We report on robust and low-power-consumption InP- and GaN-HEMT Low-Noise-Amplifiers (LNAs) operating in Q-band frequency range. A multi-stage common-gate (CG) amplifier with current reuse topology was used. To improve the survivability of the CG amplifier, we introduced a feedback resistor at the gate bias feed. The design technique was adapted to InP- and GaN-HEMT LNAs. The 75nm gate length InP HEMT LNA exhibited a gain of 18dB and a noise figure (NF) of 3dB from 33 to 50GHz. The DC power consumption was 16mW. The Robustness of the InP HEMT LNA was tested by injecting a millimeter-wave input power of 13dBm for 10 minutes. No degradation in a small signal gain was observed. The fabricated 0.12µm gate length GaN HEMT LNA exhibited a gain of 15dB and an NF of 3.2dB from 35 to 42GHz. The DC power consumption was 280mW. The LNA survived until an input power of 28dBm.

At mm-wave frequency, the layout of CMOS transistors has a larger effect on the device performance than ever before in low frequency. In this work, the distance between the gate and drain contact (Dgd) has been enlarged to obtain a better maximum available gain (MAG). By using the asymmetric-layout transistor, a 0.6 dB MAG improvement is realized when Dgd changes from 60 nm to 200 nm. A four-stage common-source low noise amplifier is implemented in a 65 nm CMOS process. A measured peak power gain of 24 dB is achieved with a power dissipation of 30 mW from a 1.2-V power supply. An 18 dB variable gain is also realized by adjusting the bias voltage. The measured 3-dB bandwidth is about 17 GHz from 51 GHz to 68 GHz, and noise figure (NF) is from 4.0 dB to 7.6 dB.

We developed a 300-GHz high gain amplifier MMIC in 75-nm InP high electron mobility transistor technology. We approached the issues with accurate characterization of devices to design the amplifier. The on-wafer through-reflect-line calibration technique was used to obtain accurate transistor characteristics. To increase measurement accuracy, a highly isolated structure was used for on-wafer calibration standards. The common source amplifier topology was used for achieving high gain amplification. The implemented amplifier MMIC exhibited a gain of over 25 dB in the 280-310-GHz frequency band.

Gallium nitride high electron mobility transistors (GaN HEMTs) were developed for millimeter-wave high power amplifier applications. The device with a gate length of 80 nm and an InAlN barrier layer exhibited high drain current of more than 1.2 A/mm and high breakdown voltage of 73,V. A cut-off frequency $ extrm{f}_{ extrm{T}}$ of 113,GHz and maximum oscillation frequency $ extrm{f}_{ extrm{max}}$ of 230,GHz were achieved. The output power density reached 1 W/mm with a linear gain of 6.4,dB at load-pull measurements at 90,GHz. And we extracted equivalent circuit model parameters of the millimeter-wave InAlN/GaN HEMT and showed that the model was useful in simulating the millimeter-wave power performance. Also, we report a preliminary constant bias stress test result.

This paper presents recent progress on high frequency and wide bandwidth GaN high power amplifiers (PAs) that are usable for high-data-rate wireless communications and modern radar systems. The key devices and design techniques for PA are described in this paper. The results of the state-of-the art GaN PAs for microwave to millimeter-wave applications and design methodology for ultra-wideband GaN PAs are shown. In order to realize high output power density, InAlGaN/GaN HEMTs were employed. An output power density of 14.8 W/mm in S-band was achieved which is 1.5 times higher than that of the conventional AlGaN/GaN HEMTs. This technique was applied to the millimeter-wave GaN PAs, and a measured power density at 96 GHz was 3 W/mm. The modified Angelov model was employed for a millimeter-wave design. W-band GaN MMIC achieved the maximum Pout of 1.15 W under CW operation. The PA with Lange coupler achieved 2.6 W at 94 GHz. The authors also developed a wideband PA. A power combiner with an impedance transformation function based on the transmission line transformer (TLT) technique was adopted for the wideband PA design. The fabricated PA exhibited an average Pout of 233 W, an average PAE of 42 %, in the frequency range of 0.5 GHz to 2.1 GHz.

