This paper studies the performance of the quantitative RF power variation in Radio-over-Fiber beam forming system utilizing a phased array-antenna integrating photo-diodes in downlink network for next generation millimeter wave band radio access. Firstly, we described details of fabrication of an integrated photonic array-antenna (IPA), where a 60GHz patch antenna 4×2 array and high-speed photo-diodes were integrated into a substrate. We evaluated RF transmission efficiency as an IPA system for Radio-over-Fiber (RoF)-based mobile front hall architecture with remote antenna beam forming capability. We clarified the characteristics of discrete and integrated devices such as an intensity modulator (IM), an optical fiber and the IPA and calculated RF power radiated from the IPA taking account of the measured data of the devices. Based on the experimental results on RF tone signal transmission by utilizing the IPA, attainable transmission distance of wireless communication by improvement and optimization of the used devices was discussed. We deduced that the antenna could output sufficient power when we consider that the cell size of the future mobile communication systems would be around 100 meters or smaller.

An energy efficient modulator for an ultra-low-power (ULP) 60-GHz IEEE transmitter is presented in this paper. The modulator consists of a differential duobinary coder and a semi-digital finite-impulse-response (FIR) pulse-shaping filter. By virtue of differential duobinary coding and pulse shaping, the transceiver successfully solves the adjacent-channel-power-ratio (ACPR) issue of conventional on-off-keying (OOK) transceivers. The proposed differential duobinary code adopts an over-sampling precoder, which relaxes timing requirement and reduces power consumption. The semi-digital FIR eliminates the power hungry digital multipliers and accumulators, and improves the power efficiency through optimization of filter parameters. Fabricated in a 65nm CMOS process, this modulator occupies a core area of 0.12mm2. With a throughput of 1.7Gbps/2.6Gbps, power consumption of modulator is 24.3mW/42.8mW respectively, while satisfying the IEEE 802.11ad spectrum mask.

This paper presents a novel 60 GHz-band photonic-integrated array-antenna and module for radio-over-fiber (RoF)-based beam forming. An integrated photonic array-antennas (IPA), where eight photodiodes and 4×2 arrayed patch-antenna are integrated in a single board, is actually fabricated, and 3.5-Gbit/s QPSK digital signal transmission with beam forming of the IPA is experimentally demonstrated. In addition, a novel 60-GHz compact antenna module is proposed and fabricated for increasing the number of antenna elements and flexibility creating various beam patterns. The feasibility of beam forming operation for the proposed antenna module is confirmed by a 60-GHz RoF transmission experiment. The capability of detecting the mobile terminal direction, which is one of the indispensable functions for actual environment, is also studied. The obtained results in this paper will be useful for designing future radio access networks based on RoF transmission technology.

A 60-GHz CMOS transmitter with on-chip antenna for high-speed short-range wireless interconnections is presented. The radiation gain of the on-chip antenna is doubled using helium-3 ion irradiation technique. The transmitter core is composed of a resistive-feedback RF amplifier, a double-balanced passive mixer, and an injection-locked oscillator. The wideband and power-saving design of the transmitter core guarantees the low-power and high-data-rate characteristic. The transmitter fabricated in a 65-nm CMOS process achieves 5-Gb/s data rate with an EVM performance of $-$12 dB for BPSK modulation at a distance of 1,mm. The whole transmitter consumes 17,mW from a 1.2-V supply and occupies a core area of 0.64,mm$^{2}$ including the on-chip antenna. The gain-enhanced antenna together with the wideband and power-saving design of the transmitter provides a low-power low-cost full on-chip solution for the short-range high-data-rate wireless communication.

A 60-GHz power amplifier (PA) with a reliability consideration for a hot-carrier-induced~(HCI) degradation is presented. The supply voltage of the last stage of the PA ($V_{{ m PA}}$) is dynamically controlled by an on-chip digitally-assisted low drop-out voltage regulator (LDO) to alleviate HCI effects. A physical model for estimation of HCI degradation of NMOSFETs is discussed and investigated for dynamic operation. The PA is fabricated in a standard 65-nm CMOS process with a core area of 0.21,mm$^{2}$, which provides a saturation power of 10.1,dBm to 13.2,dBm with a peak power-added efficiency~(PAE) of 8.1% to 15.0% for the supply voltage $V_{{ m PA}}$ which varies from 0.7,V to 1.0,V at 60,GHz, respectively.

In order to realize millimeter-wave (MMW) 3-D system-in-package (SiP) front-end modules, we propose a 60-GHz band copper ball vertical interconnection structure, which interconnects between vertically stacked substrates. The structure enables ICs to be placed between the vertically stacked substrates. Since the diameter of the copper balls must exceed the thickness of the ICs, the distance between the substrates in the modules is larger than that of the flip-chip interconnection widely used in the MMW-band. Therefore, the conventional flip-chip interconnection does not scale for the interconnection between the substrates in MMW 3-D SiP front-end modules. The layout of grounded copper balls and the patterns of inner ground layers in the upper/lower substrates are designed using 3-D electromagnetic field simulation. The designed structure allows less than 1 dB transmission loss up to 71.1 GHz, compared with a through transmission line. The result is verified with fabrication and measurement and confirms the feasibility of MMW 3-D SiP front-end modules.

A 60-GHz injection-locked frequency divider (ILFD) is presented. A multi-order LC oscillator topology is proposed to enhance the locking range of the divider. A design guideline is described based on a theoretical analysis of the locking range enhancement. A test chip is fabricated in 65 nm CMOS. Measured locking range with 0 dBm input power is 48.5–62.9 GHz (25.9%), which is 63.6% wider compared to the previously reported ILFD. Power consumption excluding buffers and biasing circuits is 1.65 mW from 1.2 V supply. The core ILFD area is 0.0157 mm2 even with an extra pair of inductors.

Developments in new frequency bands for wireless communications make a broadband channel for new services possible. Great effort has been made researching and developing broadband wireless communication in the 60-GHz millimeter-wave band since the early 1990s. In this paper, we design an ATM (asynchronous transfer mode)-based indoor millimeter-wave wireless local area network (WLAN) that supports multimedia transmissions and focus on the wireless access topic for implementation of wireless ATM. We propose an integrated multimedia transmission protocol, based on the MAC (medium access control) protocol, called RS-ISMA (reservation-based slotted idle signal multiple access). It supports CBR (constant bit rate), VBR (variable bit rate), ABR (available bit rate) and UBR (unspecified bit rate) transmissions and provides QoS (quality of service)-dependent adaptive retransmissions. An RS-ISMA-based prototype full-duplex indoor high-speed WLAN in the 60-GHz band was developed.