In this paper, the relationship between contact materials and sticking characteristics, and stability of contact resistance to obtain excellent contacts for telecommunication relays, is studied. The contact switching current for telecommunication relay is low. Moreover, contact force and opening force in these relay are respectively several mN. Nine kinds of contact materials are selected as a experimental factor. They are Ag, Ag-Ni (Ni: 0.03 to 20%), Ag-Cu 10%, Ag-Pd 60% and Pd-Ru 10%, and are overlaid with gold except Pd-Ru 10%. In this study, contact life tests on a commercial ultra-miniature telecommunication relay by mounting above-mentioned contacts are conducted. The sticking and the contact resistance are monitored at each switching operation in the contact life test. After the life test, the contact surfaces are observed, and the depth of crater, the height of pip and projected concave area are measured, then the relationship between the sticking morphologies and the composition of each material are studied. As the result of this study, the contact sticking of telecommunication rely is assumed to be the result of mechanical locking, and the effects of the Ni content in the Ag-Ni contacts is clarified. Moreover, it is confirmed that the effects of opening force on the sticking characteristics are remarkable.

Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.

In clad contacts of bonded dissimilar metals used in relays and switches, the bonding state affects the switching performance of those devices. Examining the bonding state and analyzing the relationship between the bonding state and the causes of malfunction, such as welding of the contact, leads to improvement in reliability of electromechanical devices. In this experiment we examined, with an ultrasonic microscope, the bonding state in riveted clad contacts which had been subjected to load-breaks of in-rush current, and were able to demonstrate the causal relation of the bonding state with malfunctions of the contacts. The use of the ultrasonic microscope made it possible to perform a hitherto difficult detailed analysis of the bonding state of clad contacts. It was also confirmed that this was an extremely effective method for studying the relationship with switching performance.

The former experimental results have already shown that it is oxide films formed on contact surface causing the contact resistance to degrade in dc. breaking arcs for Ag and Pd materials. In order to understand the detailed information about it, the experiments are performed to break dc. inductive load at 20 V, 0.5 A and 1.0 A in nitrogen gas with different oxygen concentrations. The contact surface morphology and surface contamination are evaluated by SEM and AES, respectively. The tested results demonstrate that, for Ag contact, the severe oxidation occurs with increasing oxygen concentration, and the critical value of oxygen concentration is found to be about 10% and 5% in 0.5 A and 1.0 A, respectively, above those values the contact resistance degrades due to the oxide films formed on the contact surface, especially on the anode surface. While, for Pd contacts, a remarkable contact resistance degradation is not found even at 1.0 A in oxigen. Evidence shows that the arc duration, in particular the gaseous phase arc duration affects the anode oxidation, which in turn causes the significant fluctuation of contact resistance.

The prediction of a relay contact's life is still very important for support and maintenance of the Crossbar Switching Systems. It was found through surveys and experiments that the protected shower arc is the main reason for switching-relay contact erosion at existing Crossbar Switching Systems, if the contacts were not heavily activated. If the contacts were heavily activated, a long sustained steady arc might occur and severely erode the contacts. This paper proposes an arch energy estimation method for the prediction of contact erosion using object-oriented simulation technology when a steady arc occurs at protected contacts. The arc energy is expressed in a simulation model through analysis, and the model was confirmed through experimentation. The simulation model was used for building block programs of an expert system to predict the life span of switching relays in the existing Crossbar Switching Systems.

Arc discharge between electrodes of relays and switches often causes contact surface damage through material transfer and arc erosion. Especially, material transfer sometimes occurs and brings serious failure even under lower load that is quite smaller than the minimum arc current value of contact material. In this paper, contact surface configuration, material transfer, and arc erosion characteristics of Ag and AgPd 60 contacts were experimentally studied after 0.5 or 1 million switching operations at various load levels. The followings can be made clear. Firstly, it was confirmed that the arcs and material transfer occurred even under such current that was lower than the minimum arc current. Therefore, the definition of the arc occurrence boundary current was newly determined. Secondly, the relation between load conditions (current and power supply voltage) and contact surface configuration (craters and pips) caused by material transfer was studied. The arc erosion behaviors of tested samples could be classified into two types: material transfer type and wear-out type. As one of the primary factors of transition from the former type to the latter one, contact activation was considered. The influences of load conditions and organic gas emitted from relay structure on arc characteristics was experimentally examined. The results indicated that load current greatly influenced the amount of material transfer and that power supply voltage affected the occurrence of the wear-out type significantly. The activation behavior of the contact surface could be found through observing the bridge voltage waveform.