In this paper, we describe the operation of circuits capable of more than 40-Gbit/s that we have developed using InP HEMT technology. For example, we succeeded in obtaining 43-Gbit/s operation for a full-rate 4:1Multiplier (MUX), 50-Gbit/s operation for a Demultiplexer (DEMUX), 50-Gbit/s operation for a D-type flip-flop (D-FF), and a preamplifier with a bandwidth of 40 GHz. In addition, the achievement of 90-Gbit/s operation for a 2:1MUX and a distributed amplifier with over 110-GHz bandwidth indicates that InP HEMT technology is promising for system operations of over 100 Gbit/s. To achieve these results, we also developed several design techniques to improve frequency response above 80 GHz including a symmetric and separated layout of differential elements in the basic SCFL gate and inverted microstrip.

We fabricate and characterize a GaAsSb/InGaAs backward diode (BWD) toward a realization of high sensitivity zero bias microwave rectification for RF wave energy harvest. Lattice-matched p-GaAsSb/n-InGaAs BWDs were fabricated and their current-voltage (I-V) characteristics and S-parameters up to 67 GHz were measured with respect to several sorts of mesa diameters in μm order. Our theoretical model and analysis are well fitted to the measured I-Vs on the basis of WKB approximation of the transmittance. It is confirmed that the interband tunneling due to the heterojunction is a dominant transport mechanism to exhibit the nonlinear I-V around zero bias regime unlike recombination or diffusion current components on p-n junction contribute in large current regime. An equivalent circuit model of the BWD is clarified by confirming theoretical fitting for frequency dependent admittance up to 67 GHz. From the circuit model, eliminating the parasitic inductance component, the frequency dependence of voltage sensitivity of the BWD rectifier is derived with respect to several size of mesa diameter. It quantitatively suggests an effectiveness of mesa size reduction to enhance the intrinsic matched voltage sensitivity with increasing junction resistance and keeping the magnitude of I-V curvature coefficient.

A wide-bandwidth fundamental mixer operating at a frequency above 110GHz for precise spectrum analysis was developed using the InP HEMT technology. A single-ended resistive mixer was adopted for the mixer circuit. An IF amplifier and LO buffer amplifier were also developed and integrated into the mixer chip. As for packaging into a metal block module, a flip-chip bonding technique was introduced. Compared to face-up mounting with wire connections, flip-chip bonding exhibited good frequency flatness in signal loss. The mixer module with a built-in IF amplifier achieved a conversion gain of 5dB at an RF frequency of 135GHz and a 3-dB bandwidth of 35GHz. The mixer module with an LO buffer amplifier operated well even at an LO power of -20dBm.

In this paper, we present the development of an advanced MMIC receiver for a 94-GHz band passive millimeter-wave (PMMW) imager. Our configuration is based on a Dicke receiver in order to reduce fluctuations in the detected voltage. By introducing an electronic switch in the MMIC, we achieved a high resolution millimeter-wave image in a shorter image collection time compared to that with a conventional mechanical chopper. We also developed an imaging array using MMIC receivers.

A high-efficiency uniform/selective heating microwave oven was developed. Because the power amplifier requires high-efficiency characteristics to function as a microwave source, a free-standing Gallium Nitride (GaN) substrate was applied in this study. By applying a harmonic tuning circuit, an output power of 71 W and PAE of 73% were achieved in pulsed operation, and an output power of 63 W and PAE of 69% were achieved in CW operation. Moreover, we fabricated a prototype PA module that consists of an oscillator, a driver amplifier, PA, and other RF circuits. The output power was controlled by pulse width modulation to maintain high efficiency regardless of output power. We evaluated the arrangement of antenna polarizations to isolate each antenna. By suppressing the interference of output from adjacent antennas, it is possible to irradiate the object on the top surface of the antenna, thereby demonstrating heating characteristics with small temperature unevenness. The prototype microwave oven successfully demonstrated uniform/selective heating.

This work shows a broadband, high-efficiency power amplifier (PA) monolithic microwave integrated circuit (MMIC) that uses InP-based metal-oxide-semiconductor (MOS) high-electron-mobility transistors (HEMTs) with an extended drain-side access region and broadband conjugate matching topology. Advanced device technologies, namely, double-side-doped structures, MOS gate structures, and asymmetric gate recess, were adopted, and the length of the drain-side access region was optimized to simultaneously obtain high power and efficiency. A common-source PA MMIC based on InP-based MOS-HEMTs was fabricated, and an interstage circuit was designed to maximize the S21 per unit stage in the broadband, resulting in a record-high power-added efficiency and wide bandwidth.