Shrinking feature sizes and higher levels of integration in semiconductor device manufacturing technologies are increasingly causing the gap between defect levels estimated in the design stage and reported ones for fabricated devices. In this paper, we propose a unified weighted fault coverage approach that includes both bridge and open faults, considering the critical area as the incident rate of each fault. We then propose a test pattern reordering scheme that incorporates our weighted fault coverage with an aim to reduce test costs. Here we apply a greedy algorithm to reorder test patterns generated by the bridge and stuck-at automatic test pattern generator (ATPG), evaluating the relationship between the number of patterns and the weighted fault coverage. Experimental results show that by applying this reordering scheme, the number of test patterns was reduced, on average, by approximately 50%. Our results also indicate that relaxing coverage constraints can drastically reduce test pattern set sizes to a level comparable to traditional 100% coverage stuck-at pattern sets, while targeting the majority of bridge faults and keeping the defect level to no more than 10 defective parts per milion (DPPM) with a 99% manufacturing yield.

Low pin-count testing is an effective method to reduce test cost. Based on this method multi-site testing, i.e., where multiple devices are tested concurrently, can be supported under the limitation on the number of channels provided by ATE. In this work we propose a scalable test module (called STM) design that can support multi-site testing more efficiently when compared with previous work. In the previous work, the total number of devices that can be tested concurrently is usually fixed when the design for testability hardware is designed. For our STM, each STM can deal with a number of circuits to be tested at the same time. Moreover, STM is scalable, i.e., multiple STMs can work collaboratively while the ATE bandwidth still remains the same to further increase the degree of test parallelism. Our STM will be integrated with ATE and serve as an interface between ATE and circuits under test (CUT). Only four pins are required by STM to communicate with ATE, and IEEE 1149.1 Std. ports are employed to transfer test data to/from CUTs. STM has been verified via silicon proof, which contains only about 2,768 logic gates. Experiments results for a number of ISCAS and IWLS'05 benchmark circuits also demonstrate that by making good use of the scalable feature of STM, test efficiency can be enhanced significantly.

Unlimited requirements for system-on-chip (SoC) facilitate three-dimensional (3D) technology as a promising alternative for extending Moore's Law. In spite of many advantages 3D technology provides, 3D technology faces testing issues because of the complexity of 3D design. Therefore, resolving the problem of test optimization and reducing test cost are crucial challenges. In this paper, we propose a novel optimization mechanism of 3D SoCs to minimize test time for mid-bond testing. To make our proposed mechanism more practical, we discuss test cost in mid-bond testing with consideration of manufacturing influence factors. Experimental results on ITC'02 SoC benchmark circuits show that our proposed mechanism reduces mid-bond test time by around 73% on average compared with one baseline solution, furthermore, the mechanism also proves its capacity in test cost reduction.

A tri-template-based codes (TTBC) method is proposed to reduce test cost of intellectual property (IP) cores. In order to reduce test data volume (TDV), the approach utilizes three templates, i.e., all 0, all 1, and the previously applied test data, for generating the subsequent test data by flipping the inconsistent bits. The approach employs a small number of test channels I to supply a large number of internal scan chains 2I-3 such that it can achieve significant reduction in test application time (TAT). Furthermore, as a non-intrusive and automatic test pattern generation (ATPG) independent solution, the approach is suitable for IP core testing because it requires neither redesign of the core under test (CUT) nor running any additional ATPG for the encoding procedure. In addition, the decoder has low hardware overhead, and its design is independent of the CUT and the given test set. Theoretical analysis and experimental results for ISCAS 89 benchmark circuits have proven the efficiency of the proposed approach.

A novel concurrent core test approach is proposed to reduce the test cost of SOC. Prior to test, the test sets corresponding to cores under test (CUT) are merged by using the proposed merging algorithm to obtain a minimum merged test set. During test, the proposed scan tree architecture is employed to support the concurrent core test using the merged test set. The approach achieves concurrent core test with one scan input and low hardware overhead. Moreover, the approach does not need any additional test generation, and it can be used in conjunction with general compression/decompression techniques to further reduce test cost. Experimental results for ISCAS 89 benchmarks have proven the efficiency of the proposed approach.

