The chemical stability of the constituent elements in polycrystalline Sr-Bi-Ta-O thin film with various Bi content prepared by metalorganic chemical vapor deposition (MOCVD) was investigated by X-ray photoelectron spectroscopy (XPS). Moreover, that of the epitaxial films was also investigated to estimate the effect of the grain boundary in polycrystalline films. Therefore, only the Bi element drastically changed from Bi3+ state to Bi0 one by the Ar sputtering. This change increased with increasing the Ta/Bi mole ratio in the film from 0.64 to 1.67. This result was observed not only for the polycrystalline films but also for the epitaxial films, suggesting that this is the grain character not grain boundary one. The stability and the leakage character of the film strongly depend on the constituent of the film.

Surface morphology and piezo response on SBT films were simultaneously measured by scanning probe microscopy. In a sample that had many short-circuited capacitor pads, some curious structures were observed on the SBT film surface. The piezo image partially did not correspond with the AFM image. Some specific grains were revealed to be piezo defects. Also observed were some smaller grains with flat surface, which showed good ferroelectricity. Next, we carried out simultaneous measurements of surface morphology and leakage current. The scanning at an intentionally high voltage was repeated until the leakage points were found. We found the leakage points, which were on some large grains, not at grain boundaries or on the flat smaller grains. In another SBT film derived from an unrefined source, many ferroelectric defects were observed despite there being no curious structures on the surface. Purity has an important bearing on the ability to avoid these defects. Thus, these nanoscopic investigations would greatly facilitate understanding of the mechanisms responsible for problems and enable optimization of the process conditions in device fabrication.

We prepared alkoxide solutions to fabricate SrBi2Ta2O9 (SBT) ferroelectric capacitors with IrO2 electrodes. In this process, to minimize excess bismuth, the Sr : Bi : Ta mole ratio was kept at 0. 9 : 2. 1 : 2. 0, i. e. , nearly stoichiometric. Three types of solution - mixed-only (MIX), complexed (COMP), and hydrolyzed (HYD) - were used. The HYD capacitor had low absolute leakage current, 10-7 A/cm2 order, and good saturation properties to 6 V. When voltage was applied to each capacitor at 2 to 6 V, MIX and COMP capacitors showed only partial hysteresis loops due to a high leakage current, reflecting the I-V characteristics. These results are probably due to film density caused by metaloxane network bonding. A fatigue endurance test was conducted using cycling of polarization switching at 6 V using the HYD capacitor with IrO2 electrodes. Slight changes were, however, observed in hysteresis loop configuration, but good hysteresis properties were kept up to 1. 04 1012 cycles. We compared SBT ferroelectric thin films fabricated with Pt electrodes and with IrO2 electrodes. Scarcely any difference due to SBT in the XRD pattern was seen, depending on the substrate material. We found that the use of IrO2 electrodes had the effect of decreasing the crystallization temperature. On Pt and IrO2 electrodes, the two films have surface morphology quite different from that of the rod-like structure wellknown for SBT films prepared using a metal 2-ethylhexanate solution. Their surfaces show a similar morphology with relatively large, closely packed grains. A comparison of the I-V characteristics after reannealing showed that the capacitor with IrO2 electrodes had a higher leakage current than that with Pt electrodes. The leakage current was probably due to the density of the film and interface between the SBT film and electrodes.

The crystallization process of Sr0. 7Bi2. 3Ta2O9 (SBT) ferroelectric thin films with different crystal orientations formed by chemical liquid deposition using an alkoxide precursor was investigated. One film showed strong c-axis orientation (a-type film), while another shows scarcely any c-axis orientation (b-type film). We report that the crystallization process was the same even when crystal orientation differed. Thin films first change from amorphous to fluorite fine grains; the fluorite grains then change to bismuth layer-structure grains. The different orientation of the SBT films is not caused by different crystallization process. Both SBT films with different crystal orientations consist of fine fluorite grains after 650 heat-treatment. Their leakage current density characteristics differ, however. The leakage current density of the a-type film was independent of the electric field, and showed a low value of 10-8 A/cm2. The leakage current density of the b-type film, however, was dependent on the electric field, and increased continuously with the increasing electric field. After 700 heat-treatment, both films consist of large grains with bismuth layer-structure and fine fluorite grains. The matrix of both films contains large grains with bismuth layer-structure that determines the leakage current density characteristics. Since the fluorite grain size after a 700 heat-treatment is the same as that after 650 heat-treatment, nucleation is predominant at the structural phase boundary from amorphous to fluorite. The bismuth layer-structure grains are large and single-crystal grains after both a 700 and 800 heat-treatment. Increased grain size predominates at the structural phase boundary from fluorite to bismuth layer-structure grains. Clearly, ferroelectric SBT films with bismuth layer-structure are crystallized in two steps, each having a different predominant crystal growth mechanism.

An improved numerical computation model is presented to calculate the metal-ferroelectric-semiconductor field effect transistor (MFSFET) characteristics with a sufficiently large gate area which can be applied for large drain voltages. In the presented model, the polarization of the ferroelectric gate insulator is inhomogeneous and treated as a variable along the channel. We have calculated electrical properties of SrBi2Ta2O9/Si MFSFETs and demonstrate that the conventional model, in which the polarization of the ferroelectric gate insulator (Pd) is treated as a constant, overestimate the drain current when the drain voltage is large. In addition, effects of the ratio of remanent polarization to spontaneous polarization (Pr/Ps ratio) of the ferroelectric film on the transistor characteristics are discussed.

Sr0. 7Bi2. 3Ta2O9(SBT) films are drawing attention as fatigue-free materials. We prepared an SBT film containing discontinuous crystals in the Bi-layered compound using a misted deposition method. In comparison to films prepared by the spin-on method, leakage current was low and spontaneous polarization is high but saturation performance was low. The low saturation performance seems attributable to the inclusion of discontinuous crystals in the Bi-layered compound, while the low leakage current may be explained by the films smaller, denser particles, which form a film without voids, resulting in higher uniformity. The misted deposition method has advantages of finer grain size and higher uniformity.