1-9hit |
Hirotake KAJII Masato ISE Hitoshi TANAKA Takahiro OHTOMO Yutaka OHMORI
The effects of the gate dielectrics on ambipolar transport in top-gate-type polymer light-emitting transistors with single-layer and bilayer gate dielectrics are investigated. Hole field-effect mobility is dependent on the dielectric constant of the gate dielectric onto the active layer. Hole transport of devices is affected by the dipolar disorder in the first gate dielectric layer on the active layer. Electron threshold voltage tends to decrease with increasing the total stacked gate capacitance.
Jae Hwa SEO Jae Sung LEE Yun Soo PARK Jung-Hee LEE In Man KANG
A gate-all-around tunneling field-effect transistor (GAA TFET) with local high-k gate-dielectric and tunneling-boost n-layer based on silicon is demonstrated by two dimensional (2D) device simulation. Application of local high-k gate-dielectric and n-layer leads to reduce the tunneling barrier width between source and intrinsic channel regions. Thus, it can boost the on-current (Ion) characteristics of TFETs. For optimal design of the proposed device, a tendency of device characteristics has been analyzed in terms of the high-k dielectric length (Lhigh-k) for the fixed n-layer length (Ln-layer). The simulation results have been analyzed in terms of on- and off-current (Ion and Ioff), subthreshold swing (SS), and RF performances.
Akio OHTA Daisuke KANME Hideki MURAKAMI Seiichiro HIGASHI Seiichi MIYAZAKI
A stacked structure consisting of ∼ 1 nm-thick MgO and ∼ 4 nm-thick HfO2 was formed on thermally grown SiO2/Si(100) by MOCVD using dipivaloymethanato (DPM) precursors, and the influences of N2 anneal on interfacial reaction and defect state density in this stacked structure were examined. The chemical bonding features of Mg atom were evaluated by using an Auger parameter independently of positive charge-up during XPS measurements. With Mg incorporation into HfO2, a slight decrease in the oxidation number of Mg was detectable. The result suggests that Mg atoms are incorporated preferentially near oxygen vacancies in the HfO2, which can be responsible for a reduction of the flat band voltage shifts observed from C-V characteristics.
Kodai KIKUCHI Fanghua PU Hiroshi YAMAUCHI Masaaki IIZUKA Masakazu NAKAMURA Kazuhiro KUDO
We have demonstrated the inverter operation of stacked-structure CMOS devices using pentacene and ZnO as active layers. The fabrication process of the device is as follows: A top-gate-type ZnO thin-film transistor (TFT), working as an n-channel transistor, was formed on a glass substrate. Then, a bottom-gate-type pentacene TFT, as a p-channel transistor, was fabricated on top of the ZnO TFT while sharing a common gate electrode. For both TFTs, solution-processed silicone-resin layers were used as gate dielectrics. The stacked-structure CMOS has several advantages, for example, easy patterning of active material, compact device area per stage and short interconnection length, as compared with the planar configuration in a conventional CMOS circuit.
Wutthinan JEAMSAKSIRI Abdelkarim MERCHA Javier RAMOS Stefaan DECOUTERE Florence CUBAYNES
The problems with the CV characterization on very leaky (thin) nitrided oxide are mainly due to the measurement precision and MOS gate dielectric model accuracy. By doing S-parameter measurement at RF frequency and using simple but reasonably accurate model, we can obtain proper CV curves for very thin nitrided gate dielectrics. Regarding the measurement frequency we propose a systematic method to find a frequency range in which we can select measurement frequencies for all biases to obtain a full CV curve. Moreover, we formulated the first order relationship between the measurement frequency range and the test structure design for CV characterization. With the established formulae, we redesigned the test structures and verified that the formulae can be used as a guideline for the test structure design for RFCV measurements.
Takaaki KAWAHARA Kazuyoshi TORII
The process mapping of the ALD process of HfO2 using HfCl4 and H2O is reported. A thickness uniformity better than 3% was achieved over a 300 mm-wafer at a deposition rate of 0.52 Å/cycle. Usually, H2O purge period is set less than 10 sec to obtain reasonable throughput; however, the amounts of residual impurities (Cl, H) found to be in the order of sub%, and these impurities are piled up near the HfO2/Si interface. In order to reduce the piled up impurities, we proposed a 2-step deposition in which purge period for initial 10-20 cycles was set to be 90 sec and that for remaining cycles was usual value of 7.5 sec. The leakage current is reduced to 1/10 by using this 2-step deposition.
Kenzo MANABE Kazuhiko ENDO Satoshi KAMIYAMA Toshiyuki IWAMOTO Takashi OGURA Nobuyuki IKARASHI Toyoji YAMAMOTO Toru TATSUMI
We studied nitrogen incorporation in Al2O3 gate dielectrics by nitrogen plasma and examined the dependence of the electrical properties on the nitrogen incorporation. We found that the nitrogen concentration and profile in Al2O3 films thinner than 3 nm can be controlled by the substrate temperature and the plasma conditions. The electrical characterization showed that the plasma nitridation suppresses charges in Al2O3 films and prevents dopant penetration through the gate dielectric without increasing the leakage current or the interfacial trap density. We also demonstrated the improved performance of a metal-oxide-semiconductor field effect transistor by using a plasma nitrided Al2O3 gate dielectric. These results indicate that plasma nitridation is a promising method for improving the electrical properties of Al2O3 gate dielectrics.
Takashi YAMAMOTO Yukiko IZUMI Naoyuki SUGIYAMA Kazuhiro YOSHIKAWA Hideki HASHIMOTO Yoshihiro SUGITA
We prepared HfO2 films by atomic layer deposition (ALD) on three kinds of silicon substrate surfaces (chemical oxide, HF-last surface and thermal oxide), and characterized their morphologies, structures, compositions, and crystallinities by physical analysis. The results revealed that the as-deposited HfO2 films consisted of nano-crystalline particles with a different crystalline system from that of the annealed films. The size of the nano-crystalline particles on the film on the chemical oxide was smaller than those on the other surfaces. The reason is thought to be the difference in OH concentration on the substrate surface. The predominant crystalline phases of all HfO2 films were monoclinic after annealing. Moreover, the film prepared on the chemical oxide had the smoothest surface after annealing. However, island structures with grain boundaries developed in the films on the other surfaces.
Yusuke MORISAKI Takayuki AOYAMA Yoshihiro SUGITA Kiyoshi IRINO Toshihiro SUGII Tomoji NAKAMURA
The characteristics of HfO2 gate stacks, which consisted of the SiN layer deposited between the HfO2 and poly-Si gate electrode and the SiON interfacial layer were investigated. The SiN layer played important role to reduce the leakage current caused by the defect of the crystallized HfO2. The SiN layer was also effective to achieve the prevention of the interfacial reaction, the suppression of dopant penetration. Furthermore, that stack structure indicated excellent TDDB reliability fabricated by conventional high temperature processes.