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[Author] Yuta SOMEI(2hit)

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  • Evaluation of a True Random Number Generator Utilizing Timing Jitters in RSFQ Logic Circuits Open Access

    Kenta SATO  Naonori SEGA  Yuta SOMEI  Hiroshi SHIMADA  Takeshi ONOMI  Yoshinao MIZUGAKI  

     
    BRIEF PAPER

      Pubricized:
    2022/01/19
      Vol:
    E105-C No:6
      Page(s):
    296-299

    We experimentally evaluated random number sequences generated by a superconducting hardware random number generator composed of a Josephson-junction oscillator, a rapid-single-flux-quantum (RSFQ) toggle flip-flop (TFF), and an RSFQ AND gate. Test circuits were fabricated using a 10 kA/cm2 Nb/AlOx/Nb integration process. Measurements were conducted in a liquid helium bath. The random numbers were generated for a trigger frequency of 500 kHz under the oscillating Josephson-junction at 29 GHz. 26 random number sequences of 20 kb length were evaluated for bias voltages between 2.0 and 2.7 mV. The NIST FIPS PUBS 140-2 tests were used for the evaluation. 100% pass rates were confirmed at the bias voltages of 2.5 and 2.6 mV. We found that the Monobit test limited the pass rates. As numerical simulations suggested, a detailed evaluation for the probability of obtaining “1” demonstrated the monotonical dependence on the bias voltage.

  • Planarized Nb 4-Layer Fabrication Process for Superconducting Integrated Circuits and Its Fabricated Device Evaluation

    Shuichi NAGASAWA  Masamitsu TANAKA  Naoki TAKEUCHI  Yuki YAMANASHI  Shigeyuki MIYAJIMA  Fumihiro CHINA  Taiki YAMAE  Koki YAMAZAKI  Yuta SOMEI  Naonori SEGA  Yoshinao MIZUGAKI  Hiroaki MYOREN  Hirotaka TERAI  Mutsuo HIDAKA  Nobuyuki YOSHIKAWA  Akira FUJIMAKI  

     
    PAPER

      Pubricized:
    2021/03/17
      Vol:
    E104-C No:9
      Page(s):
    435-445

    We developed a Nb 4-layer process for fabricating superconducting integrated circuits that involves using caldera planarization to increase the flexibility and reliability of the fabrication process. We call this process the planarized high-speed standard process (PHSTP). Planarization enables us to flexibly adjust most of the Nb and SiO2 film thicknesses; we can select reduced film thicknesses to obtain larger mutual coupling depending on the application. It also reduces the risk of intra-layer shorts due to etching residues at the step-edge regions. We describe the detailed process flows of the planarization for the Josephson junction layer and the evaluation of devices fabricated with PHSTP. The results indicated no short defects or degradation in junction characteristics and good agreement between designed and measured inductances and resistances. We also developed single-flux-quantum (SFQ) and adiabatic quantum-flux-parametron (AQFP) logic cell libraries and tested circuits fabricated with PHSTP. We found that the designed circuits operated correctly. The SFQ shift-registers fabricated using PHSTP showed a high yield. Numerical simulation results indicate that the AQFP gates with increased mutual coupling by the planarized layer structure increase the maximum interconnect length between gates.