The authors have studied mechanism of transition from metallic phase to gaseous phase in contact break arc. For further elucidation of the mechanism, we have carried out spectroscopic measurement. The spectrum measurement system which had high time resolution was composed using two monochromators and a bifurcated image fiber, which had one input port and two output ports. The input port received the arc light, and the two monochromators received the arc light from the two output ports, respectively. The spectral sensitivity of the two monochromators was corrected with a standard lamp. We have measured simultaneously two spectra of break arc for Ag in laboratory air, under the condition where source voltage E=48 V, load inductance L=2.3 mH, and closed contact current I0=6 A. As a result, the time-varying tendency of spectrum intensity is similar for the same element, even if the wavelength is different. And from the comparison of time average spectrum intensity, it is clarified that average intensity for gas spectrum does not attain to 10% of that for metallic atomic spectrum (Ag I, 520.91 nm). In addition, the decrease point of Ag II (ion) spectrum has been found to correspond with the peak of Ag I (atom) spectrum.

The electric or electronic circuits have many contact devices such as relay and switch. The contact between two nominally conducting flat surface has a lot of micro contact spots. The constriction resistance of the contact is known to determine the sum of the parallel resistance of the micro contacts and the interaction of them. The constriction resistance of two circular conducting spots was approximately formulated by Greenwood. This formulation shows that the interacted resistance of two circular spots is in inverse proportion to the distance between two conducting spots. It was known that this effect is introduced by the interaction between two conducting spots. However, the condition of interaction in the spots is not clear. Calculating the current density distribution in the spots is important to clarify the condition of interaction. The numerical analysis is very suitable to calculate the current density in the spots. In the fundamental case of the computation of the current density the boundary element method (BEM) is more efficient and accurate than that of the finite element method (FEM) because the boundary condition at the infinite is naturally satisfied and is not required a great number of the element in a wide space. In this paper the current density in the square spots is computed by the BEM. As the distance between two conducting spots becomes small, the current density in the two spots decreases. It becomes clear that the constriction resistance of conducting spots is increased by this effect. The decrease of current density by interaction is not uniformly, that at the near location to the opposite spot is larger than that at the far location in the same spot. In this paper the constriction resistance of two conducting spots is also considered. It was known that the constriction resistance of one conducting spot is not influenced by the form of spot very much. However, that of two conducting spots is not clear. The constriction resistance of two square spots is also computed by the BEM. The computed values of the constriction resistance of two square spots are compared with that of two circular spots by Greenwood's formulation and other results. As the result, it is clear that they have the considerable discrepancy. However, the trend of the variations is almost agree each other.

Single-crystal LiNbO3 and LiTaO3 piezo-electric resonators were developed for surface-mount technology (SMT) used in electronic equipment manufacturing. Using an energy-trapping design, a shear-mode piezoelectric resonator chip is bonded directly to the board with conductive resin and covered with a ceramic cap. The process occasionally produces nonlinear resonators, however, which led us to study the frequency characteristics of impedances for the abnormal samples. Their input impedances at the resonant frequency depended on the driving voltage. The insulator between the thin film metal electrode on the crystal strip or the thick film electrode on the ceramic base, in conjunction with silver balls in the adhesive resin, apparently caused the problem. Assuming that the insulator makes diode contacts, which show stable nonohmic phenonena or cause a discharge in a conductor causing a drastically changing in the impedance, we proposed the following corrective action：subject the nonohmic contacts to a high-voltage frequency-swept signal near the resonant frequency. The samples subjected to the high voltages recovered metalic contact and maintained even after severe thermal cycle testing.

