Small-size MOSFETs are becoming core devices in RF applications because of improved high frequency characteristics. For reliable design of RF integrated circuits operating at the GHz range, accurate modeling of small-size MOSFET characteristics is indispensable. In MOSFETs with reduced gate length (Lg), the lateral field along the MOSFET channel is becoming more pronounced, causing short-channel effects. These effects should be included in the device modeling used for circuit simulation. In this work, we investigated the effects of the field gradient in the gate-drain capacitance (Cgd). 2-Dimensional (2D) simulations done with MEDICI show that the field gradient, as it influences the channel condition, induces a capacitance which is visible in the MOSFET saturation operation. Changes in Cgd is incorporated in the modeling by an induced capacitance approach. The new approach has been successfully implemented in the surface-potential based model HiSIM (Hiroshima-university STARC IGFET Model) and is capable of reproducing accurately the measured Cgd-Lg characteristics, which are particularly significant for pocket-implant technology. Results show that pocket-implantation introduces a steep potential increase near the drain region, which results to a shift of the Cgd transition region (from linear to saturation) to lower bias voltages. Cgd at saturation decreases with Lg due to steeper surface potential and increased impurity concentration effects at reduced Lg.

We have developed a model for circuit-simulation which describes the MOSFET region from pinch-off to drain contact based on the surface potential. The model relates the surface-potential increase beyond the pinch-off point to the channel/drain junction profile by applying the Gauss law with the assumption that the lateral field is greater than the vertical one. Explicit equations for the lateral field and the pinch-off length are obtained, which take the potential increase in the drain overlap region into account. The model, as implemented into a circuit simulator, correctly reproduces measured channel conductance and overlap capacitance for 100 nm pocket-implant technologies as a function of bias condition and gate length.

We have developed a new simulation methodology for predicting shot noise intensity in Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET). In our approach, shot noise in MOSFETs is calculated by employing a two dimensional device simulator in conjunction with the shot noise model of a p-n junction. The accuracy of the noise model has been demonstrated by comparing simulation results with measured noise data of p-n diodes. The intensity of shot noise in various n-MOSFET devices under various bias conditions was estimated beyond GHz operational frequency by using our simulation scheme. At DC or low-frequency region, sub-threshold current dominates the intensity of shot noise. Therefore, shot noise is independent on frequency in this region, and its intensity is exponentially depends on VG, proportional to L-1, and almost independent on VD. At high-frequency region above GHz frequency, on the other hand, shot noise intensity depends on frequency and is much larger than that of low-frequency region. In particular, the intensity of the RF shot noise is almost independent on L, VD and VG. This suggests that high-frequency shot noise intensity of MOSFETs is decided only by the conditions of source-bulk junction.

This report focuses on an optimization scheme of advanced MOSFETs for designing CMOS circuits with high power efficiency. For this purpose the physics-based compact model HiSIM2 is applied so that the relationship between device and circuit characteristics can be investigated properly. It is demonstrated that the short-channel effect, which is usually measured by the threshold-voltage shift relative to long-channel MOSFETs, provides a consistent measure for device-performance degradation with reduced channel length. However, performance degradations of CMOS circuits such as the power loss cannot be predicted by the threshold-voltage shift alone. Here, the subthreshold swing is identified as an additional important measure for power-efficient CMOS circuit design. The increase of the subthreshold swing is verified to become obvious when the threshold-voltage shift is larger than 0.15V.

The degradation of a SiC-MOSFET-based DC-AC converter-circuit efficiency due to aging of the electrically active devices is investigated. The newly developed compact aging model HiSIM_HSiC for high-voltage SiC-MOSFETs is used in the investigation. The model considers explicitly the carrier-trap-density increase in the solution of the Poisson equation. Measured converter characteristics during a 3-phase line-to-ground (3LG) fault is correctly reproduced by the model. It is verified that the MOSFETs experience additional stress due to the high biases occurring during the fault event, which translates to severe MOSFET aging. Simulation results predict a 0.5% reduction of converter efficiency due to a single 70ms-3LG, which is equivalent to a year of operation under normal conditions, where no additional stress is applied. With the developed compact model, prediction of the efficiency degradation of the converter circuit under prolonged stress, for which measurements are difficult to obtain and typically not available, is also feasible.