A supply voltage (VDD) independent temperature sensor circuit, which can be realized by the optimum combination of three current modes of n-MOSFETs including the subthreshold current using the feedback scheme from the temperature dependent voltage (VTD) output to the gates of three n-MOSFETs, was proposed and fabricated by a standard 1.2 µm n-well CMOS process. The circuit consists of only 17 MOSFETs without high resistors resulting in a small die area of 0.18 mm2. The temperature coefficient TC of the sensor circuit can be controlled by the channel length ratio L4/L3 of two n-MOSFETs. The average temperature sensor voltage VTS and its typical TC are 1.77 V at VDD=5.0 V (20) and 5.1 mV/ for VDD=5.01.0 V in the temperature range of -20-100 in case of L4/L3=9, respectively.

A new Row-by-Row Dynamic Source-Line Voltage Control (RRDSV) scheme is proposed to suppress leakage current by two orders of magnitude in the SRAM's for sub-70 nm process technology with sub-1-V VDD. This two-order leakage reduction is caused from the cooperation of reverse body-to-source biasing and Drain Induced Barrier Lowering (DIBL) effects. In addition, metal shields are proposed to be inserted between the cell nodes and the bit lines not to allow the cell nodes to be flipped by the external bit-line coupling noise in this paper. A test chip has been fabricated to verify the effectiveness of the RRDSV scheme with the metal shields by using 0.18-µm CMOS process. The retention voltages of SRAM's with the metal shields are measured to be improved by as much as 40-60 mV without losing the stored data compared to the SRAM's without the shields.

We propose an ultra low power watch-dog circuit with the use of MOSFETs operation under subthreshold characteristics. The circuit monitors the amount of the product degradation because the subthreshold current of MOSFET emulates the rate of the general chemical reaction. Its operation was verified with both SPICE simulation and the measurement of the prototype chip. The new circuit embedded in a tag attached to any product could dynamically monitor the degradation regardless of storage conditions.

Recent achievements in low-voltage and low-power circuit techniques are reported in this paper. DC current in low-voltage CMOS circuits stemming from the subthreshold current in MOS transistors, is effectively reduced by applying switched-power-line schemes. The AC current charging the capacitance in DRAM memory arrays is reduced by a partial activation of array blocks during the active mode and by a charge recycle during the refresh mode. A very-low-power reference-voltage generator is also reported to control the internal chip voltage precisely. These techniques will open the way to using giga-scale LSIs in battery-operated portable equipment.

Process and device technologies of CMOS devices for low-voltage operation are described. First, optimum power-supply voltage for CMOS devices is examined in detail from the viewpoints of circuit performance, device reliability and power dissipation. As a result, it is confirmed that power-supply voltage can be reduced without any speed loss of the CMOS device. Based upon theoretical understanding, the author suggests that lowering threshold voltage and reduction of junction capacitance are indispensable for CMOS devices with low-voltage supply, in order to improve the circuit performance, as expected from MOS device scaling. Process and device technologies such as Silicon On Insulator (SOI) device, low-temperature operation and CMOS Shallow Junction Well FET (CMOS-SJET) structure are reviewed for reduction of the threshold voltage and junction capacitance which lead to high-seed operation of the COMS device at low-voltage.