Composite materials of solid lubricants, such as graphite, MoS2, WS2, etc., and metals are being used as the sliding electrical contacts. However, few reports have so far been presented on the detailed characteristics of such composite materials. It is shown in this report that contact resistance and coefficient of friction of the sliding contact of the composite material of Cu-Nb system against Cu were higher than those of the sliding contact of the composite material of Cu-Sn system against Cu. It was, further, found that composite materials of Cu-Sn system were superior to those of Cu-Nb system being both contact resistances and coefficients of friction lowered. At the same time, it was found that performances of composite materials of Cu-Sn alloy base containing exclusively WS2 were superior to those containing both WS2 and MoS2. It was, therefore, suggested that proper samples suitable for the service conditions should be selected from the composite materials of Cu-Sn system which contain exclusively WS2 for the practical applications.

On the surface of contacts which are exposed to the atmosphere, the reaction with gases in the atmosphere produces contaminant films including oxides. The contact reliability is degraded by the contaminant films. Humidity in the atmospheric environment also influences on the surface of contacts. However, influence of humidity on the surface has not been clarified. In the present paper, influence of humidity on the Cu surface and the oxides (CuO + Cu2O) on it were studied with respect to the thickness of the oxide film and contact resistance characteristics both for static and for sliding contacts. The thickness was measured by ellipsometric analysis. Topographic image affected by humidification was also observed by scanning tunneling microscope (STM). In the atmospheric environment, the clean surface of Cu was found to oxidize with fluctuations of the thickness for lapse of exposure time due to the fluctuations of the humidity. It was also found that the thickness of the oxide film decreases immediately after the humidification, and increases under dehumidification. Changes in contact resistance affected by humidity was corresponding to the change in the film thickness. Immediately after humidification contact resistance decreased, and increased with dehumidification both for static and for sliding contacts. For the mechanism of the influence of humidity on the oxide, chemical reduction of hydrogen generated by decomposition of the absorbed water molecule (H2O) was derived. The clean Cu surface was oxidized by oxygen due to absorbed water molecule and atmosphere.

We fabricated and investigated HEMTs with nonalloyed ohmic contacts using highly conductive n+-ln0.5Ga0.5 As contact layers. We optimized the growth condition of n+-In0.5 Ga0.5As contact layers by MOVPE. Using WSi/W nonalloyed ohmic electrodes, we fabricated InGaP/InGaAs/GaAs pseudomorphic HEMTs with thermal stability of 500 for 30 minutes. In order to examine the scalability of HEMT devices, we tried to reduce the total size of HEMT devices to 3.2 µm using nonalloyed ohmic electrodes, which is the smallest value as far as we know. We could reduce the nonalloyed ohmic contact length Loh to 0.4 µm without degrading the device characteristics. Reducing the n+-In0.5Ga0.5As contact length LIGA to l µm however, decreased the transconductance gm by about 20%. We found that the scaling of the conventional nonalloyed HEMT structure is limited by LIGA.

An eye-contact technique using a blazed half-transparent mirror (BHM) is developed. This half-transparent mirror (HM) consists of an in-line array of many slanting micro-HMs. We fabricated a prototype system and confirmed the principle of this technique. The resolution of an image reflected by a BHM was simulated to determine how to improve the image quality and the factors degrading the resolution were clarified.

Via electromigration (EM) performance of aluminum based metallization (AL) systems has been investigated for vias chains of 1500-4000 vias of 1.0 micron diameter. The results show that via EM lifetime can not be enhanced by a simple increase of M2 step coverage in AL/AL vias because the EM induced voids are formed at AL/AL via interface where electrons flow from Ml to M2 even in the case of very poor M2 step coverage. The voids are induced by the boundary layer in AL/AL vias, where a temperature gradient causes discontinuity of aluminum atoms flux. The failure location is not moved though via EM lifetime can be improved by controlling stress in passivation, sputter etch removal thickness and grain size of the first metal. Next, the effect of the boundary layer are eliminated by depositing titanium under the second aluminum or depositing WSi on the first aluminum. In the both cases, via EM lifetime are improved and the failure locations are changed. Especially WSi layer suppresses the voids formation rather than titanium. Models for the failure mechanism in each metallization system are further discussed.

