection from latch-up problems and soft errors caused by α-particles. In this paper, we describe device characteristics and discuss the crystal quality degradation introduced by ion implantation, and two dimensional effects of base diffusion capacitance.

The a-Si films deposited on quartz substrates were crystallized by lateral sweep annealing in steep temperature gradient using a gas burner. Random nucleation in amorphous region was effectively suppressed in the temperature gradient, so lateral solid phase epitaxial growth from crystallites generated at the initial stage of lateral sweep annealing spread over 100 µm. Their crystallographic orientations were mostly (100).

Modeling and numerical simulation of crystal growth of Si film and heat transport in 3D structure were made for optimization of physical and geometrical parameters used during laser recrystallization. Based on simulations a new concept called micro-absorber was introduced for obtaining defect-free Si films.