This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15 µm CMOS using this method and confirmed that 10% τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90 nm, 65 nm and 55 nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

Timing closure in LSI design is becoming more and more difficult. But the conventional interconnect RC extraction method has over-margins caused by its corner conditions settings. In this paper, statistical corner conditions using the independence of variations between process parameters and between interconnect layers are proposed, with examinations using the measurement data. As a result of the method, the fast-to-slow guardband decreases by half in average, compared to the conventional method. The proposed method is ready for implementation to LPE tools.

A compact model is proposed for accurately incorporating effects of STI (shallow trench isolation) stress into post-layout simulation by making layout-dependent corrections to SPICE model parameters. The model takes in-plane (longitudinal and transverse) and normal components of the layout-dependent stress into account, and model formulas are devised from physical considerations. Not only can the model handle the shape of the active-area of any MOSFET conforming to design rules, but also considers distances to neighboring active-areas. Extraction of geometrical parameters from the layout can be performed by standard LVS (layout versus schematic) tools, and the corrections can subsequently be back-annotated into the netlist. The paper spells out the complete formulation by presenting expressions for the mobility and the threshold voltage explicitly by way of example. The model is amply validated by comparisons with experimental data from 90 nm- and 65 nm-CMOS technologies having the channel orientations of, respectively, <110> and <100>, both on a (100) surface. The worst-case standard errors turn out to be as small as 1.7% for the saturation current and 8 mV for the threshold voltage, as opposed to 20% and 50 mV without the model. Since device characteristics variations due to STI stress constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

Layout-aware compact models proposed so far have been generally verified only for simple test patterns. However, real designs use much more complicated layout patterns. Therefore, models must be verified for such patterns to establish their practicality. This paper proposes a methodology and test patterns for exhaustively and systematically validating layout-aware compact models for general layout patterns for the first time. The methodology and test patterns are concretely shown through validation of a shallow trench isolation (STI) stress compact model proposed in [1]. First, the model parameters for a 55-nm CMOS technology are extracted, and then the model is verified and established to be accurate for the basic patterns used for parameter extraction. Next, fundamental ideas of model operation for general layout patterns are verified using various verification patterns. These tests revealed that the model is relatively weak in some cases not included in the basic patterns. Finally, the errors for these cases are eliminated by enhancing the algorithm. Consequently, the model is confirmed to have high generality. This methodology will be effective for validating other layout-aware compact models for general layout patterns.

A novel interconnect design concept named "ASIS (Appilication-specific Interconnect Structure)" is presented for 45 nm CMOS performance maximization. Basic scheme of ASIS is that corresponding to applications, such as high-performance, low-power, or high reliability, interconnect structure as well as metal thickness is individually optimized in order to maximize chip-level performance matched to the application. Our investigation shows that for low-power application, the increased resistivity of scaled-down Cu-wire is not a main issue, so that thinner wire is more advantageous. For high-performance application, partially double pitch structure for local and intermediate layers is advantageous. For high-reliability requirement, Cu-Al alloy or CoWP cap-metal is quite effective for boosting reliability.