Excimer laser annealing at 308nm in UV and semiconductor blue laser-diode annealing at 445nm were performed and compared in term of the crystallization depending on electrical properties of Si films. As a result for the thin Si films of 50nm thickness, both lasers are very effective to enlarge the grain size and to activate electrically the dopant atoms in the CVD Si film. Smooth Si surface can be obtained using blue-laser annealing of scanned CW mode. By improving the film quality of amorphous Si deposited by sputtering for subsequent crystallization, both laser annealing techniques are effective for LTPS applications not only on conventional glass but also on flexible sheet. By conducting the latter advanced annealing technique, small grain size as well as large grains can be controlled. As blue laser is effective to crystallize even rather thicker Si films of 1µm, high performance thin-film photo-sensor or photo-voltaic applications are also expected.

PbZr0.4Ti0.6O3 (PZT) thin films with high crystallinity and high remanant polarization (Pr) have been fabricated by sol-gel deposition with pulsed excimer (XeCl) laser annealing at low process temperatures. The amorphous PZT films were prepared on Pt/Ti/SiO2/Si substrates by a sol-gel method. The deposited amorphous PZT films were annealed at 550 for 10 min. to initiate the nucleation of the PZT perovskite phase, and then annealed with an UV pulsed excimer laser (308 nm) heating at 400. X-ray diffraction (XRD) patterns show that 150-230 mJ/cm2 range multi-shot excimer laser irradiation drastically improved the crystallinity of the PZT perovskite phase. Field emission SEM (FE SEM) image show that the PZT thin film has uniform-sized crystal grains. The ferroelectric properties were found to depend on the laser energy density and shot number.

The role of hydrogen in the Si film during excimer laser annealing (ELA) has been successfully studied by using a novel sample structure, which is stacked by a-Si film and SiN film. Hydrogen contents in the Si films during ELA are changed by preparing samples with hydrogen content of 2.3-8.2 at.% in the SiN films with a use of catalytic (Cat)-CVD method. For the low concentration of hydrogens in the Si film, the grain size increases by decreasing hydrogen concentration in the Si film, and the internal stress of the film decreases as increasing the shot number. For the high concentration of hydrogens in the Si film, hydrogen burst was observed at 500 mJ/cm2 and the dependence of the internal stress on the shot number becomes weak even at 318 mJ/cm2. These phenomena can be understood basically using the secondary grain growth mechanism, which we have proposed.

A two-dimensional laser beam profiler has been developed that can measure the intensity distribution on a sample surface of a single-shot of an excimer-laser light beam from not only the macroscopic viewpoint, but also the microscopic viewpoint, which is important to excimer-laser triggered lateral large-grain growth of Si. A resolution as fine as 0.4 µm was obtained with a field of view of as large as 30 µm 30 µm. The effects of homogenizers, phase-shifters, and their combination on beam profiles were quantitatively investigated by using this apparatus. The relationship between the microscopic beam profile and the surface morphology of laterally grown grains was also examined.

We have successfully produced laterally-grown grains on large (300 350 mm) glass substrates by means of a newly developed excimer laser crystallization system that features a high-precision mask stage and an auto-focusing system. The original grains were produced with a steep beam edge and their lateral growth was extended by repeated irradiation and translation. TFTs fabricated with these extended grains were found to have mobilities that remained almost constant at 270 cm2/Vs (n-ch. TFTs) and 230 cm2/Vs (p-ch. TFTs) over a wide range of laser fluence (400-600 mJ/cm2).

A series of transparent photochemical acid-generators (PAGs) has been successfully prepared and investigated to apply ArF excimer-laser lithography. These PAGs were synthesized as new alkylsulfonium salts that have cycloalkyl groups but no aromatic ones. They were almost transparent at 193. 4 nm and have high acid-generation efficiency enough to use for ArF excimer-laser resists. The photochemical reaction of these alkylsulfonium salts occurs mainly due to the S-C bond fission. A resist utilizing the PAGs was capable to resolve a 0. 2µm L/S pattern at a 50-mJ/cm2 dose with an aqueous alkaline developer. These PAGs are promising materials for use in ArF excimer-laser lithography.