In this paper, a complete X-tolerant test data compression solution is proposed for system-on-a-chip (SOC) testing. The solution achieves low-cost testing by employing not only selective Huffman vertical coding (SHVC) for test stimulus compression but also MISR-based time compactor for test response compaction. Moreover, the solution is non-intrusive, since it can tolerate any number of unknown states (also called X state) in test responses such that it does not require modifying the logic of core to eliminate or block the sources of unknown states. Furthermore, the solution achieves enhanced diagnosis capability over conventional MISR. The enhanced diagnosis requires the least hardware overhead by reusing the existing masking logic and achieves significant saving in diagnostic time. Experimental results for ISCAS 89 benchmarks as well as the evaluation of hardware implementation have proven the efficiency of the proposed test solution.

In the Reconfigurable System-On-a-Chip (RSOC), an FPGA core is embedded to improve the design flexibility of SOC. In this paper, we demonstrate that the embedded FPGA core is also feasible for use in implementing the proposed hybrid pattern Built-In Self-Test (BIST) in order to reduce the test cost of SOC. The hybrid pattern BIST, which combines Linear Feedback Shift Register (LFSR) with the proposed on-chip Deterministic Test Pattern Generator (DTPG), can achieve not only complete Fault Coverage (FC) but also minimum test sequence by applying a selective number of pseudorandom patterns. Furthermore, the hybrid pattern BIST is designed under the resource constraint of target FPGA core so that it can be implemented on any size of FPGA core and take full advantage of the target FPGA resource to reduce test cost. Moreover, the reconfigurable core-based approach has minimum hardware overhead since the FPGA core can be reconfigured as normal mission logic after testing such that it eliminates the hardware overhead of BIST logic. Experimental results for ISCAS 89 benchmarks and a platform FPGA chip have proven the efficiency of the proposed approach.

The increase of test time of embedded DRAMs (e-DRAM) is one of the key issues of System-on-chip (SOC) device test. This paper proposes to put the repair analysis function on chip as Built In Self Repair (BISR). BISR is performed at 166 MHz as at-speed of e-DRAM with using low cost automatic test equipment (ATE). The area of the BISR is 1.7 mm2. Using error storage table form contributes to realize small area penalty of repair analysis function. e-DRAM function test time by BISR was about 20% less than the conventional method at wafer level testing. Moreover, representative samples are produced to confirm repair analysis ability. The results show that all of the samples are actually repaired by repair information generated by BISR.

we evaluate the effect of express lots on production dispatching rule scheduling and cost in VLSI manufacturing final test process. In the assignment of express lots, we make comparisons of two rules, First In First Out (FIFO) rule which is widely used and WEIGHT+RPM rule which considers the time required for jig and temperature exchanges, the remaining processing time of the machine in use and the lot waiting time in queue. When using FIFO rule, the test efficiency begins to deteriorate and the test cost per chip begins to increase, if the content of express lots exceeds 15%. Furthermore, for 30% of express lots' content, the number of total processed lots decreases by 19% and the test cost per chip increases by 22% in comparison to the cases including no express lots. For WEIGHT+RPM rule, however, the test efficiency does not deteriorate and the test cost per chip does not increase even if the content of express lots is increased up to 50%. When we use WEIGHT+RPM rule, Express Lots Tolerances (ELTs), defined as the maximum content of express lots which permits the deterioration of the system characteristics by 5%, are about three times as high as ones when using FIFO rule. It is also found that WEIGHT+RPM rule maintains higher ELTs against the changes in the numbers of planned chips and prepared jigs as compared with FIFO rule.

In order to evaluate the effect of testing technologies such as electron beam (EB) testing and focused ion beam (FIB) reconstruction on the VLSI development cycle, the VLSI development period and cost are analyzed by using detailed fault models which make possible to take into consideration the effect of EB and FIB techniques. First, the specifications of fabricated VLSIs and the VLSI development cycle are modeled. Next the faults which can be diagnosed by such testing techniques are modeled. By using the parametric model of the VLSI development cycle, the development period and cost are analyzed. In the fault diagnosis stage, the use of an EB tester or the combinational use of an EB tester and an FIB equipment, instead of a traditional mechanical prober is considered. It is seen that the development period and cost are reduced by using EB and FIB diagnosis equipments by a factor of about 3. The effect of scan path method is also evaluated by making use of the same simulation method. Results show that the scan path design is effective for the reduction in both period and cost in the development cycle.