We report on robust and low-power-consumption InP- and GaN-HEMT Low-Noise-Amplifiers (LNAs) operating in Q-band frequency range. A multi-stage common-gate (CG) amplifier with current reuse topology was used. To improve the survivability of the CG amplifier, we introduced a feedback resistor at the gate bias feed. The design technique was adapted to InP- and GaN-HEMT LNAs. The 75nm gate length InP HEMT LNA exhibited a gain of 18dB and a noise figure (NF) of 3dB from 33 to 50GHz. The DC power consumption was 16mW. The Robustness of the InP HEMT LNA was tested by injecting a millimeter-wave input power of 13dBm for 10 minutes. No degradation in a small signal gain was observed. The fabricated 0.12µm gate length GaN HEMT LNA exhibited a gain of 15dB and an NF of 3.2dB from 35 to 42GHz. The DC power consumption was 280mW. The LNA survived until an input power of 28dBm.

We have developed InGaP-channel field effect transistors (FETs) with high breakdown voltages that can be fabricated by using conventional GaAs FET fabrication processes. The buffer and barrier layers were also optimized for the realization of high-voltage operation. The InGaP-channel FET has an extremely high on-state drain-to-source breakdown voltage of over 40 V, and a gate-to-drain breakdown voltage of 55 V. This enabled high-voltage large-signal operation at 40 V. The third-order intermodulation distortion of the InGaP channel FETs was 10-20 dB lower than that of an equivalent GaAs-channel FET, due to the high operating voltage.

Gallium nitride high electron mobility transistors (GaN HEMTs) were developed for millimeter-wave high power amplifier applications. The device with a gate length of 80 nm and an InAlN barrier layer exhibited high drain current of more than 1.2 A/mm and high breakdown voltage of 73,V. A cut-off frequency $ extrm{f}_{ extrm{T}}$ of 113,GHz and maximum oscillation frequency $ extrm{f}_{ extrm{max}}$ of 230,GHz were achieved. The output power density reached 1 W/mm with a linear gain of 6.4,dB at load-pull measurements at 90,GHz. And we extracted equivalent circuit model parameters of the millimeter-wave InAlN/GaN HEMT and showed that the model was useful in simulating the millimeter-wave power performance. Also, we report a preliminary constant bias stress test result.

Highly reliable GaN high electron mobility transistors (HEMTs) are demonstrated for 3G-wireless base station applications. A state-of-the-art 250-W AlGaN/GaN-HEMTs push-pull transmitter amplifier operated at a drain bias voltage of 50 V is addressed with high efficiency under W-CDMA signals. The amplifier, combined with a digital pre-distortion (DPD) system, also achieved an adjacent channel leakage power ratio (ACLR) of less than -50 dBc for 4-carrier W-CDMA signals. Memory effect and temperature characteristics are also discussed. A stable operation including gate leakage current under RF stress testing for 1000 h is demonstrated at a drain bias voltage of 60 V. AlGaN/GaN HEMTs on an n-type doped 3-inch SiC substrate is introduced towards low cost manufacturing for the first time.

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines and the amplifier has a bandwidth of beyond 110 GHz. The transmission line on the substrate consists of grounded coplanar waveguides that yield low insertion loss and high isolation characteristics in coupled lines even in mold resin in comparison with conventional microstrip lines. The CSP amplifier achieved a gain of 7.8 dB, a 3-dB bandwidth of 97 GHz, and operated up to 100 GHz. To the best of our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP. We also investigated the transmission characteristics of lead-free solder bumps through experiments by assemblying CSPs on printed circuit boards and modeling them so that we could design the packages accurately.

Second harmonic signal feedback technique is applied to an HBT power amplifier for Wide-band CDMA (W-CDMA) mobile communication system to improve its linearity and efficiency. This paper describes the feedback effect of the 2nd harmonic signal from the output of the amplifier to the input on the 3rd order intermodulation distortion (IMD) products and Adjacent Channel leakage Power (ACP) of the power amplifier. The feedback amplifier, using an InGaP/GaAs HBT with 48 fingers of 3 20 µ m emitter, exhibits a 10 dB reduction in the level of the 3rd order IMD products. In addition, an ACP improvement of 7 dB for the QPSK modulation signal with a chip rate of 4.096 Mcps at 1.95 GHz was realized. As a result, the amplifier achieves a power-added efficiency of 41.5%, gain of 15.3 dB, and ACP of 43.0 dBc at a 5 MHz offset frequency and output power of 27.5 dBm. At the output power of 28 dBm, the power-added efficiency increases to 43.3% with an ACP of 40.8 dBc.