In order to investigate the characteristics of the superconducting gap structures of BSCCO oxide superconductor, tunneling spectrum measurements were carried out with several junctions on the bulk single crystal surfaces. Point contact tunneling studies by means of the M/I/S and S/(I)/S junctions have shown the reproducible gap values, 2Δ (//c-axis) of 402 meV, at the cleaved crystal surfaces, and the ratio of 2Δ(//)/kBTc5.50.3 indicates the strong coupling superconductor of this material. Somewhat larger gap values, 2Δmax(c-axis)701 meV, have been also observed at the lateral surface, and these various gap values observed on each surface of the same crystal indicate the characteristic of the large gap anisotropy, Δ()/Δ(//)1.8, of this material.

The goal of visual telecommunication has been to create a sense of "being there" or "telepresence." This paper introduces a novel shared drawing medium called ClearBoard that goes beyond "being there" by providing virtual shared workspace. It realizes (1) a seamless integration of shared drawing space and partner's image, and (2) eye contact to support real-time and remote collaboration by two users. We devised the key metaphor: "talking through and drawing on a transparent glass window" to design ClearBoard. A prototype, ClearBoard-1 is implemented based on the "Drafter-Mirror" architecture. This paper first reviews previous work on shared drawing support to clarify our design goals. We then examine three metaphors that fulfill these goals. The design requirements and the two possible system architectures of ClearBoard are described. Finally, some findings gained through the experimental use of the prototype, including the feature of "gaze awareness," are discussed.

This paper discusses how to achieve eye contact in teleconferences attended by two or three conferees through a "Private Display Method." This method, which allows several images to be simultaneously displayed on a single screen, makes it possible to achieve eye contact. Each conferee can see a unique image, which is captured by a camera, which effectively acts as a substitute for the conferee in a counterparts room. The unique image is selected by a duoble-lenticular lens from images from two or three projectors. The effectiveness of the private display method has been demonstrated by ray-tracing simulation and by using a 50 double-lenticular screen. A prototype teleconferencing system for two persons was constructed with the 50 double-lenticular screen, a semi transparent silver coated mirror, two projectors and two cameras. Eye-contact with all counterparts can be achieved with the prototype teleconference system. The private display method is a promising way of achieving eye contact in teleconferences attended by two or three conferees.

Reactive gases such air pollution agents as H2S or SO2 usually corrode the electrical contact surfaces. Since corrosion products formed on the surface increase contact resistance, they harmfully degrades contact reliability. To prevent the corrosion of the surface, oil coating on it may be effective. The oil film acts basically as a barrier for reaction between the corrosive gas and the surface. For thin film coating, the corrosion inhibition can not be expected. However, effect of film thickness on the corrosion property has not been clarified. In the present study, in order to clarify the corrosion inhibition of the oil coating for the contacts, the stearic acid coating on Ag (silver) contact surface was studied from view-point of the relationship between the thickness of the coating film and the contact resistance. As results, the effect of the stearic acid coating on corrosion inhibition in the atmosphere contained with H2S 3 ppm was found. However, the corrosion of the surface coated with thin stearic acid film occurred at microscopically scattered thin patiches in the specific pattern of the film. Existing of the optimum thickness of the stearic acid coating which gives both minimum contact resistance and effective corrosion inhibition was found. In the intermediate film thickness, this optimum thickness was induced by the increased contact resistance due to corrosion of the thin film region and insulation property of the stearic acid in the thick film region. Moreovr,it was found that this optimum thickness was affected by corrosion time. At the early stage of corrosion, the optimum thickness was about 200 . However, the corrosion time becomes longer as 700 min, this optimum thickness changed to thick as 1000 . With this increase in the thickness, the contact resistance in the optimum thickness rised to high level. Furthermore, the contact resistance in the optimum thickness decreased with increase in the contact load. However, dependence of the contact load on the optimum thickness was not recognized under a certain corrosion time.

The erosion of contact metal, which determines the life of contacts in the telephone switching system, is proportional to the arc energy. The equations for arc voltage, arc current, arc duration time and number of arcs are expressed explicitly in terms of circuit parameters and contact properties, and the expression is derived for arc energy that accompanies a single operation of contact closure. Contact erosion is consistent with the calculated arc energy. The erosion rate at closure is estimated based on the measured contact-erosion volume and the calculated arc energy. Arc energy at contact closure becomes as large as that at contact break if the cable is long or the supply voltage is high. This expression in combination with the expression for contact break enabled us to perform contact life design, which is indispensable for maintenance administration of telephone switching systems.