A close correlation between the YBa2Cu3Oy film morphology and location of the (100) MgO substrate during growth by excimer laser ablation was obtained. When the susbtrate was placed inside the fringe portion of the laser plume, the spiral shape was most clearly seen on the entire film surface for both the conventional and eclipse ablation methods. When the substrate was placed outside the plume, the spiral growth was less pronounced. On the other hand, when the substrate was placed inside the plume core, marked deformation of the morphology occurred, and the superconducting critical temperature was lowered. This correlation was explained to some extent by the spatial variation of kinetic energy of the flying growth species.

New critical-dimension controlling technique of off-axis illumination for aperiodic patterns has been developed. By means of arranging not-imaging additional pattern near 0.25 micron isolated patterns, the depth of focus of an isolated pattern was improved as well as the periodic patterns. Simulation and experimental results were verified on a 0.48 numerical-aperture, KrF excimer laser stepper. Using new deep-ultra-violet hardening technique for chemically amplified positive resist, the critical dimension loss of resist pattern was prevented. 0.25 micron design rule pattern was obtained with excellent mask linearity without critical-dimension-loss. The combination techniques are achieved quarter micron design rule complex circuit pattern layouts.

256 MbDRAM chips have been fabricated by mix-and-match method using high NA KrF excimer laser stepper and i-line stepper. In the case of KrF stepper, the negative siloxane resist is used for rectangular and wiring patterns and the positive novolak-resin resist is used for hole patterns. Both of these two kinds of resist produce accurate pattern shape, allow-able pattern profile, satisfactory depth of focus and sufficient overlay accuracy for device fabrication in 0.25 µm design rule.

This paper describes the potential of KrF excimer laser lithography for the development and production of 64 M and 256 Mbit DRAMs on the basis of our recent developed results. Quarter micron KrF excimer laser lithography has been developed. A new chemically amplified positive resist realizes high stability and process compatibility for 0.25 micron line and space patterns and 0.35 micron contact hole patterns. This developed resist is characterized as the increase of dissolution characteristics in exposed areas, and hence means the high resolution is obtained. A multiple interference effect was greatly reduced by using our over coat film or anti-reflective coating. This over coat film has no intermixing to the resist and it is simultaneously removed when the resist is developed. This anti-reflective coating has low etch selectivity to the resist, and hence the over coat film is etched away when etching the substrate. The two major results indicate that the KrF excimer laser lithography is promising for the development of 256 MDRAMs.

Reduction in the illumination wavelength for exposure leads to higher resolution while keeping the depth of focus. Thus, KrF excimer laser lithography has been positioned as the next generation lithography tool behind g/i-line optical lithography, and many studies have been investigated. In the early days, the excimer laser lithography had many inherent problems, such as inadequate reliability, difficult maintainability, high operating cost, and low resolution and sensitivity of resist materials. However, the performance of the excimer laser stepper has been improved and chemical amplification resists have been developed for the past decade. At present, KrF excimer lithography has reached the level of trial manufacturing of lower submicron ULSI devices beyond 64 Mbit DRAMs.

Recent progress on photoexcited process applications to fabricating of VLSI and flat panel devices in Japan has been reviewed. The excimer laser melt technique makes it possible to form large-grain poly-Si film on a glass substrate, improving TFT electrical characteristics, and to fill metals into high-aspect-ratio contact holes in VLSI metallization. Scanning of CW laser in poly-Si film led to growth of a single-crystal Si layer on SiO2 to fabricate 3-D (dimensional) devices successfully. Direct writing with pyrolytic reaction was put into practice for interconnection restructuring. In the photochemical process, lower temperature epitaxial growth of Si and dry cleaning of a Si wafer employing Hg lamp irradiation were noted. Directional etching was performed by sidewall film formation, while resolution of better than 0.5 µm was difficult to obtain due to diffraction limit. It was proposed that higher resolution would be obtained by introduction of a nonlinear process which enhanced pattern contrast.